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Dellmann

Laurent Dellmann, Adliswil CH

Patent application numberDescriptionPublished
20090188108METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE - Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.07-30-2009
20090245721THREE-DIMENSIONAL STACKED OPTICAL DEVICE - A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device.10-01-2009
20090245722THREE-DIMENSIONAL STACKED OPTICAL DEVICE - A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.10-01-2009

Laurent Dellmann, Ruschlikon CH

Patent application numberDescriptionPublished
20110134614DEMOUNTABLE DRY CONNECTION FOR FLEXIBLE CIRCUITS TO CIRCUIT BOARDS - Substrates are connected by demountable coupling by connecting an electronic module to a substrate. An electronic module and a substrate carrying electrical and/or optical circuits are provided. A connector electrical circuit is connected between the substrate and the electronic module. The connector electrical circuit is electrically demountable dry connected to the electronic module.06-09-2011

Laurent A. Dellmann, Adliswil CH

Patent application numberDescriptionPublished
20080247706OPTO-ELECTRONIC BOARD - An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.10-09-2008
20090279201JOINT SPECIFICATION OF SERVO FORMAT AND SERVO READER PARAMETERS FOR TAPE DRIVE SYSTEMS - A servo pattern, including stripes arranged in servo bursts for use in position error signal (PES) generation, is provided in which a stripe width is narrower than 1.7 μm and in which the stripes are oriented at an azimuth angle which in absolute value is equal to or larger than 6 degrees.11-12-2009

Patent applications by Laurent A. Dellmann, Adliswil CH

Laurent A. Dellmann, Birmensdorf CH

Patent application numberDescriptionPublished
20090133914METHOD FOR PRODUCING AN INTEGRATED DEVICE AND A DEVICE PRODUCED THEREBY - A method for producing an integrated device. A source substrate is provided, the source substrate carrying one or more components to be attached to a receiver surface having a uneven topography. The source substrate includes a deformable layer on a surface on which the one or more components are carried. The source substrate is aligned such that said one or more components carried thereon are associated with contact areas of the receiver surface. The source substrate and the receiver surface are moved towards each other such that the one or more components are brought into contact with the contact areas wherein the deformable layer is at least partially deformed. The source substrate is removed such that the one or more of the components remain located on the contact areas of the receiver surface.05-28-2009

Torsten Dellmann, Koln DE

Patent application numberDescriptionPublished
20090074556Method and Device for the Transport of Goods by Rail - In one embodiment of the present invention, a method and device are disclosed for the transport of goods by rail, wherein goods wagons are used with independent propulsion means. The propulsion means for the goods wagons are used only for short journeys from a station to a customer and back. For long journeys the goods wagons are assembled into a train and pulled by a tractor vehicle.03-19-2009