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De Langen

Jos De Langen, Singapore SG

Patent application numberDescriptionPublished
20100183296Systems and Methods for Diagnostic Monitoring of Optical Modulation Amplitude at an Optical Receiver Using Automatic Gain Control - Optical receivers and a method for providing a diagnostic measurement of optical modulation amplitude at other than a signal output of an optical receiver are invented and disclosed. The method includes the steps of applying a representation of an output of an optical detector to a circuit that determines a difference between a first signal level and a second signal level that is different from the first signal level and buffering the difference between the first signal level and the second signal level received from the circuit. The optical receivers include an optical detector, a transimpedance amplifier that applies automatic gain control, a circuit that determines a difference between two signal values and a limiting post amplifier. The receivers provide a diagnostic measure that can be compared to certain thresholds relating to known bit error rates or applied in a calculation to generate an absolute optical modulation amplitude value.07-22-2010

Klaas-Jan De Langen, Nijmegen NL

Patent application numberDescriptionPublished
20090160459SYSTEM FOR DIAGNOSING IMPEDANCES HAVING ACCURATE CURRENT SOURCE AND ACCURATE VOLTAGE LEVEL-SHIFT - The present invention relates to a system for measuring a capacitor (C). A current source (06-25-2009

Mark De Langen, Rotterdam NL

Patent application numberDescriptionPublished
20080234532FIDUCIAL MARKER - A fiducial marker which is visible to a wide range of imaging techniques, comprises a radiopaque material, such as barium sulphate or a metal wire, encapsulated in a biocompatible polymeric material, for example a polyaryletherketone such as polyetheretherketone.09-25-2008

Michel De Langen, Beuningen NL

Patent application numberDescriptionPublished
20100089135DEVICE AND METHOD FOR MEASURING SENSOR CHIPS - A device and method for measuring a sensor chip with bond pads uses a plurality of conductive elements configured to be sufficiently rigid to penetrate oxidation on the bond pads to electrically connect to the bond pads of the sensor chip to exchange measurement information with the sensor chip.04-15-2010
20110062531 SENSOR ARRAY AND A METHOD OF MANUFACTURING THE SAME - A sensor array (03-17-2011