Patent application number | Description | Published |
20150293146 | LAMINATE STRUCTURE AND CLAMPING MECHANISM FOR FAULTED CIRCUIT INDICATOR - A faulted circuit indicator (FCI) device for installation on a power line includes a housing, a laminate structure fastened to the housing and configured to receive the power line, and a clamp mechanism pivotally fastened to the housing and configured to secure the housing to the power line. The clamp mechanism includes a pair of opposing clamp arms each having a curved configuration. The curved configuration of the clamp arms maintains the power line in a centered relationship within the laminate structure when the clamp arms are engaged on the power line over a range of power line diameters. | 10-15-2015 |
20150295453 | POWER SUPPLY FOR FAULTED CIRCUIT INDICATOR - A faulted circuit indicator includes a microprocessor or discrete logic to determine a fault condition and initiate one or more fault indications, a super capacitor, a battery, and power supply circuitry for providing power to the microprocessor and one or more fault indicators. The power supply circuitry: inductively receives energy from a power line; determines whether an induced voltage is sufficient to power one or more functions of the FCI device; and if not, determines whether available voltage from the super capacitor is sufficient to power the one or more functions of the FCI device. If so, the power supply circuitry draws voltage from the super capacitor and, if not, the power supply circuitry draws voltage from the battery when it is determined that the available voltage from the super capacitor is not sufficient to power the one or more functions of the FCI device. | 10-15-2015 |
20150295705 | WIRELESS TRANSMISSION SYNCHRONIZATION USING A POWER LINE SIGNAL - A gateway may be configured to synchronize transmissions of a plurality of faulted circuit indicators (FCIs). The gateway may determine a time delay from a zero crossing of a power line signal and obtain network information from the at least one FCI from the plurality of FCIs. The gateway may identify a proximate FCI that is closest to a gateway based on at least one link parameter, and assign the determined time delay to the proximate FCI. The gateway may receive confirmations that at least one FCI received the determined time delay, and has synchronized transmissions based on the determined time delay and the zero crossings of the power signal. | 10-15-2015 |
Patent application number | Description | Published |
20080211353 | HIGH TEMPERATURE BIMORPH ACTUATOR - A bimorph actuator has been found that uses commonly available piezoelectric material and is operational up to about 150° C. or one half of Curie temperature, in that it does not exhibit depolarization due to negative electric fields and/or elevated temperature. This result is accomplished by driving both piezoelectric materials with a positive electric field along the polarization direction. | 09-04-2008 |
20080238520 | POWER ELECTRONIC MODULE INCLUDING DESATURATION DETECTION DIODE - A power electronic module includes: a switch module including a desaturation detection diode and a power semiconductor switch, and wherein the desaturation detection diode is coupled to a switching connection of the power semiconductor switch; and a driver module coupled to the switch module, wherein the driver module is configured for obtaining a voltage signal across the desaturation detection diode and the power semiconductor switch and configured for turning off the power semiconductor switch upon the voltage signal exceeding a threshold. In one example, the driver module is discrete from the switch module. In another example, the switch module and driver modules are configured to respectively provide and receive a voltage signal of less than or equal to seventy volts. | 10-02-2008 |
20080308141 | PHOTOVOLTAIC POWER CONVERTER SYSTEM WITH A CONTROLLER CONFIGURED TO ACTIVELY COMPENSATE LOAD HARMONICS - Photovoltaic power converter system including a controller configured to reduce load harmonics is provided. The system comprises a photovoltaic array and an inverter electrically coupled to the array to generate an output current for energizing a load connected to the inverter and to a mains grid supply voltage. The system further comprises a controller including a first circuit coupled to receive a load current to measure a harmonic current in the load current. The controller includes a second circuit to generate a fundamental reference drawn by the load. The controller further includes a third circuit for combining the measured harmonic current and the fundamental reference to generate a command output signal for generating the output current for energizing the load connected to the inverter. The photovoltaic system may be configured to compensate harmonic currents that may be drawn by the load. | 12-18-2008 |
20090154056 | Low inductance capacitor and method of manufacturing same - A film capacitor includes metallization that is sectionalized, patterned and configured to provide interconnections on only one face of a rolled or stacked film capacitor. | 06-18-2009 |
20110101515 | POWER MODULE ASSEMBLY WITH REDUCED INDUCTANCE - A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal can also be electrically coupled to the first conductive substrate, while a negative terminal can be electrically coupled to the second power semiconductor component, and an output terminal may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness. | 05-05-2011 |
20110300725 | Busbar Electrical Power Connector - A dual pole busbar power connector including opposing elements configured to form a slot configured to receive a dual-pole blade therebetween. The slot extends from busbars to opposing element distal ends. The opposing elements each includes: a first contact extending into the slot from the opposing element; and a second contact extending into the slot from the opposing element and disposed farther from a slot busbar end than the first contact. When the dual-pole blade is inserted in the slot the first contact contacts a respective blade element at a location in the slot more proximate the slot busbar end than a slot distal end. | 12-08-2011 |
20120009733 | POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD - A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor. | 01-12-2012 |
20120242453 | ENERGY MANAGEMENT IN RFID SYSTEMS WITH LONG TERM ACTIVE SENSING - The inventive RFID Environmental Monitoring System (RFID_EMS) includes an RFID-based Environmental Monitor and Energy Management Logic for reducing energy consumption in active RFID tags used for long-term active sensing of storage and transit conditions of shipping containers. The RFID-based Environmental Monitor consists of an active RFID tag containing an RF transponder, microcontroller, sensors and associated interface circuitry. The Energy Management Logic provides hardware and software which work together, and consists of executable software or microcontroller logic that monitors and regulates energy use by an RFID tag and associated sensors, and may control the state of specialized peripheral circuits on the tag. By reading the RFID_EMS tag, the invention enables the determination of the condition of precision equipment prior to use, including equipment that requires high readiness after long periods of transit and/or storage. | 09-27-2012 |
20130029531 | FLEXIBLE POWER CONNECTOR - A flexible power connector is presented. An embodiment of a flexible power connector includes a stacked structure having one or more insulating strips alternatingly arranged with a plurality of conducting strips, wherein the one or more insulating strips are interposed between the plurality of conducting strips to insulate each conducting strip from the other conducting strip in the stacked structure, and wherein the plurality of conducting strips is disposed parallel and proximate to each other to reduce electrical losses in the stacked structure | 01-31-2013 |
20130075878 | COAXIAL POWER MODULE - A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure. | 03-28-2013 |
20140133104 | LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB - A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s). | 05-15-2014 |
20140167248 | POWER MODULE PACKAGE - An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir. | 06-19-2014 |
20150024553 | POWER MODULE PACKAGE - An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir. | 01-22-2015 |
20150131328 | SYSTEM AND METHOD FOR POWER CONVERSION - A power conversion system is presented. The system includes a power source coupled to a power converter and a controller. The controller is configured to determine a value of at least one parameter corresponding to the power source. Additionally, the controller is configured to provide a first portion of the at least one parameter to the power converter and modify an operating frequency of the power converter, duty ratio of the power converter, or a combination thereof. Furthermore, the controller is configured to obtain an electrical quantity at an output of the power converter based on the modified operating frequency, the modified duty ratio, or a combination thereof. Also, the controller is configured to deliver a combination of the electrical quantity obtained at the output of the power converter and a second portion of the at least one parameter to a load. Method for converting power is also presented. | 05-14-2015 |