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Dennard, US

Mark D. Dennard, Decatur, GA US

Patent application numberDescriptionPublished
20080245862SYSTEM AND METHOD FOR INTERACTIVE MARKETING TO CONSUMERS - A system and method for interactive marketing to consumers and, more particularly, to a system and method for marketing merchandise to consumers in an interactive retail environment. The method includes detecting a disturbance in an area and sending information related to the disturbance to a back end merchandising system. The method further includes retrieving relevant information related to the detected disturbance from the back end merchandising system and displaying the relevant information on a display surface.10-09-2008
20090058647SYSTEM AND METHOD FOR RFID DYNAMIC CONTENT PRESENTATION - A system and method for providing RFID dynamic content presentation using wireless devices and RFID technologies. The method comprises providing a wireless capable device which is configured to receive RFID information and store the RFID information in storage for later retrieval. The system is an infrastructure which comprises at least one RFID tag which stores RFID information; and a wireless capable device which is configured to receive the RFID information and store the RFID information in storage for later retrieval.03-05-2009
20090063705SYSTEM AND METHOD OF SENDING COMPRESSED HTML MESSAGES OVER TELEPHONY PROTOCOL - A system and method for sending compressed html messages and, more particularly, a system and method for sending compressed html messages over a telephony protocol. the method comprises compressing an html message and sending the compressed html message via a telephony protocol. The compressed html message is sent as an SMS message and the telephony protocol is SS7 protocol, bypassing TCP/IP. The compressed html message can be coded with a return number, forcing a return message to be sent via a text message over SS7 protocol. The system and method includes a computer infrastructure operable to compress an html message and send the compressed html message such as and SMS message via a telephony protocol. A computer program product comprising a computer usable medium having readable program code embodied in the medium for performing the processes is also contemplated.03-05-2009
20100075610SYSTEM AND METHOD FOR REDUCING LATENCY OF LOCATION BASED INFORMATION RETRIEVED FROM A LOCATION SERVICE - A system and method is provided for reducing latency when providing user location information services. The system is implemented in a computer infrastructure which comprises computer executable code tangibly embodied on a computer readable medium. The executable code is operable to trigger a location based service to obtain user location information prior to the user registering for location services.03-25-2010
20110131078SYSTEM AND METHOD TO MODEL AND FORECAST TECHNOLOGY ADOPTION - A method is implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions. The programming instructions are operable to at least one of receive and assess current technology adoption trends. Additionally, the programming instructions are operable to provide a technology adoption forecast.06-02-2011
20120223815SYSTEM AND METHOD FOR RFID DYNAMIC CONTENT PRESENTATION - A system and method for providing RFID dynamic content presentation using wireless devices and RFID technologies. The method comprises providing a wireless capable device which is configured to receive RFID information and store the RFID information in storage for later retrieval. The system is an infrastructure which comprises at least one RFID tag which stores RFID information; and a wireless capable device which is configured to receive the RFID information and store the RFID information in storage for later retrieval.09-06-2012

Patent applications by Mark D. Dennard, Decatur, GA US

Mark D. Dennard, Kennesaw, GA US

Patent application numberDescriptionPublished
20090202115MINUTIAE MASK - A system and method of authenticating fingerprints. A method of authenticating a fingerprint includes comparing a geometric shape of a scanned fingerprint to a corresponding geometric shape of a stored fingerprint. The geometric shape and the corresponding geometric shape are defined by vertices. The vertices are defined by minutiae points, while the vertices are spaced apart from the minutiae points.08-13-2009

Mark D. Dennard, Decalur, GA US

Patent application numberDescriptionPublished
20090061909SYSTEM AND METHOD OF CREATING AND PROVIDING SMS HTTP TAGGING - A system and method for sending text messages and, more particularly, a system and method for forcing SMS capable devices to communicate via SMS using, for example, SS7 protocol. A method comprises providing a tag forcing a return text message to be sent via SS7 protocol. In use, the system and method is configured to force the use of SMS messages via the SS7 protocol. The system and method can be implemented over any network, for example, and any existing mobile device and related infrastructure can be modified to take advantage of the benefits and functionality of the system and method of the invention.03-05-2009

