Deleon
Antonio Morreale Deleon, Cantoblanco ES
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20130237529 | COMPOUND THAT CAN INHIBIT UBC13-UEV INTERACTIONS, PHARMACEUTICAL COMPOSITIONS AND THERAPEUTIC USES - The invention relates to a compound (I) wherein R is a heterocyclyl radical; R | 09-12-2013 |
Briccio Deleon, San Pablo PH
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20120160294 | Method for Connecting Solar Cells - A method of connecting two solar cells is disclosed. In one embodiment, the method comprises gripping an interconnect with a head of positioning device, heating the interconnect with the head of the positioning device to between two predetermined temperatures, where one is higher than the other, positioning the interconnect so as to overlay two adjacent solar cells, coupling the interconnect to each of the two adjacent solar cells, and releasing the interconnect from the head. | 06-28-2012 |
Conrado Deleon, Lipa PH
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20140266564 | LAMINATED ELECTRICAL FUSE - A compact, high breaking capacity fuse that includes a top insulative layer, at least one intermediate insulative layer, and a bottom insulative layer arranged in a vertically stacked configuration. The at least one intermediate layer may have a hole formed therethrough that defines an air gap within the fuse. A first conductive terminal may be formed on a first end of the fuse and a second conductive terminal may be formed on a second end of the fuse. At least one fusible element may connect the first terminal to the second terminal, thus providing an electrically conductive pathway therebetween. A portion of the at least one fusible element may pass through the air gap defined by the hole in the at least one intermediate insulative layer. | 09-18-2014 |
Craig Deleon, South Australia AU
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20080265127 | Concrete Sideform System - This invention concerns a concrete side form system suitable for factory casting or site casting concrete. The side form ( | 10-30-2008 |
Craig Deleon, Blackwood AU
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20080217825 | Magnetic Clamp - A magnetic clamp ( | 09-11-2008 |
20090295055 | ADAPTER FOR A MAGNETIC CLAMP - An adapter ( | 12-03-2009 |
20120193510 | Concrete Sideform System - A concrete side form system suitable for factory casting or site casting concrete. The side form includes a substantially rigid longitudinally extending wall. The wall has a first face to define the edge profile of a concrete panel poured onto a casting bed bounded by the wall and a second face opposite the first face having formation to enable the wall to be secured to the casting bed. The wall includes a longitudinally extending frame having formation along at least one of its edges to removably receive a removable longitudinal insert to provide a shape along an edge of the concrete panel. The removable inserts provide the system with the ability to simply, easily and cost effectively change the edge profile of concrete poured against the side form. | 08-02-2012 |
Craig Deleon, Kent Town AU
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20100155571 | A Sideform End Seal or Cap - A sideform moulding accessory ( | 06-24-2010 |
Israel Deleon, Ottawa CA
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20120250720 | AMPLIFICATION OF LONG-RANGE SURFACE PLASMONS WITH REDUCED NOISE - An optical amplifier suitable for coherently amplifying surface plasmon-polariton waves with high gain and low noise over visible and infrared wavelengths. The optical amplifier is comprised of a thin strip of material having a complex permittivity with a negative real part, in contact on at least one side with an optical gain medium, where the strip has finite width and thickness such that optical radiation couples to the strip and propagates along its length as a surface plasmon-polariton wave. The surface plasmon-polariton amplifier can also be incorporated into a resonant cavity to form a plasmon-polariton laser. | 10-04-2012 |
Jerry Deleon, Calamba City PH
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20120213239 | SEMICONDUCTOR LASER CHIP PACKAGE WITH ENCAPSULATED RECESS MOLDED ON SUBSTRATE AND METHOD FOR FORMING SAME - A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric layers, a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate. An encapsulation covers the laser chip, the wire bond, and at least a portion of the top surface of the substrate including the recess region. The encapsulation is an optically transparent molding compound. The package is arranged to be mounted as a side-looker and/or a top-looker. | 08-23-2012 |
20140008778 | PHOTONIC SEMICONDUCTOR DEVICES IN LLC ASSEMBLY WITH CONTROLLED MOLDING BOUNDARY AND METHOD FOR FORMING SAME - Embodiments of a laminate leadless carrier package are presented. The package includes an optoelectronic chip, a substrate supporting the optoelectronic chip, a plurality of conductive slotted vias, a wire bond pad disposed on the top surface of the substrate, a wire bond coupled to the optoelectronic chip and the wire bond pad and an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate. The slotted vias provide electrical connections between the top conductive layer and the bottom conductive layer. The substrate includes a plurality of conductive and dielectric layers laminated together including a bottom conductive layer, a top conductive layer, and a dielectric layer between the top and bottom conductive layers. The encapsulation is a molding compound, and the molding compound is pulled back from at least one of the slotted vias. | 01-09-2014 |
Jerry Deleon, San Fernando PH
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20110079801 | OPTOELECTRONIC DEVICES WITH LAMINATE LEADLESS CARRIER PACKAGING IN SIDE-LOOKER OR TOP-LOOKER DEVICE ORIENTATION - A laminate leadless carrier package comprising an optoelectronic chip, a substrate supporting the chip, the substrate comprising a plurality of conductive and dielectric layers; a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate; an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound; and wherein the package is arranged to be mounted as a side-looker. A process for manufacturing laminate leadless carrier packages, comprising preparing a substrate; applying epoxy adhesive to a die attach pad; mounting an optoelectronic chip on the die attach pad; wire-bonding the optoelectronic chip; molding a molding compound to form an encapsulation covering the optoelectronic chip, a wire bond, and the top surface of the substrate; and dicing the substrate into individual packages. | 04-07-2011 |