Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


David C. Douglas

David C. Douglas, Palo Alto, CA US

Patent application numberDescriptionPublished
20100244288METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR CHIPS USING VARYING AREAS OF PRECISION - A system that fabricates a semiconductor chip. The system places patterns for components which require fine line-widths within a high resolution region of a reticle, wherein the high resolution region provides sharp focus for a given wavelength of light used by the lithography system. At the same time, the system places patterns for components which do not require fine line-widths outside of the high-resolution region of the reticle, thereby utilizing the region outside of the high-resolution region of the reticle instead of avoiding the region. Note that the coarseness for components placed outside of the high resolution region of the reticle is increased to compensate for the loss of optical focus outside of the high resolution region.09-30-2010
20110018120HIGH-BANDWIDTH RAMP-STACK CHIP PACKAGE - A chip package is described. This chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, electrically couples to the exposed pads. For example, the ramp component may be electrically coupled to the semiconductor dies using: microsprings, an anisotropic film, and/or solder. Consequently, the electrical contacts may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique. By removing the need for costly and area-consuming through-silicon vias (TSVs) in the semiconductor dies, the chip package facilitates chips to be stacked in a manner that provides high bandwidth and low cost.01-27-2011
20110068479ASSEMBLY OF MULTI-CHIP MODULES USING SACRIFICIAL FEATURES - A multi-chip module (MCM) is described. This MCM includes two substrates, having facing surfaces, which are mechanically coupled. Disposed on a surface of a first of these substrates, there is a negative feature, which is recessed below this surface. A positive feature in the MCM, which includes an assembly material other than a bulk material in the substrates, at least in part mates with the negative feature. For example, the positive feature may be disposed on the surface of the other substrate. Alternatively, prior to assembly of the MCM, the positive feature may be a separate component from the substrates (such as a micro-sphere). Note that the assembly material has a bulk modulus that is less than a bulk modulus of the material in the substrates. Furthermore, at least a portion of the positive feature may have been sacrificed when the mechanical coupling was established.03-24-2011

Patent applications by David C. Douglas, Palo Alto, CA US

David C. Douglas, Concord, MA US

Patent application numberDescriptionPublished
20080301298Identifying a computing device - A computer architecture for enterprise device applications that provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. The unique identity is independent of a network-address. Security information and a network address may be associated with the unique identity.12-04-2008
20080301783Computer system - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. Telemetry data is communicated between a data producing device and a data receiving device. The telemetry data sent from the data producing device is identified using the identity identifier of the data producing device.12-04-2008
20090006840Using an identity-based communication layer for computing device communication - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. The identity-based communications layer is situated between a network layer and an application layer and transmits a message between two devices identified by a global address. The global address specifies a protocol, a network, and an address meaningful for the combination of the protocol and the network.01-01-2009
20090006850Computer system for authenticating a computing device - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. A communications session is established between two devices using an authentication service that authenticates the device that is initiating the establishment of the communications session with another device. After authenticating the initiating device, the authentication service provides to the initiating device the network address of the other device and an authentication credential for use in the communications session between the initiating device and the other device.01-01-2009
20090007217COMPUTER SYSTEM FOR AUTHENTICATING A COMPUTING DEVICE - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. A communications session is established between two devices using an authentication service that authenticates the device that is initiating the establishment of the communications session with another device. After authenticating the initiating device, the authentication service provides to the initiating device the network address of the other device and an authentication credential for use in the communications session between the initiating device and the other device.01-01-2009
20090007234COMPUTER SYSTEM FOR AUTHENTICATING A COMPUTING DEVICE - A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. A communications session is established between two devices using an authentication service that authenticates the device that is initiating the establishment of the communications session with another device. After authenticating the initiating device, the authentication service provides to the initiating device the network address of the other device and an authentication credential for use in the communications session between the initiating device and the other device.01-01-2009

Patent applications by David C. Douglas, Concord, MA US