Robert H. Dennard, Yorktown Heights, NY US

Patent application numberDescriptionPublished
20110073961SELF-ALIGNED WELL IMPLANT FOR IMPROVING SHORT CHANNEL EFFECTS CONTROL, PARASITIC CAPACITANCE, AND JUNCTION LEAKAGE - A method of forming a self-aligned well implant for a transistor includes forming a patterned gate structure over a substrate, including a gate conductor, a gate dielectric layer and sidewall spacers, the substrate including an undoped semiconductor layer beneath the gate dielectric layer and a doped semiconductor layer beneath the undoped semiconductor layer; removing portions of the undoped semiconductor layer and the doped semiconductor layer left unprotected by the patterned gate structure, wherein a remaining portion of the undoped semiconductor layer beneath the patterned gate structure defines a transistor channel and a remaining portion of the doped semiconductor layer beneath the patterned gate structure defines the self-aligned well implant; and growing a new semiconductor layer at locations corresponding to the removed portions of the undoped semiconductor layer and the doped semiconductor layer, the new semiconductor layer corresponding to source and drain regions of the transistor.03-31-2011
20110108943HYBRID DOUBLE BOX BACK GATE SILICON-ON-INSULATOR WAFERS WITH ENHANCED MOBILITY CHANNELS - A semiconductor wafer structure for integrated circuit devices includes a bulk substrate; a lower insulating layer formed on the bulk substrate; an electrically conductive back gate layer formed on the lower insulating layer; an upper insulating layer formed on the back gate layer; and a hybrid semiconductor-on-insulator layer formed on the upper insulating layer, the hybrid semiconductor-on-insulator layer comprising a first portion having a first crystal orientation and a second portion having a second crystal orientation.05-12-2011
20110115021ISOLATION STRUCTURES FOR SOI DEVICES WITH ULTRATHIN SOI AND ULTRATHIN BOX - Shallow trenches are formed around a vertical stack of a buried insulator portion and a top semiconductor portion. A dielectric material layer is deposited directly on sidewalls of the top semiconductor portion. Shallow trench isolation structures are formed by filling the shallow trenches with a dielectric material such as silicon oxide. After planarization, the top semiconductor portion is laterally contacted and surrounded by the dielectric material layer. The dielectric material layer prevents exposure of the handle substrate underneath the buried insulator portion during wet etches, thereby ensuring electrical isolation between the handle substrate and gate electrodes subsequently formed on the top semiconductor portion.05-19-2011
20110115553SOI CMOS STRUCTURE HAVING PROGRAMMABLE FLOATING BACKPLATE - SOI CMOS structures having at least one programmable electrically floating backplate are provided. Each electrically floating backplate is individually programmable. Programming can be performed by injecting electrons into each conductive floating backplate. Erasure of the programming can be accomplished by tunneling the electrons out of the floating backplate. At least one of two means can accomplish programming of the electrically floating backgate. The two means include Fowler-Nordheim tunneling, and hot electron injection using an SOI pFET. Hot electron injection using pFET can be done at much lower voltage than injection by tunneling electron injection.05-19-2011
20110121811POWER DELIVERY IN A HETEROGENEOUS 3-D STACKED APPARATUS - A heterogeneous three-dimensional (3-D) stacked apparatus is provided that includes multiple layers arranged in a stacked configuration with a lower layer configured to receive a board-level voltage and one or more upper layers stacked above the lower layer. The heterogeneous 3-D stacked apparatus also includes multiple tiles per layer, where each tile is designed to receive a separately regulated voltage. The heterogeneous 3-D stacked apparatus additionally includes at least one layer in the one or more upper layers with voltage converters providing the separately regulated voltage converted from the board-level voltage.05-26-2011
20120168864SELF-ALIGNED WELL IMPLANT FOR IMPROVING SHORT CHANNEL EFFECTS CONTROL, PARASITIC CAPACITANCE, AND JUNCTION LEAKAGE - A transistor device includes a patterned gate structure formed over a substrate, the patterned gate structure including a gate conductor, a gate dielectric layer and sidewall spacers; and a doped well implant formed in the substrate, the well implant being self-aligned with the patterned gate structure.07-05-2012
20120284541POWER DELIVERY IN A HETEROGENEOUS 3-D STACKED APPARATUS - A heterogeneous three-dimensional (3-D) stacked apparatus is provided that includes multiple layers arranged in a stacked configuration with a lower layer configured to receive a board-level voltage and one or more upper layers stacked above the lower layer. The heterogeneous 3-D stacked apparatus also includes multiple tiles per layer, where each tile is designed to receive a separately regulated voltage. The heterogeneous 3-D stacked apparatus additionally includes at least one layer in the one or more upper layers with voltage converters providing the separately regulated voltage converted from the board-level voltage.11-08-2012

