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Dececco
Paola Dececco, Redwood City, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100091284 | APPARATUS AND METHODS FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY - Disclosed are techniques, apparatus, and targets for determining overlay error between two layers of a sample. A plurality of targets is provided. Each target includes a portion of the first and second structures and each is designed to have an offset between its first and second structure portions. The targets are illuminated with electromagnetic radiation to thereby obtain spectra from each target at a −1 | 04-15-2010 |
Paola Dececco, Foster City, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080283743 | Method and system for non-destructive distribution profiling of an element in a film - A method to determine a distribution profile of an element in a film. The method comprises exciting an electron energy of an element deposited in a first film, obtaining a first spectrum associating with the electron energy, and removing a background spectrum from the first spectrum. Removing the background value generates a processed spectrum. The method further includes matching the processed spectrum to a simulated spectrum with a known simulated distribution profile for the element in a film comparable to the first film. A distribution profile is obtained for the element in the first film based on the matching of the processed spectrum to a simulated spectrum selected from the set of simulated spectra. | 11-20-2008 |
| 20110144787 | METHOD AND SYSTEM FOR NON-DESTRUCTIVE DISTRIBUTION PROFILING OF AN ELEMENT IN A FILM - A method to determine a distribution profile of an element in a film. The method comprises exciting an electron energy of an element deposited in a first film, obtaining a first spectrum associating with the electron energy, and removing a background spectrum from the first spectrum. Removing the background value generates a processed spectrum. The method further includes matching the processed spectrum to a simulated spectrum with a known simulated distribution profile for the element in a film comparable to the first film. A distribution profile is obtained for the element in the first film based on the matching of the processed spectrum to a simulated spectrum selected from the set of simulated spectra. | 06-16-2011 |
Stefano Dececco, Ottawa CA
| Patent application number | Description | Published |
|---|---|---|
| 20090168348 | HIGH DENSITY COMPONENT ASSEMBLY METHOD AND APPARATUS - Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies. | 07-02-2009 |