| Patent application number | Description | Published |
|---|
| 20080247427 | Optical systems for laser arrays - Surface emitting laser arrays with intra-cavity harmonic generation are coupled to an optical system that extracts harmonic light in both directions from an intra-cavity nonlinear optical material in such a way that the focusing properties of the light beams are matched. | 10-09-2008 |
| 20080273557 | Illumination system for optical modulators - A phase plate and lens modify light beams emitted by an array of lasers to form an efficient illumination source for a MEMS light modulator array. The phase of the electric field emitted by the lasers is modified such that the after passing through a lens the beam profile at the lens focal plane has an approximately rectangular shape appropriate for illuminating a light modulator array. The phase plate may be constructed from a glass plate with rectangular notches etched in it or with rectangular ridges formed on it. Furthermore a light source, such as a laser, may be coupled to an adiabatically tapered optical waveguide in which a phase adjusting block is introduced in analogy to notches in a bulk phase plate. Phase modified light beams output from the waveguide system have similar focusing properties to those passing through a bulk phase plate. | 11-06-2008 |
| 20090140433 | MEMS chip-to-chip interconnects - A chip-to-chip interconnect system suited for MEMS that do not require low-resistance connections is described. The interconnects may be fabricated simultaneously with MEMS ribbon structures such as are found in MEMS optical modulators. | 06-04-2009 |
| 20090219491 | Method of combining multiple Gaussian beams for efficient uniform illumination of one-dimensional light modulators - An illumination system for transforming at least one laser light beam having a non-uniform distribution in a first axis and a second axis to a beam having a substantially uniform distribution in the first axis while preserving the non-uniform distribution in the second axis. The transformed beam may be imaged as a line image onto a one-dimensional light modulation device. The illumination system may comprise a light tunnel having two sides that interact with the at least one laser light beam in the first axis and two sides that do not interact with the light in the second axis. | 09-03-2009 |
| 20090237785 | Microfabricated optical wave plate - A microfabricated optical wave plate comprises a reflective polarizer and a mirror separated by a fixed or variable distance. The wave plate imparts a relative phase delay on polarization components of incident light, thereby transforming the overall polarization of the light. | 09-24-2009 |
| 20090323169 | Scanned, one-dimensional, phased-array display system - A scanned, one-dimensional, phased-array display system combines imaging optics on one axis with Fourier transform optics on another. The display offers the energy efficiency and fault tolerance of phase modulator-based displays, and the compactness, flexibility and speed of optical MEMS. Also described is a mechanism to introduce amplitude variations on the Fourier axis if needed to compensate for image artifacts. | 12-31-2009 |
| 20100040094 | Optical systems for laser arrays - Surface emitting laser arrays with intra-cavity harmonic generation are coupled to an optical system that extracts harmonic light in both directions from an intra-cavity nonlinear optical material in such a way that the focusing properties of the light beams are matched. | 02-18-2010 |
| 20100315565 | Display system - A display system is based on a linear array phase modulator and a phase edge discriminator optical system. | 12-16-2010 |
| 20100315694 | Compact display system - A display system is based on a linear array phase modulator and a phase edge discriminator optical system. | 12-16-2010 |
| 20110084343 | Monolithic IC and MEMS microfabrication process - Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wafer. The sequence of IC and MEMS process steps is designed to prevent alteration of partially completed circuits and devices by subsequent high process temperatures. | 04-14-2011 |
