| Patent application number | Description | Published |
|---|
| 20080202925 | Single, Right-Angled End-Block - A single, right-angled end-block is claimed for rotatably carrying a target in a sputtering apparatus. The end-block comprises all necessary means to drive, energise, bear and seal (coolant and gas) the target in the sputtering apparatus from the outside through a single opening in a wall or door. The right-angled end-block rotates the target around an axis of rotation that is parallel to the wall on which the target is mounted. By preference the end-block is situated below the target in order to allow easy drainage of the coolant. | 08-28-2008 |
| 20080264785 | Module For Coating Both Sides of a Substrate in a Single Pass - A module to carry targets in a sputter deposition installation for coating two-sided substrates is described. The module is mountable to the installation through an interface flange that carries at least two targets with their associated magnet systems. When the module is mounted, the targets take positions at opposite sides of the two-sided substrate, while the magnet systems orient the sputter deposition towards the substrate. The module enables coating of both sides of the substrate in one single pass. Different configurations are described with gas distribution systems and additional substrate supports. An enclosure with adjustable blinds in order to reduce gas spreading is also included. | 10-30-2008 |
| 20090114529 | SPUTTERING APPARATUS - A coating apparatus is revealed that is designed to coat substrates by means of a physical vacuum deposition process or a chemical vacuum deposition process or a combination thereof. Said coating apparatus is particular in that it uses a rotatable magnetron ( | 05-07-2009 |
| 20090130336 | COATING APPARATUS - A coating apparatus ( | 05-21-2009 |
| 20090139862 | ROTATABLE SPUTTER TARGET - The invention relates to a rotatable sputter target and to a method to manufacture such a sputter target. The sputter target comprises a target material and a magnet array located at the interior of the target material. The magnet array defines a central zone extending along the major part of the length of the target material and defines an end zone at each end of the central zone. The target material comprises a first material and a second material. The target material comprises the first material at least on the central zone and comprises the second material at least on the end zones. The second material has a lower sputter deposition rate than the first material. The second material is preferably applied by thermal spraying. The first material comprises a first element and the second material comprises a compound of the first element of the first material. | 06-04-2009 |
| 20090183983 | INSERT PIECE FOR AN END-BLOCK OF A SPUTTERING INSTALLATION - An insert piece ( | 07-23-2009 |
| 20110100809 | METHOD TO MANUFACTURE AN OXIDE SPUTTER TARGET COMPRISING A FIRST AND SECOND PHASE - The invention relates to a method to manufacture an oxide sputter target. The method comprises the steps of providing a target holder; applying an outer layer of a sputterable material on the target holder by simultaneously spraying at least one oxide and at least one metal. The outer layer of sputterable material comprises a first phase and a second phase. The first phase comprises an oxide of at least a first metal and a second metal; the second phase comprises a metal in its metallic phase. The metal in its metallic phase forms discrete volumes arranged in or between the oxide of the first phase. The outer layer of sputterable material comprises between 0.1 and 20 wt % metal in its metallic phase. The invention further relates to an oxide sputter target. | 05-05-2011 |
