Patent application number | Description | Published |
20100007034 | LENS SUPPORT AND WIREBOND PROTECTOR - A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds. | 01-14-2010 |
20100266236 | OPTICAL COMMUNICATIONS DEVICE HAVING A MOUNTING CORE AND METHOD - A parallel optical communications device is provided that has a mounting core that functions as a mounting system for mounting core components of the parallel optical communications device. In addition, the mounting core functions as a heat dissipation system for the core components of the parallel optical communications device, and also protects the core components and other elements of the communications device from dust and damage that can be caused by handling and other factors. In addition to performing the aforementioned functions, the mounting core is configured to enable the parallel optical communications device to be made extremely small in size while also protecting signal integrity. | 10-21-2010 |
20110008005 | PARALLEL OPTICAL COMMUNICATIONS DEVICE HAVING WELDABLE INSERTS - A parallel optical communications device is provided that has an OSA that includes at least one heat dissipation block having a slot formed in a lower surface thereof that contains a weldable insert. Likewise, an upper surface of the mounting device of the ESA has at least one slot formed therein that contains a weldable insert. After the OSA is placed in contact with the ESA and optically aligned with the ESA, the OSA is secured to the upper surface of the mounting device of the ESA by welding together the respective weldable inserts contained in the respective slots in the OSA and in the mounting device of the ESA. The welding process results in an extremely strong welded joint between the OSA and the ESA that prevents relative movement between the OSA and the ESA if external forces that are exerted on the OSA and/or on the ESA. | 01-13-2011 |
20110310490 | LENS DEVICE HAVING PROTECTIVE ELEMENTS - A lens device has a body with a base surface, a plurality of lenses on the base surface, and a plurality of projections extending above the base surface and defining a protective plane above the plurality of lenses. The plurality of projections can include, for example, post-like regions, ridge-like regions, or a combination thereof. | 12-22-2011 |
20120063725 | LOW-PROFILE OPTICAL COMMUNICATIONS MODULE HAVING TWO GENERALLY FLAT OPTICAL CONNECTOR MODULES THAT SLIDINGLY ENGAGE ONE ANOTHER - A low-profile optical communications module is provided that has two generally flat optical connector modules that slidingly engage one another to allow optical signals to be coupled between the optical connector modules. Because of the generally flat shapes of the optical connector modules and the manner in which they slidingly engage on another, the optical communications module has a very low profile that makes it well suited for use in thin devices, such as laptop and notebook computers and other electronics devices. | 03-15-2012 |
20120219257 | LENS DEVICE ATTACHMENT TO PRINTED CIRCUIT BOARD - An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame. | 08-30-2012 |
20120327668 | OPTO-ELECTRONIC TRANSCEIVER MODULE WITH HOUSING HAVING THERMALLY CONDUCTIVE PROTRUSION - An opto-electronic communication module includes a housing, a circuit substrate, and an opto-electronic communication device, such as a laser, mounted on the circuit substrate. A protrusion that is unitarily formed in the housing extends through the circuit substrate to provide a thermal path to promote dissipation of heat emitted by the opto-electronic communication device. | 12-27-2012 |
20130188914 | PARALLEL OPTICAL COMMUNICATIONS SYSTEM THAT INCORPORATES A METHOD AND APPARATUS FOR PERFORMING ELECTROMAGNETIC INTERFERENCE (EMI) CONTAINMENT - Methods and apparatuses are provided for performing electromagnetic interference (EMI) containment in a parallel optical communications system. The apparatus includes a curved surface formed in the system housing near the opening through which a stack of ribbon cables passes, and a spring device. The stack of ribbon cables is sandwiched in between the curved surface of the housing and the spring device. The spring device exerts a force on the stack of ribbon cables that presses the stack against the curved surface of the housing and forms a sharp bend in the stack just before the stack passes through the opening in the housing. Because EMI radiation is restricted to propagation along the sharply bent pathway of the stack of ribbon cables, most or all of the EMI radiation traveling along that pathway is either attenuated or reflected before it reaches the opening. | 07-25-2013 |
20130194753 | GUIDE RAIL SYSTEM AND A METHOD FOR PROVIDING HIGH-DENSITY MOUNTING OF OPTICAL COMMUNICATIONS MODULES - A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion. | 08-01-2013 |
20140037254 | SIDE-EDGE MOUNTABLE PARALLEL OPTICAL COMMUNICATIONS MODULE, AN OPTICAL COMMUNICATIONS SYSTEM THAT INCORPORATES THE MODULE, AND A METHOD - A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth. | 02-06-2014 |
20140056592 | AIR-COOLED OPTICAL TRANSCEIVER MODULE SYSTEM - In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements. | 02-27-2014 |
20140063743 | METHODS AND SYSTEMS FOR DISSIPATING HEAT IN OPTICAL COMMUNICATIONS MODULES - Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another. | 03-06-2014 |
20140105535 | LENS STANDOFF AND PROTECTION FOR OPTICAL COMMUNICATION SYSTEMS - An opto-electronic system includes a substrate, an opto-electronic chip mounted on the substrate, a frame, and a lens device retained in the frame. A frame mounting portion of the frame is in contact with an upper surface of the opto-electronic chip. A lens mounting portion of the frame is spaced above the frame mounting portion. A lower surface of the lens device is in contact with the lens mounting portion. The spacing of the lens mounting portion and frame mounting portion determines the spacing between the upper surface of the opto-electronic chip and the lower surface of the lens device. | 04-17-2014 |
20140147127 | METHODS AND SYSTEMS FOR DISSIPATING HEAT IN OPTICAL COMMUNICATIONS MODULES - A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary. | 05-29-2014 |
20150030281 | METHODS AND APPARATUSES FOR PREVENTING AN OPTICS SYSTEM OF AN OPTICAL COMMUNICATIONS MODULE FROM BEING DAMAGED OR MOVED OUT OF ALIGNMENT BY EXTERNAL FORCES - Protection features are incorporated into an optical communications module to ensure that the optics system of the module will not be damaged or moved out of alignment by external forces exerted on a mating surface of the module when a connector module is mated with the optical communications module. One protection feature is a strike plate that is disposed on the mating surface of the module that redistributes forces exerted on the mating surface. Another protection feature is an optically-transmissive window formed in the mating surface and comprising an optically-transmissive element having anti-reflection (AR) coatings disposed on its upper and lower surfaces. The optics system is positioned beneath the mating surface so that forces that are exerted on the mating surface are not transferred to the optics system. Another protection feature is a design of the module that mechanically decouples the optics system from the mating surface. | 01-29-2015 |
20150030299 | OPTICAL MODULE CONNECTOR SYSTEM AND METHOD - A connector cover includes a body having a lower recessed portion configured to receive a portion of a reflecting connector of a type that retains the ends of optical fibers therein and has a reflector that redirects or turns the optical signals. The body has an upper housing portion that covers the reflector when the reflecting connector is received in the lower recessed portion of the body. The body also has a pair of arms extending from a forward end of the body. Each arm has a distal end with an arm distal end engagement. The arms are configured to engage a portion of an optical transceiver module. | 01-29-2015 |