Patent application number | Description | Published |
20100272310 | MICROCAP ACOUSTIC TRANSDUCER DEVICE - A device includes a first wafer, a second wafer, a gasket bonding the first wafer to the second wafer to define a cavity between the first wafer and the second wafer, and an acoustic transducer disposed on the first wafer and disposed within the cavity between the first wafer and the second wafer. One or more apertures are provided for communicating an acoustic signal between the acoustic transducer and an exterior of the device. An aperture may be formed in the cavity itself, or the cavity may be hermetically sealed. An aperture may be formed completely through the first wafer and located directly beneath at least a portion of the acoustic transducer. | 10-28-2010 |
20100278368 | MICROMACHINED HORN - An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile. | 11-04-2010 |
20100327702 | TEMPERATURE CONTROL OF MICROMACHINED TRANSDUCERS - A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity. | 12-30-2010 |
20110088234 | TEMPERATURE CONTROL OF MICROMACHINED TRANSDUCERS - A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity. | 04-21-2011 |
20110120971 | MICROMACHINED TRANSDUCERS AND METHOD OF FABRICATION - In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch. | 05-26-2011 |
20110198970 | ENCAPSULATED ACTIVE TRANSDUCER AND METHOD OF FABRICATING THE SAME - A micro-electromechanical systems (MEMS) ultrasonic transducer device includes a substrate defining an opening and an active transducer having multiple of active layers stacked over the opening of the substrate. The active transducer is completely encapsulated by multiple passivation layers. | 08-18-2011 |
20110203378 | INTEGRATED OPTICAL AND ACOUSTIC TRANSDUCER DEVICE - An integrated transducer device includes an optical transducer and an acoustic transducer integrally joined with the optical transducer. The acoustic transducer includes a membrane responsive to acoustic signals, the membrane being aligned with the optical transducer such that optical signals emitted or received by the optical transducer pass through the membrane. A propagation direction of the acoustic signals emitted or received by the acoustic transducer is collinear with a propagation direction of the optical signals emitted or received by the optical transducer. | 08-25-2011 |
20110291207 | TRANSDUCER DEVICES HAVING DIFFERENT FREQUENCIES BASED ON LAYER THICKNESSES AND METHOD OF FABRICATING THE SAME - A transducer array on a common substrate includes a membrane and first and second transducer devices. The membrane is formed on the common substrate, and includes a lower layer and an upper layer. The first transducer device includes a first resonator stack formed on at least the lower layer in a first portion of the membrane, the upper layer having a first thickness in the first portion of the membrane. The second transducer device includes a second resonator stack formed on at least the lower layer in a second portion of the membrane, the upper layer having a second thickness in the second portion of the membrane, where the second thickness is different from the first thickness, such that a first resonant frequency of the first transducer device is different from a second resonant frequency of the second transducer device. | 12-01-2011 |
20120025335 | MICROELECTROMECHANICAL SYSTEMS (MEMS) PACKAGE - A micro-electromechanical systems (MEMS) transducer device comprises: a package substrate having a first coefficient of thermal expansion (CTE); and a transducer substrate comprising a transducer. The transducer substrate is disposed over the package substrate. The transducer substrate has a second CTE that substantially matches the first CTE. | 02-02-2012 |
20120025337 | MEMS TRANSDUCER DEVICE HAVING STRESS MITIGATION STRUCTURE AND METHOD OF FABRICATING THE SAME - A micro-electromechanical systems (MEMS) transducer device mounted to a package substrate includes an active transducer having a resonator stack formed over a cavity through a transducer substrate, and a stress mitigation structure between the transducer substrate and the package substrate. The stress mitigation structure reduces stress induced on the transducer substrate due to mismatched coefficients of thermal expansion (CTEs) of the transducer substrate and the package substrate, respectively. | 02-02-2012 |
20120098625 | ELECTROSTATIC BONDING OF A DIE SUBSTRATE TO A PACKAGE SUBSTRATE - A transducer apparatus comprises a package substrate and a transducer disposed over a die substrate. The die substrate is disposed over the package substrate. The transducer apparatus also comprises a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate. | 04-26-2012 |
20120269372 | MICROMACHINED HORN - An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile. | 10-25-2012 |