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Demuynck

David A. Demuynck, Underhill, VT US

Patent application numberDescriptionPublished
20120086101INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME - The disclosure relates generally to integrated circuits (IC), IC interconnects, and methods of fabricating the same, and more particularly, high performance inductors. The IC includes at least one trench within a dielectric layer disposed on a substrate. The trench is conformally coated with a liner and seed layer, and includes an interconnect within. The interconnect includes a hard mask on the sidewalls of the interconnect.04-12-2012

Isabelle Demuynck, Orleans FR

Patent application numberDescriptionPublished
20080312314Alpha crystalline form of strontium ranelate - Alpha crystalline form of strontium ranelate of formula (I):12-18-2008

Maartkin Demuynck, Nevele BE

Patent application numberDescriptionPublished
20100163553MICROWAVE STEAM COOKING CONTAINER SYSTEM - A microwave steam cooking container system for cooking foodstuff, comprising a water reservoir, a food container comprising a plurality of apertures on a bottom thereof, an outer wall portion and an inner wall portion, and a microwave shielding material encapsulated between said inner and outer wall portions, a cover comprising an inner wall portion and an outer wall portion, and a microwave shielding material encapsulated between said cover inner and said cover outer wall portions, wherein said food container is stacked and removably placed within said water reservoir, wherein in the assembled position the foodstuff to be cooked is shielded from cooking by direct exposure to microwave energy.07-01-2010

Marc Demuynck, Wondelgem BE

Patent application numberDescriptionPublished
20110212187ANTIMICROBIAL COMPOSITION - The invention relates to new antimicrobial compositions comprising a combination of—at least one organic and/or inorganic peroxide, —at least one silver source, and —at least one nitrogen containing compound which is a non glucogenic compatible solute, selected from taurine, choline and choline derivatives, trimethylamine-oxide (TMAO), ectoine and hydroxyectoine, the N-methylated aminoacids glycine betaine, dimethylglycine, sarcosine, carnitine, N-methyl alanine, trimethylamino-butyric acid, butyrobetaine and proline betaine, and the poly amino hydrocarbon compounds putrescine, cadaverine, spermine and spermidine.09-01-2011

Steven Demuynck, Aarschot BE

Patent application numberDescriptionPublished
20100207177METHOD FOR PRODUCING A COPPER CONTACT - A method for producing a contact through the pre-metal dielectric (PMD) layer of an integrated circuit, between the front end of line and the back end of line, and the device produced thereby are disclosed. The PMD layer includes oxygen. In one aspect, the method includes producing a hole in the PMD, depositing a conductive barrier layer at the bottom of the hole, depositing a CuMn alloy on the bottom and side walls of the hole, filling the remaining portion of the hole with Cu. The method further includes performing an anneal process to form a barrier on the side walls of the hole, wherein the barrier has an oxide including Mn. The method further includes performing a CMP process.08-19-2010