| Patent application number | Description | Published |
|---|
| 20080239687 | Server infrastructure having independent backplanes to distribute power and to route signals - Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis. | 10-02-2008 |
| 20080309208 | Installation And Removal Of Computing Components - Included are embodiments for installation and removal of computing components. More specifically, at least one embodiment of an apparatus includes at least one removable support platform configured to define a computing device bay and at least one removable switch divider configured to further define the computing device bay, the computing device bay configured to receive a double-high component. | 12-18-2008 |
| 20080310097 | Blade Device Enclosure - A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device. | 12-18-2008 |
| 20080310100 | AIRFLOW ADJUSTMENT IN AN ELECTRONIC MODULE ENCLOSURE - An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening. | 12-18-2008 |
| 20080310107 | AIRFLOW PATH WITHIN AN ELECTRONIC MODULE ENCLOSURE - An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum. | 12-18-2008 |
| 20080316704 | AIR MANIFOLD FOR ELECTRONIC MODULE ENCLOSURE - A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section. | 12-25-2008 |
| 20090016010 | COMPONENT LAYOUT IN AN ENCLOSURE - An electronic module includes an enclosure having front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board. | 01-15-2009 |
| 20090306833 | COOLING ASSIST MODULE - Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths. | 12-10-2009 |
