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Demuro

Carlo Demuro, Bresso (mi) IT

Patent application numberDescriptionPublished
20100244181Filling Gaps in Integrated Circuit Fabrication - A gap may be filled using deposition and sputtering by forming a liner and a gap fill material in the same deposition chamber in some embodiments. The liner may be made harder than the gap fill so that the liner protects the underlying substrate when sputtering is used during the gap fill.09-30-2010

Paul Demuro, Tulsa, OK US

Patent application numberDescriptionPublished
20100106114DRESSING - A dressing (04-29-2010

Tim Demuro, San Antonio, TX US

Patent application numberDescriptionPublished
20100106114DRESSING - A dressing (04-29-2010