Patent application number | Description | Published |
20080308641 | SMART CARD WITH SWITCHABLE MATCHING ANTENNA - A smart card having a multi-layer substrate; a transponder module disposed in a first layer of the multi-layer substrate; a first antenna disposed in the first layer of the multi-layer substrate; and a second antenna disposed in a second layer of the multi-layer substrate. A switch and a capacitor in series with the second antenna. The first antenna may be tuned to a different frequency than the second antenna. An RFID chip and antenna in a mold mass disposed in a recess in the first layer of a substrate, behind a hologram disposed on the first layer of the substrate. The switch for the second antenna disposed under the RFID chip. A layer of ferrite material disposed between the hologram and the RFID chip. LEDs disposed behind the hologram. | 12-18-2008 |
20090166421 | RFID READER / CARD COMBINATION TO CONVERT A CONTACT SMARTCARD READER TO CONTACTLESS - An interface conversion reader (ICR) to convert a contact smartcard reader to a contactless smartcard reader. The ICR may have a rectangular card body format for insertion into a slot provided in a conventional contact smartcard reader, with a portion of said card body protruding out of the reader after insertion; wherein the protruding portion of said card body incorporates a contactless interface with an antenna to inductively couple and communicate with a contactless smartcard. The ICR may comprise an ISO 7816 contact interface to communicate with the contact smartcard reader and to draw power from said reader to activate the conversion of ISO 7816 data to ISO 14443 data. | 07-02-2009 |
20090213027 | METHODS OF CONNECTING AN ANTENNA TO A TRANSPONDER CHIP - An antenna wire ( | 08-27-2009 |
20090315320 | INLAYS FOR SECURITY DOCUMENTS - Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electromagnetic shielding. Additional security elements may include material that is optically changeable by an electromagnetic field. Ferrite-containing layers may be incorporated in the inlay substrate. | 12-24-2009 |
20100141453 | Method and Apparatus for Making a Radio Frequency Inlay - A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. | 06-10-2010 |
20110247197 | FORMING CHANNELS FOR AN ANTENNA WIRE OF A TRANSPONDER - Channels may be formed in the inlay substrate of a transponder, such as by laser ablation, and the antenna wire may subsequently be laid in the channels. Laying the wire in a channel ensures that it substantially fully embedded in the substrate, thereby eliminating a need for pressing the wire into the substrate. The channels may be tapered, or profiled, to enhance adhesion of a self-bonding wire. A recess for the chip module can also be formed using laser ablation, and insulation may be removed from end portions of the antenna wire using laser ablation. Laser ablation may also be used to create various mechanical and security features. | 10-13-2011 |
20120038445 | RFID ANTENNA MODULES AND INCREASING COUPLING - A transponder with an antenna module having a chip module and an antenna; a booster antenna having a first antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end, and a second antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end; the inner end of the second antenna structure connected with the outer end of the first antenna structure. The antenna module may be positioned so that its antenna overlaps one of the first antenna structure or the second antenna structure. An antenna module having two additional antenna structures is disclosed. Methods of enhancing coupling are disclosed. | 02-16-2012 |
20120055013 | FORMING MICROSTRUCTURES AND ANTENNAS FOR TRANSPONDERS - Microstructures such as connection areas, contact pads, antennas, coils, plates for capacitors and the like may be formed using nanostructures such as nanoparticles, nanowires and nanotubes. A laser may be used to assist in the process of microstructure formation, and may also be used to form other features on a substrate such as recesses or channels for receiving the microstructures. A smart mobile phone sticker (MPS) mounted to a cell phone with a self-sticking shielding element comprising a core layer having ferrite particles. | 03-08-2012 |
20120074233 | COUPLING IN AND TO RFID SMART CARDS - A dual interface (DI) smart card ( | 03-29-2012 |
20120080527 | TRANSFERRING AN ANTENNA TO AN RFID INLAY SUBSTRATE - Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites. | 04-05-2012 |
20130062419 | RFID ANTENNA MODULES AND METHODS OF MAKING - A winding core (WC) having a tubular body portion (B) and two ends is mounted by one of its ends to a module tape (MT), a module antenna (MA) is wound around the winding core (WC), a chip (CM) is disposed on the module tape (MT) within the winding core (WC). Connections (wb) are made, and glob-top (GT) is applied over the chip (CM), substantially filling the interior area of the winding core (WC). The module antenna (MA), winding core (WC) and chip (CM) may subsequently be overmolded with a mold mass (MM). The winding core (WC) may have a flange (F) at one end. Using the module antenna (MA) itself as a dam for the glob-top is disclosed. Double-sided and single-sided module tapes (MT) having vias, openings, or vias and openings are disclosed. | 03-14-2013 |
