Patent application number | Description | Published |
20120256198 | LED PACKAGE STRUCTURE FOR INCREASING THE LIGHT UNIFORMING EFFECT - A LED package structure for increasing the light uniforming effect includes a substrate unit, a light emitting unit, a first package unit, and a second package unit. The substrate unit includes at least one substrate body. The light emitting unit includes at least one light emitting element disposed on the at least one substrate body and electrically connected to the at least one substrate body. The first package unit includes a first package resin body formed on the at least one substrate body to cover the at least one light emitting element. The second package unit includes a second package resin body formed on the at least one substrate body to cover the first package resin body. The second package resin body is a light uniforming resin body having a light diffusing material mixed therein, and the second package resin body has an exposed light uniforming surface formed thereon. | 10-11-2012 |
20120267659 | LED PACKAGE STRUCTURE - A LED package structure includes a substrate unit, a light emitting unit, a package unit, and a phosphor unit. The substrate unit includes a substrate body. The light emitting unit includes at least one light emitting element disposed on and electrically connected to the substrate body. The package unit includes a package resin body formed on the substrate body to cover the light emitting element. The package resin body has a light output surface formed on the top surface thereof to guide light beams generated by the light emitting element to leave the package resin body. The phosphor unit includes a prefabricated phosphor cap disposed on the substrate body to enclose the package resin body. The prefabricated phosphor cap is separated from the package resin body by a predetermined distance to form a receiving portion between the prefabricated phosphor cap and the package resin body. | 10-25-2012 |
20130169144 | LED PACKAGE STRUCTURE CAPABLE OF ADJUSTING THE SPATIAL COLOR UNIFORMITY AND THE LIGHT DISTRIBUTION CURVE - A LED package structure capable of adjusting the spatial color uniformity and the light distribution curve includes a substrate unit, a light-emitting unit, a transparent package unit, and a phosphor package unit. The light-emitting unit includes at least one light-emitting element for generating a light-emitting source to show a predetermined light distribution curve. The transparent package unit includes a transparent package resin body covering the light-emitting element. The phosphor package unit includes a phosphor package resin body covering the transparent package resin body. Hence, when the light-emitting source generated by the light-emitting element is transformed into a light-projecting source through the transparent package resin body and the phosphor package resin body sequentially, and the spatial color uniformity and the light distribution curve of the light-projecting source can be adjusted according to the phosphor package resin body having a non-uniform thickness. | 07-04-2013 |
20150252990 | LIGHT EMITTING MODULE AND LAMP BULB STRUCTURE - A light emitting module includes a base unit, a substrate unit, a light emitting unit and a driving unit. The base unit includes a base body having a horizontal carrying surface and at least one inclined carrying surface. The inclined carrying surface is inclined by a predetermined angle relative to the horizontal carrying surface. The substrate unit includes a bendable substrate disposed on the base body. The bendable substrate has a horizontal portion disposed on the horizontal carrying surface, at least one inclined portion disposed on the inclined carrying surface, and at least one bending portion disposed between the horizontal and the inclined portions. The inclined portion is inclined by a predetermined angle relative to the horizontal portion. The light emitting unit includes at least one light emitting group disposed on the horizontal portion. The driving unit includes a plurality of electronic components disposed on the inclined portion. | 09-10-2015 |