Robert H. Dennard, Cronton-On-Hudson, NY US

Patent application numberDescriptionPublished
20120299080STRUCTURE FOR CMOS ETSOI WITH MULTIPLE THRESHOLD VOLTAGES AND ACTIVE WELL BIAS CAPABILITY - A structure includes a semiconductor substrate having a first type of conductivity and a top surface; an insulating layer disposed over the top surface; a semiconductor layer disposed over the insulating layer and a plurality of transistor devices disposed upon the semiconductor layer. Each transistor device includes a source, a drain and a gate stack defining a channel between the source and the drain, where some transistor devices have a first type of channel conductivity and the remaining transistor devices have a second type of channel conductivity. The structure further includes a well region formed adjacent to the top surface of the substrate and underlying the plurality of transistor devices, the well region having a second type of conductivity and extending to a first depth within the substrate. The structure further includes first isolation regions between adjacent transistor devices and extending through the semiconductor layer to a depth sufficient for electrically isolating the adjacent transistor devices from one another, and second isolation regions between selected adjacent transistor devices. The second isolation regions extend through the silicon layer, through the insulating layer and into the substrate to a second depth that is greater than the first depth to electrically separate the well region into a first well region and a second well region. The structure further includes at least one back gate region disposed wholly within a well region and underlying one of the plurality of transistor devices, the at least one back gate region has the first type of conductivity and is electrically floating within the well region, where during operation the at least one back gate region having the first type of conductivity is biased by leakage and capacitive coupling by a bias potential applied to the well region within which it is disposed.11-29-2012

Robert Heath Dennard, Croton-On-Hudson, NY US

Patent application numberDescriptionPublished
20090046503Enhanced Gated Diode Memory Cells - A memory cell for use in an integrated circuit comprises a read transistor and a gated diode. The read transistor has a source terminal. The gated diode has a gate terminal in signal communication with the read transistor. A variable source voltage acts on the source terminal of the read transistor when the memory cell is in operation. The variable source voltage is temporarily altered when the memory cell is read. For example, the source voltage may be reduced when the read transistor is implemented using an N-type transistor and increased when the read transistor is implemented using P-type transistor. This acts to impart the memory cell with faster read speed, higher read margin, and lower standby current.02-19-2009
20090103382Gated Diode Sense Amplifiers - A sense amplifier for use in sensing a signal in an integrated circuit comprises an amplifier portion and an output portion. The amplifier portion comprises a gated diode having a gate terminal. The output portion comprises an output transistor in signal communication with the gate terminal of the gated diode and having a source terminal. A variable source voltage acts on the source terminal of the output transistor when the sense amplifier is in operation. The variable source voltage is temporarily altered when the sense amplifier is actively sensing the signal in the integrated circuit.04-23-2009
20120241902SELF-ALIGNED DUAL DEPTH ISOLATION AND METHOD OF FABRICATION - FDSOI devices and methods for the fabrication thereof are provided. In one aspect, a method for fabricating a device includes the following steps. A wafer is provided having a substrate, a BOX and a SOI layer. A hardmask layer is deposited over the SOI layer. A photoresist layer is deposited over the hardmask layer and patterned into groups of segments. A tilted implant is performed to damage all but those portions of the hardmask layer covered or shadowed by the segments. Portions of the hardmask layer damaged by the implant are removed. A first etch is performed through the hardmask layer to form a deep trench in the SOI layer, the BOX and at least a portion of the substrate. The hardmask layer is patterned using the patterned photoresist layer. A second etch is performed through the hardmask layer to form shallow trenches in the SOI layer.09-27-2012