20130075134 | PREPARING A SUBSTRATE FOR EMBEDDING WIRE - A portion of the surface of a substrate may be prepared for mounting an antenna wire such as by removing material to form a sequence of ditches (holes) separated by bridges (lands), and conforming to the pattern for the antenna, which is typically a flat squared spiral, having a number of turns. The antenna wire may be laid in the ditches and embedded in the bridges. Additional features, such as undermining or removing material from adjacent the bridges may facilitate displacement of substrate material at the bridges. The collapsed bridges form pinch points, securing the wire in the substrate. In some embodiments of the invention, relevant portions of the substrate are prepared for embedding antenna wire, without removing material. The substrate may be an inlay substrate or card body for a secure document. | 03-28-2013 |
20130075477 | COUPLING IN AND TO RFID SMART CARDS - A data carrier such as a smart card comprising an antenna module (AM) and a booster antenna (BA). The booster antenna (BA) has an outer winding (OW) and an inner winding (IW), each of which has an inner end (IE) and an outer end (OE). A coupler coil (CC) is provided, connecting the outer end (OE, b) of the outer winding (OW) and the inner end (IE, e) of the inner winding (IW). The inner end (IE, a) of the outer winding (OW) and the outer end (OE, f) of the inner winding (IW) are left un-connected (free floating). The coupler coil (CC) may have a clockwise (CW) or counter-clockwise (CCW) sense which is the same as or opposite to the sense (CW or CCW) of the outer and inner windings. Various configurations of booster antennas (BA) are disclosed. | 03-28-2013 |
20140104133 | ANTENNA MODULES FOR DUAL INTERFACE SMART CARDS, BOOSTER ANTENNA CONFIGURATIONS, AND METHODS - Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. | 04-17-2014 |
20140196278 | SONOTRODE WITH CUTTING MECHANISM - During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for cutting or nicking the wire. Insulation may be removed from a portion of the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed. | 07-17-2014 |
Patent application number | Description | Published |
20120040128 | TRANSFERRING ANTENNA STRUCTURES TO RFID COMPONENTS - Forming antenna structures having turns of wire, foil or conductive material on a an antenna substrate or in a layer of adhesive layer on a carrier substrate, transferring the antenna structures individually or many at once to corresponding transponder sites on an inlay substrate and connecting the aligned termination ends of the antenna structures to terminal areas of RFID chip modules at the transponder sites. Transferring may be performed by various means such as laminating (heat and pressure), or heating the antenna structures directly or indirectly. The antenna substrate may be in web format or sheet format. Automated manufacturing procedures are disclosed. Kits having components for manufacturing inlay substrates, inlays and secure documents are disclosed. Various features of an inlay substrate and chip module are disclosed. | 02-16-2012 |
20130126622 | OFFSETTING SHIELDING AND ENHANCING COUPLING IN METALLIZED SMART CARDS - A dual-interface smart card having a booster antenna with coupler coil in its card body, and a metallized face plate having a window opening for the antenna module. Performance may be improved by one or more of making the window opening substantially larger than the antenna module, providing perforations through the face plate, disposing ferrite material between the face plate and the booster antenna. Additionally, by one or more of modifying contact pads on the antenna module, disposing a compensating loop under the booster antenna, offsetting the antenna module with respect to the coupler coil, arranging the booster antenna as a quasi-dipole, providing the module antenna with capacitive stubs, and disposing a ferrite element in the antenna module between the module antenna and the contact pads. | 05-23-2013 |
20130140370 | RFID ANTENNA MODULES AND METHODS - An RFID chip (CM) is flip-chip mounted and connected to a surface of a substrate (MT), such as for a 6-pad ISO smart card antenna module (AM). A winding core (WC) for an antenna (MA) stiffens, stabilizes and planarizes substrate (MT) to enhance reliability of the connections. The flip-chip antenna module (FCAM) interfaces with a contactless reader. Contact pads (CP) on the opposite side of the substrate (MT) provide a contact interface. Also disclosed is first forming an antenna (MA) on an antenna substrate (AS), then joining it to the module substrate (MT). Such an antenna may be an embedded wire, or an etched metal layer. | 06-06-2013 |
20130271265 | CAPACITIVE COUPLING OF AN RFID TAG WITH A TOUCH SCREEN DEVICE ACTING AS A READER - Capacitive coupling of an RFID tag with a touch screen device acting as an RFID reader, and methods to produce a capacitive coupling tag. A capacitive coupling tag, which communicates at near field distance with a host computing device by using the touch screen display of the host when the tag is placed on the touch screen or held in contact in close proximity to the touch screen by a person acting as a ground electrode and thereby causing a difference in electrical potential. A capacitive coupling tag which operates with or without a chip. | 10-17-2013 |
