| Patent application number | Description | Published |
|---|
| 20080308641 | SMART CARD WITH SWITCHABLE MATCHING ANTENNA - A smart card having a multi-layer substrate; a transponder module disposed in a first layer of the multi-layer substrate; a first antenna disposed in the first layer of the multi-layer substrate; and a second antenna disposed in a second layer of the multi-layer substrate. A switch and a capacitor in series with the second antenna. The first antenna may be tuned to a different frequency than the second antenna. An RFID chip and antenna in a mold mass disposed in a recess in the first layer of a substrate, behind a hologram disposed on the first layer of the substrate. The switch for the second antenna disposed under the RFID chip. A layer of ferrite material disposed between the hologram and the RFID chip. LEDs disposed behind the hologram. | 12-18-2008 |
| 20090166421 | RFID READER / CARD COMBINATION TO CONVERT A CONTACT SMARTCARD READER TO CONTACTLESS - An interface conversion reader (ICR) to convert a contact smartcard reader to a contactless smartcard reader. The ICR may have a rectangular card body format for insertion into a slot provided in a conventional contact smartcard reader, with a portion of said card body protruding out of the reader after insertion; wherein the protruding portion of said card body incorporates a contactless interface with an antenna to inductively couple and communicate with a contactless smartcard. The ICR may comprise an ISO 7816 contact interface to communicate with the contact smartcard reader and to draw power from said reader to activate the conversion of ISO 7816 data to ISO 14443 data. | 07-02-2009 |
| 20090213027 | METHODS OF CONNECTING AN ANTENNA TO A TRANSPONDER CHIP - An antenna wire ( | 08-27-2009 |
| 20090315320 | INLAYS FOR SECURITY DOCUMENTS - Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electromagnetic shielding. Additional security elements may include material that is optically changeable by an electromagnetic field. Ferrite-containing layers may be incorporated in the inlay substrate. | 12-24-2009 |
| 20100141453 | Method and Apparatus for Making a Radio Frequency Inlay - A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. | 06-10-2010 |
| 20110247197 | FORMING CHANNELS FOR AN ANTENNA WIRE OF A TRANSPONDER - Channels may be formed in the inlay substrate of a transponder, such as by laser ablation, and the antenna wire may subsequently be laid in the channels. Laying the wire in a channel ensures that it substantially fully embedded in the substrate, thereby eliminating a need for pressing the wire into the substrate. The channels may be tapered, or profiled, to enhance adhesion of a self-bonding wire. A recess for the chip module can also be formed using laser ablation, and insulation may be removed from end portions of the antenna wire using laser ablation. Laser ablation may also be used to create various mechanical and security features. | 10-13-2011 |
