| Patent application number | Description | Published |
|---|
| 20080283190 | METHOD OF REMOVING MEMS DEVICES FROM A HANDLE SUBSTRATE - A method of removing MEMS devices ( | 11-20-2008 |
| 20080283197 | DIE PICKER WITH LASER DIE HEATER - A device for removing MEMS devices ( | 11-20-2008 |
| 20080283198 | DIE PICKER WITH HEATED PICKING HEAD - A device for removing MEMS devices ( | 11-20-2008 |
| 20090109260 | INKJET PRINTHEAD COMPRISING NOZZLE PLATE HAVING IMPROVED ROBUSTNESS - An inkjet printhead comprising a reinforced bi-layered nozzle plate structure spanning across a plurality of nozzles is provided. Typically, the nozzle plate structure comprises: a first nozzle plate spanning a plurality of nozzles, the first nozzle plate having a plurality of cavities defined therein; photoresist filling the cavities; and a second nozzle plate covering said the first nozzle plate and the photoresist. | 04-30-2009 |
| 20090110846 | METHOD OF FABRICATING INKJET PRINTHEAD HAVING PLANAR NOZZLE PLATE - A method of fabricating an inkjet printhead is provided. The method comprises the steps of: (a) providing a partially-fabricated printhead having a first nozzle plate comprised of a first material spanning a plurality of nozzles, the first nozzle plate having a plurality of cavities; (b) filling the cavities with a filler, such that an upper surface of the first nozzle plate and an upper surface of the filler together define a contiguous planar surface; and (c) depositing a second material onto the planar surface to form a second nozzle plate having a planar exterior surface. | 04-30-2009 |
| 20100134562 | INKJET PRINTHEAD WITH FIRST AND SECOND NOZZLE PLATES - An inkjet printhead with first and second nozzle plates. The first nozzle plate is comprised of a first material spanning a plurality of nozzles. The first nozzle plate has a plurality of cavities filled with a filler such that an upper surface of the first nozzle plate and an upper surface of the filler together define a contiguous planar surface. The second nozzle plate is comprised of a second material disposed on the planar surface. | 06-03-2010 |
| 20110018939 | INKJET PRINTHEAD ASSEMBLY HAVING BACKSIDE ELECTRICAL CONNECTION - An inkjet printhead assembly comprising an ink supply manifold; printhead integrated circuits and a connector film for supplying power to drive circuitry in the printhead integrated circuits. Each printhead integrated circuit has a frontside comprising the drive circuitry and inkjet nozzle assemblies, a backside attached to the ink supply manifold, and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. A connection end of the connector film is sandwiched between part of the ink supply manifold and the printhead integrated circuits. | 01-27-2011 |
| 20110018940 | PRINTHEAD INTEGRATED CIRCUIT CONFIGURED FOR BACKSIDE ELECTRICAL CONNECTION - A printhead integrated circuit has a frontside comprising drive circuitry and inkjet nozzle assemblies, a backside for attachment to an ink supply manifold and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. The backside has a recessed portion for accommodating part of a connector film, which supplies power to the drive circuitry. | 01-27-2011 |
| 20110018941 | PRINTHEAD INTEGRATED COMPRISING THROUGH-SILICON CONNECTORS - A printhead integrated circuit comprising a silicon substrate defining a frontside and a backside, inkjet nozzle assemblies positioned at the frontside, drive circuitry for supplying power to the inkjet nozzle assemblies and through-silicon connectors extending from the frontside towards the backside. The through-silicon connectors provides electrical connections between the drive circuitry and corresponding integrated circuit contacts. The integrated circuit contacts are positioned for connection to a backside-mounted connector film supplying power to the drive circuitry. | 01-27-2011 |
| 20110020964 | METHOD OF FABRICATING INKJET PRINTHEAD ASSEMBLY HAVING BACKSIDE ELECTRICAL CONNECTIONS - A method of fabricating an inkjet printhead assembly having backside electrical connections. The method comprises the steps of: (a) providing printhead integrated circuits, each having a backside recessed edge portion and connectors extending through the integrated circuit, each connector having a head connected to frontside drive circuitry and a base in the recessed edge portion; (b) positioning a connection end of a connector film in the recessed edge portion; (c) connecting each film contact to the base of a corresponding connector; and (d) attaching the backside of each printhead integrated circuit together with the connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections. | 01-27-2011 |
| 20110020965 | METHOD OF FABRICATING PRINTHEAD INTEGRATED CIRCUIT WITH BACKSIDE ELECTRICAL CONNECTIONS - A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads. | 01-27-2011 |
