Patent application number | Description | Published |
20090160065 | Reconstituted Wafer Level Stacking - A stacked microelectronic assembly is fabricated from a structure which includes a plurality of first microelectronic elements having front faces bonded to a carrier. Each first microelectronic element may have a first edge and a plurality of first traces extending along the front face towards the first edge. After exposing at least a portion of the first traces, a dielectric layer is formed over the plurality of first microelectronic elements. After thinning the dielectric layer, a plurality of second microelectronic elements are aligned and joined with the structure such that front faces of the second microelectronic elements are facing the rear faces of the plurality of first microelectronic elements. Processing is repeated to form the desirable number of layers of microelectronic elements. In one embodiment, the stacked layers of microelectronic elements may be notched at dicing lines to expose edges of traces, which may then be electrically connected to leads formed in the notches. Individual stacked microelectronic units may be separated from the stacked microelectronic assembly by any suitable dicing, sawing or breaking technique. | 06-25-2009 |
20110002053 | WAFER LEVEL OPTICAL ELEMENTS AND APPLICATIONS THEREOF - The present invention provides wafer level optical elements that obviate a substrate wafer or a portion thereof disposed between optical structures or optical surfaces of the element. | 01-06-2011 |
20110006432 | RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS - A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements ( | 01-13-2011 |
20110181854 | FOCUS COMPENSATION FOR OPTICAL ELEMENTS AND APPLICATIONS THEREOF - Optical imaging apparatus are provided having the desired focal properties, which can be manufactured and/or assembled at the wafer level. | 07-28-2011 |
20110222171 | RECESSED OPTICAL SURFACES - An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes. | 09-15-2011 |
20110304930 | Focus Compensation For Optical Elements And Applications Thereof - Optical imaging apparatus are provided having the desired focal properties, which can be manufactured and/or assembled at the wafer level. | 12-15-2011 |
20120133916 | WAFER LEVEL OPTICAL ELEMENTS AND APPLICATIONS THEREOF - In one aspect, the present invention provides a wafer level optical assembly comprising a first wafer level optical element, the first wafer level optical element comprising a first alignment structure and a second wafer level optical element, the second wafer level optical element comprising a second alignment structure, wherein the first alignment structure contacts the second alignment structure. | 05-31-2012 |
20120229908 | RECESSED OPTICAL SURFACES - An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes. | 09-13-2012 |
20130229719 | Wafer Level Optical Elements and Applications Thereof - The present invention provides wafer level optical elements that obviate a substrate wafer or a portion thereof disposed between optical structures or optical surfaces of the element. | 09-05-2013 |