Patent application number | Description | Published |
20100244288 | METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR CHIPS USING VARYING AREAS OF PRECISION - A system that fabricates a semiconductor chip. The system places patterns for components which require fine line-widths within a high resolution region of a reticle, wherein the high resolution region provides sharp focus for a given wavelength of light used by the lithography system. At the same time, the system places patterns for components which do not require fine line-widths outside of the high-resolution region of the reticle, thereby utilizing the region outside of the high-resolution region of the reticle instead of avoiding the region. Note that the coarseness for components placed outside of the high resolution region of the reticle is increased to compensate for the loss of optical focus outside of the high resolution region. | 09-30-2010 |
20110018120 | HIGH-BANDWIDTH RAMP-STACK CHIP PACKAGE - A chip package is described. This chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, electrically couples to the exposed pads. For example, the ramp component may be electrically coupled to the semiconductor dies using: microsprings, an anisotropic film, and/or solder. Consequently, the electrical contacts may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique. By removing the need for costly and area-consuming through-silicon vias (TSVs) in the semiconductor dies, the chip package facilitates chips to be stacked in a manner that provides high bandwidth and low cost. | 01-27-2011 |
20110068479 | ASSEMBLY OF MULTI-CHIP MODULES USING SACRIFICIAL FEATURES - A multi-chip module (MCM) is described. This MCM includes two substrates, having facing surfaces, which are mechanically coupled. Disposed on a surface of a first of these substrates, there is a negative feature, which is recessed below this surface. A positive feature in the MCM, which includes an assembly material other than a bulk material in the substrates, at least in part mates with the negative feature. For example, the positive feature may be disposed on the surface of the other substrate. Alternatively, prior to assembly of the MCM, the positive feature may be a separate component from the substrates (such as a micro-sphere). Note that the assembly material has a bulk modulus that is less than a bulk modulus of the material in the substrates. Furthermore, at least a portion of the positive feature may have been sacrificed when the mechanical coupling was established. | 03-24-2011 |
20120056327 | RAMP-STACK CHIP PACKAGE WITH STATIC BENDS - A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, is electrically and mechanically coupled to the exposed pads. For example, the ramp component may be coupled to the semiconductor dies using: solder, microsprings and/or an anisotropic conducting film. Furthermore, each of the semiconductor dies includes a static bend so that an end segment of each of the semiconductor dies is parallel to the direction and is mechanically coupled to the ramp component. These end segments may facilitate high-bandwidth communication of signals between the chips and the ramp component, for example, via proximity communication. | 03-08-2012 |
20120211878 | CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES - In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate. | 08-23-2012 |
20150043168 | Winged Heat Sink - A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board. | 02-12-2015 |
20150068776 | Fire-protection mechanism - A fire-protection mechanism is described. The fire-protection mechanism includes multiple, overlapping cavities that can be filled with water (and, more generally, a fluid). When the fire-protection mechanism is deployed over an object, such as a building, and the cavities are filled with water, the fire-protection mechanism reduces the likelihood that the object is damaged by the heat associated with a fire proximate to the object, such as a wild fire. In particular, the heat capacity and latent heat of the water significantly increase the thermal time constant of the object, thereby reducing the likelihood of combustion. The fire-protection mechanism may include a reflective coating to redirect infrared radiation away from the object to provide further protection. In addition, the water in the cavities may be refilled, as needed, by directing a stream of water onto the fire-protection mechanism and/or through an internal channel in the fire-protection mechanism. | 03-12-2015 |
Patent application number | Description | Published |
20080301298 | Identifying a computing device - A computer architecture for enterprise device applications that provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. The unique identity is independent of a network-address. Security information and a network address may be associated with the unique identity. | 12-04-2008 |
20080301783 | Computer system - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. Telemetry data is communicated between a data producing device and a data receiving device. The telemetry data sent from the data producing device is identified using the identity identifier of the data producing device. | 12-04-2008 |
20090006840 | Using an identity-based communication layer for computing device communication - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. The identity-based communications layer is situated between a network layer and an application layer and transmits a message between two devices identified by a global address. The global address specifies a protocol, a network, and an address meaningful for the combination of the protocol and the network. | 01-01-2009 |
20090006850 | Computer system for authenticating a computing device - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. A communications session is established between two devices using an authentication service that authenticates the device that is initiating the establishment of the communications session with another device. After authenticating the initiating device, the authentication service provides to the initiating device the network address of the other device and an authentication credential for use in the communications session between the initiating device and the other device. | 01-01-2009 |
20090007217 | COMPUTER SYSTEM FOR AUTHENTICATING A COMPUTING DEVICE - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. A communications session is established between two devices using an authentication service that authenticates the device that is initiating the establishment of the communications session with another device. After authenticating the initiating device, the authentication service provides to the initiating device the network address of the other device and an authentication credential for use in the communications session between the initiating device and the other device. | 01-01-2009 |
20090007234 | COMPUTER SYSTEM FOR AUTHENTICATING A COMPUTING DEVICE - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. A communications session is established between two devices using an authentication service that authenticates the device that is initiating the establishment of the communications session with another device. After authenticating the initiating device, the authentication service provides to the initiating device the network address of the other device and an authentication credential for use in the communications session between the initiating device and the other device. | 01-01-2009 |