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Deppisch
Berthold Deppisch, Riedenheim DE
| Patent application number | Description | Published |
|---|---|---|
| 20090270548 | AQUEOUS COATING MATERIAL, ITS PREPARATION AND USE - Disclosed herein is an aqueous coating material comprising (A) at least one polyurethane which is ionically stabilized, nonionically stabilized, or a combination thereof, and which is saturated, unsaturated, grafted with olefinically unsaturated compounds, or a combination thereof, (B) at least one wetting agent or dispersant; and (C) at least one organic solvent selected from the group consisting of dimethyl sulfoxide, sulfolane, 2-methyl-1-butanol, 3-methyl-1-butanol, 2-methyl-1-pentanol, hexyl glycol, 1,6-hexanediol, diethylene glycol, triethylene glycol, glycerol, solutions of trimethylolpropane, solutions of pentaerythritol, solutions of sorbitol, reactive polyether polyols with a number-average molecular weight of 110 to 6000 daltons and a hydroxyl number of 25 to 1000 mg KOH/g, propylene glycol monobutyl ether, dipropylene glycol dimethyl ether, glycerol ethoxylate, ethyl 3-ethoxypropionate, gamma-butyrolactone, N-(2-hydroxyethyl)piperidine, N-methylmorpholine, N-(2-hydroxyethyl)morpholine, N-acetylmorpholine, N-cyclohexylpyrrolidone, N-octyl-2-pyrrolidone, and a combination thereof. Also disclosed is a process for preparing the foregoing aqueous coating material. | 10-29-2009 |
Carl Deppisch, Chandler, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20080239660 | Flux precoated solder preform for thermal interface material - In one embodiment, an apparatus comprises a semiconductor device, a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises a pre-coated flux material. | 10-02-2008 |
| 20090001557 | Forming a semiconductor package including a thermal interface material - In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed. | 01-01-2009 |
| 20100065246 | Methods of fabricating robust integrated heat spreader designs and structures formed thereby - Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications. | 03-18-2010 |
| 20100259890 | COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE - A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation. | 10-14-2010 |
Carl L. Deppisch, Chandler, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090093072 | ELECTRONIC ASSEMBLIES WITH HOT SPOT COOLING AND METHODS RELATING THERETO - A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described. | 04-09-2009 |
| 20110147914 | Clad Solder Thermal Interface Material - A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace. | 06-23-2011 |
| 20110159310 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby - Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material. | 06-30-2011 |
Carl L. Deppisch, Phoenix, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20080293188 | Reactive solder material - Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device. | 11-27-2008 |
Carl Ludwig Deppisch, Chandler, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20110147438 | CLAD SOLDER THERMAL INTERFACE MATERIAL - A clad solder thermal interface material is described. In one example the material has a first layer of solder, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature lower than the melting temperature of the first layer, and a third layer of solder clad to the first layer of solder opposite the second layer, the third layer having a melting temperature lower than the melting temperature of the first layer. | 06-23-2011 |