| Patent application number | Description | Published |
|---|
| 20090168259 | WAFER LEVEL BALANCED CAPACITANCE DESIGN FOR MAGNETIC HEADS - Embodiments of the invention provide methods, systems and apparatus for testing electronic components, and more specifically for testing magnetoresistive heads. A pair of top shield pads and a pair of bottom shield pads may be formed in a kerf region of a wafer on which magnetoresistive heads are formed. The top shield pads, bottom shield pads, and a magnetoresistive head may form a circuit that may be coupled with a testing circuit to exchange test signals configured to test the magnetic head. The pair of bottom shield pads may provide balanced impedance to substrate that nullifies the effects of broadband noise. | 07-02-2009 |
| 20090290259 | MAGNETIC HEAD WITH DELAYED CONNECTION HEATER SHUNTING - A slider structure that allows a grounded heater element to be employed, while also allowing a decision of whether the slider is to be an “up” slider or a “down” slider to be made in a late stage in the formation of the slider. The slider includes electrical contact pads for making electrical connection with the heater element. The slider also includes a dedicated ground path formed on the slider body at a location that is removed from either of the first and second contact pads, ground path providing electrical connectivity to the slider body. At a late stage in the manufacture of the read and write head, a determination can be made as to which contact pad is to be a ground pad, and that pad can be electrically connected with the ground path. | 11-26-2009 |
| 20090296285 | METHODS AND SYSTEMS FOR USING RESISTIVITY OF SENSOR FILM IN AN ELEMENT SHUNT - A system in one approach includes a sensor stack formed of a plurality of thin film layers; a shunt formed of at least some of the same layers as the sensor stack, the shunt being spaced from the sensor stack; a first lead coupled to the sensor stack and the shunt; and a second lead coupled to the sensor stack and the shunt. A method in one embodiment includes forming a plurality of thin film layers; removing a portion of the thin film layers for defining at least a portion of a sensor stack and at least a portion of a shunt spaced front the sensor stack; forming a first lead coupled to the at least a portion of the sensor stack and the at least a portion of the shunt and a second lead coupled to the at least a portion of the sensor stack and the at least a portion of the shunt. Additional systems and methods are also presented. | 12-03-2009 |
| 20100021764 | METHODS AND SYSTEMS FOR CONFINING SENSE CURRENT OF A CPP READ TRANSDUCER TO THE ABS SIDE OF THE FREELAYER - A method in one embodiment includes forming a mask above a thin film sensor stack; forming an electrically insulating layer above the mask and sensor stack, the insulating layer having a portion extending along a nonhorizontal end of the mask; selectively removing the insulating layer except for the portion thereof extending along the nonhorizontal end of the mask; removing portions of the sensor stack that are not covered by the mask and the portion of the insulating layer, wherein an end of the portion of the insulating layer positioned away from the mask is about aligned with a back end of the sensor stack after removing the portions thereof; and removing the mask. Additional systems and methods are also presented. | 01-28-2010 |
| 20100073826 | MAGNETIC HEAD HAVING REDUCED COST ELECTROSTATIC DISCHARGE SHUNT - A method for manufacturing a magnetic head with an electrostatic discharge resistor for preventing electrostatic discharge damage to magnetic head. The electrostatic discharge resistor is formed by a processes that saves manufacturing time and cost by forming resistor in the same deposition and patterning steps used to form the magnetoresistive sensor. However, the resistor includes only a portion of the layers used to form the magnetoresistive sensor, thereby ensuring that the resistor will have sufficient resistivity. | 03-25-2010 |
| 20100214699 | MAGNETORESISTIVE SENSOR WITH OVERLAID COMBINED LEADS AND SHIELDS - A magnetic head according to one embodiment includes a first magnetic shield; a first insulation layer disposed above said first magnetic shield; a plurality of sensor layers disposed above said first insulation layer; two electrical leads overlying a majority of a surface of the sensor layers, the electrical leads being formed of a magnetic material and serving as a second magnetic shield; and a read width insulation member disposed above said sensor layers and between said two electrically conductive members, the read width insulation members lying in a common plane with the electrically conductive members, the common plane being oriented parallel to a plane of deposition of the read width insulation member. Other systems and methods are also presented. | 08-26-2010 |
| 20100254042 | PERPENDICULAR MAGNETIC RECORDING SYSTEM WITH AUXILIARY COIL AND CIRCUITRY FOR FAST SWITCHING OF WRITE POLE MAGNETIZATION - A perpendicular magnetic recording system has a write head having a main coil (the write coil) and main pole (the write pole) that directs write flux in a direction perpendicular to the recording layer in the magnetic recording medium, and an auxiliary coil and auxiliary pole that injects magnetic flux into the write pole at an angle to the primary or perpendicular axis of the write pole. The additional flux from the auxiliary pole, which is injected non-parallel to the primary magnetization of the write pole, exerts a relatively large torque on the magnetization of the write pole, thereby facilitating magnetization reversal of the write pole. Electrical circuitry is connected to the main coil and the auxiliary coil to generate the auxiliary flux simultaneous with the switching of the magnetization of the write pole. | 10-07-2010 |
| 20110019313 | SELF-ALIGNED DOUBLE FLUX GUIDED TMR SENSOR - A magnetic head according to one embodiment includes an array of sensor structures formed on a common substrate. Each sensor structure further comprises: a magnetic tunnel junction sensor spaced from a media-facing surface of the head; and a flux guide between the media-facing surface of the head and the sensor, the flux guide guiding magnetic flux from a magnetic medium adjacent the media-facing surface to the sensor. Additional systems and methods are also presented. | 01-27-2011 |
| 20110027618 | Fabrication of magnetoresistive sensors and electronic lapping guides - The subject matter disclosed herein provides methods for manufacturing an electronic lapping guide and a magnetic read head assembly. The magnetoresistive head assembly includes a sensing element that has a front edge and a front flux guide that has a back edge, such that the sensing element front edge and the front flux guide back edge share a common interface that defines an interface plane normal to the surface of a wafer substrate. The electronic lapping guide comprises a conductive material adapted to attach to two electrical leads for measuring a resistance through the conductive material. The conductive material may include a conductive material back edge aligned with the interface plane. The resistance of the conductive material may be inversely proportional to a conductive material length normal to the interface plane. | 02-03-2011 |
| 20110109993 | PERPENDICULAR MAGNETIC RECORDING WRITE HEAD WITH ENHANCEMENT CAPACITOR ON SLIDER BODY FOR WRITE CURRENT OVERSHOOT AT WRITE CURRENT SWITCHING - Write enhancement circuitry on the head carrier of a magnetic recording disk drive provides additional write current overshoot beyond that provided by the write driver circuitry. An enhancement capacitor is formed with a dielectric layer between two layers of electrically-conductive magnetically-permeable shield material that serve as the capacitor plates. The write enhancement circuitry may also include an enhancement resistor. The enhancement capacitor and resistor are connected between the two terminals on the head carrier that connect to the write head coil. The capacitor and resistor are fabricated on the head carrier at the same time and in the same process as the read head. The first and second capacitor plates are generally coplanar with and formed of the same electrically-conductive magnetically-permeable material that forms the first and second magnetic shields for the read head. The enhancement resistor is a stack of layers that is coplanar with and formed of the same materials as the stack of layers that form the sensor portion of the read head between the two magnetic shields. | 05-12-2011 |
