| Patent application number | Description | Published |
|---|
| 20080205980 | SYSTEM FOR RELEASABLY ATTACHING A DISPOSABLE DEVICE TO A DURABLE DEVICE - A system for releasably attaching a steerable disposable multi-linked device to a durable device may include a disposable portion and a durable portion. The disposable portion may include a connecting member connected to the disposable portion and the durable portion and a steerable multi-linked device. The steerable multi-linked device may include a first link, a plurality of intermediate links, a second link movably coupled to a second one of the intermediate links, and a cable which passes through the first link and intermediate links and extends beyond a first end of the first link. A first one of the intermediate links may be movably coupled to the first link. The durable portion may include an axial member which defines an opening therethrough and a feeder mechanism. | 08-28-2008 |
| 20100294071 | STEERABLE MULTI-LINKED DEVICE HAVING A MODULAR LINK ASSEMBLY - A steerable multi-linked device. The device includes a first multi-linked mechanism and a second multi-linked mechanism. At least one of the first and second multi-linked mechanisms is steerable and includes a modular link assembly at an end thereof. The modular link assembly includes a base, and a tip removably connected to the base. | 11-25-2010 |
| 20110056320 | STEERABLE MULTI-LINKED DEVICE HAVING A MODULAR LINK ASSEMBLY - A steerable multi-linked device. The device includes a first multi-linked mechanism and a second multi-linked mechanism. At least one of the first and second multi-linked mechanisms is steerable and includes a modular link assembly at an end thereof. The modular link assembly includes a base, and a tip removably connected to the base. | 03-10-2011 |
| 20110152613 | ARTICULATED DEVICE WITH VISUALIZATION SYSTEM - An articulated device may include a first steerable multi-linked mechanism and a second steerable multi-linked mechanism. The second steerable multi-linked mechanism may include a first link, a plurality of intermediate links and a second link movably coupled to a second one of the intermediate links A first one of the intermediate links may be movably coupled to the first link The articulated device may include a camera located within at least a portion of the second link and a protective shield connected to a distal end of the second link The protective shield may surround at least a portion of the camera. | 06-23-2011 |
| Patent application number | Description | Published |
|---|
| 20090184416 | MCM packages - An RF/IPD package with improved thermal management is described. The IPD substrate is attached to a system substrate with a thin RF chip mounted in the standoff between the IPD substrate and the system substrate. RF interconnections are made between the top of the RF chip and the bottom of the IPD substrate. Heat sinking is provided by bonding a heat sink layer on the RF chip to a heat sink layer on the system substrate. The heat sink may also serve as a ground plane connection. Combinations of other types of integrated devices may be fabricated using this approach. | 07-23-2009 |
| 20090218655 | Integrated passive devices - The specification describes an integrated passive device (IPD) that is formed on a polysilicon substrate. A method for making the IPD is disclosed wherein the polysilicon substrate is produced starting with a single crystal handle wafer, depositing a thick substrate layer of polysilicon on one or both sides of the starting wafer, forming the IPD on one of the polysilicon substrate layers, and removing the handle wafer. In a preferred embodiment the single crystal silicon handle wafer is a silicon wafer rejected from a single crystal silicon wafer production line. | 09-03-2009 |
| 20090237175 | Compact balun transformers - Balun transformers are described wherein multiple transformer loops are implemented in a stacked design with the primary and secondary loops overlying one another. By aligning the loops in a vertical direction, instead of offsetting the loops, the area of the device is reduced. Multiple transformer loops are nested on each level, and the transformer loops on a given level are connected together using a crossover located on a different level. | 09-24-2009 |
| 20090278690 | RF devices - A low cost passive RFID tag uses capacitive or inductive coupling between the RF IC chip and the antenna. Coupling elements are formed directly on the surface of the RF IC chip. | 11-12-2009 |
| 20110101497 | METHOD FOR FABRICATING A FLIP-BONDED DUAL-SUBSTRATE INDUCTOR, FLIP-BONDED DUAL-SUBSTRATE INDUCTOR, AND INTEGRATED PASSIVE DEVICE INCLUDING A FLIP-BONDED DUAL-SUBSTRATE INDUCTOR - A flip-bonded dual-substrate inductor includes a base substrate, a first inductor body portion provided on a surface of the base substrate, a cover substrate, a second inductor body portion provided on a surface of a cover substrate, and a nanoparticle bonding material provided between the base substrate surface and the cover substrate surface to electrically connect the first inductor body portion and the second inductor body portion. A method for fabricating a flip-bonded dual-substrate inductor including forming a first inductor body portion on a surface of a base substrate, forming a second inductor body portion on a surface of a cover substrate, and attaching the base substrate surface to the cover substrate surface using a nanoparticle bonding material that electrically connects the first inductor body portion and the second inductor body portion. | 05-05-2011 |