20130299589 | LASER-ABLATING MECHANICAL AND SECURITY FEATURES FOR SECURITY DOCUMENTS - Channels may be formed in the inlay substrate of a transponder, such as by laser ablation, and the antenna wire may subsequently be laid in the channels. Laying the wire in a channel ensures that it substantially fully embedded in the substrate, thereby eliminating a need for pressing the wire into the substrate. The channels may be tapered, or profiled, to enhance adhesion of a self-bonding wire. A recess for the chip module can also be formed using laser ablation, and insulation may be removed from end portions of the antenna wire using laser ablation. Laser ablation may also be used to create various mechanical and security features. | 11-14-2013 |
20130299598 | RFID ANTENNA MODULES AND INCREASING COUPLING - A transponder with an antenna module having a chip module and an antenna; a booster antenna having a first antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end, and a second antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end; the inner end of the second antenna structure connected with the outer end of the first antenna structure. The antenna module may be positioned so that its antenna overlaps one of the first antenna structure or the second antenna structure. An antenna module having two additional antenna structures is disclosed. Methods of enhancing coupling are disclosed. | 11-14-2013 |
20140014732 | COUPLING IN AND TO RFID SMART CARDS - A dual interface (DI) smart card ( | 01-16-2014 |
20140059841 | TRANSFERRING AN ANTENNA TO AN RFID INLAY SUBSTRATE - Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites. | 03-06-2014 |
20140060722 | INLAYS FOR SECURITY DOCUMENTS - Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electro-magnetic shielding. Additional security elements may include material that is optically changeable by an electro-magnetic field. Ferrite-containing layers may be incorporated in the inlay substrate. | 03-06-2014 |
20140091149 | DUAL INTERFACE SMART CARDS, AND METHODS OF MANUFACTURING - A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB). | 04-03-2014 |
20140209691 | SELECTIVE DEPOSITION OF MAGNETIC PARTICLES AND USING MAGNETIC MATERIAL AS A CARRIER MEDIUM TO DEPOSIT NANOPARTICLES - Selective deposition of magnetic material such as particles, and producing a pre-laminated stack of shielding layers for offsetting attenuation of RF caused by a metal face plate of a smart card (or tag) or a metallized layer near a passive transponder. Coated or uncoated magnetic particles of different sizes may be used to increase the packing density of the material after its deposition on a substrate. Magnetography-based techniques may be used to apply the particles, at high packing density, including different-sized particles to a substrate such as PVC. Magnetic particles may be used as a carrier medium to deposit other particles nanoparticles. A system for selective deposition is disclosed. | 07-31-2014 |
20140284386 | LASER ABLATING STRUCTURES FOR ANTENNA MODULES FOR DUAL INTERFACE SMARTCARDS - Laser etching antenna structures (AS) for RFID antenna modules (AM). Combining laser etching and chemical etching. Limiting the thickness of the contact pads (CP) to less than the skin depth (18 m) of the conductive material (copper) used for the contact pads (CP). Multiple antenna structures (AS1, AS2) in an antenna module (AM). Incorporating LEDs into the antenna module (AM) or smartcard (SC). | 09-25-2014 |
20140284387 | RFID ANTENNA MODULES AND INCREASING COUPLING - A transponder with an antenna module having a chip module and an antenna; a booster antenna having a first antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end, and a second antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end; the inner end of the second antenna structure connected with the outer end of the first antenna structure. The antenna module may be positioned so that its antenna overlaps one of the first antenna structure or the second antenna structure. An antenna module having two additional antenna structures is disclosed. Methods of enhancing coupling are disclosed. | 09-25-2014 |
20140361086 | SMARTCARD WITH COUPLING FRAME AND METHOD OF INCREASING ACTIVATION DISTANCE OF A TRANSPONDER CHIP MODULE - A conductive coupling frame (CF) having two ends, forming an open loop, disposed surrounding and closely adjacent a transponder chip module (TCM), and substantially coplanar with an antenna structure (AS, LES) in the transponder chip module (TCM). A metal card body (MCB) having a slit (S) extending from a module opening (MO) to a periphery of the card body to function as a coupling frame (CF). The coupling frame (CF) may be thick enough to be non-transparent to RF at frequencies of interest. A switch may be provided to connect ends of the coupling frame (CF) across the slit (S). The transponder chip module (TCM) may comprise a laser-etched antenna structure (LES) and a non-perforated contact pad (CP) arrangement. | 12-11-2014 |
20150021402 | BOOSTER ANTENNA CONFIGURATIONS AND METHODS - A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB). | 01-22-2015 |
20150021403 | SMARTCARD WITH COUPLING FRAME AND METHOD OF INCREASING ACTIVATION DISTANCE OF A TRANSPONDER CHIP MODULE - A conductive coupling frame (CF) having two ends, forming an open loop having two ends or a discontinuous metal layer disposed surrounding and closely adjacent a transponder chip module (TCM, | 01-22-2015 |