Patent application number | Description | Published |
20120033373 | RADIAL OPTICAL DATA INTERCHANGE PACKAGING - A radial optical data interchange packaging comprises a central core; a plurality of central core photo transceivers emerging from an exterior side surface of the central core; a mother board coupled to the central core, wherein the mother board is perpendicularly oriented below and abutting the central core; a plurality of retention slots on the mother board, wherein the retention slots radially extend away from the central core; and a plurality of cards held by the retention slots, wherein each of the plurality of cards comprises a set of card photo transceivers that optically communicate with the central core photo transceivers. | 02-09-2012 |
20120188742 | IMPLEMENTING SURFACE MOUNT COMPONENTS WITH SYMMETRIC REFERENCE BALANCE - A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure. | 07-26-2012 |
20130048371 | IMPLEMENTING ADJUSTABLE SIZE FERRITE CORE FOR EMI CABLE NOISE SUPPRESSION - A method and structures for implementing an adjustable size ferrite core for electromagnetic interference (EMI) cable noise suppression. A plurality of ferrite core segments are mated together defining an adjustable size cable receiving cavity. Each of the ferrite core segments includes an inner wall portion with mating fingers extending along adjoining edges. The mating fingers are selectively positioned together to select a size of the adjustable cable receiving cavity. | 02-28-2013 |
20130094170 | ELECTROMAGNETIC INTERFERENCE SHIELD - An electromagnetic interference (EMI) shield that increases the airflow through the EMI shield while preventing line-of-sight openings through the EMI shield. Two plates are coupled together. Each of the respective plates has a raised component with an aperture therethrough to provide a path through the plate. The raised component is preferably scoop-shaped with the aperture at one end and an opposite end tapering into the respective plate. At least a portion of one of the raised components overlaps at least a portion of the other of the raised components when the plates are coupled together to form a path through the plates, while the plates are coupled together. Line-of-sight openings through the plates, to an electronic device protected by the EMI shield, are at least partially prevented by the raised components. | 04-18-2013 |
20140120750 | IMPLEMENTING RECONFIGURABLE POWER CONNECTOR FOR MULTIPLE WIRING CONFIGURATIONS - A method and structures are provided for implementing a reconfigurable power connector for multiple wiring configurations. The reconfigurable power connector optionally is configured to connect to either a 4-wire delta (Δ) or a 5-wire wye (Y). The reconfigurable power connector includes a fifth pin that is moveable between a retracted position in the 4-wire delta (Δ) configuration and an extended position in the 5-wire wye (Y) configuration. | 05-01-2014 |
20140140001 | VARIABLE THICKNESS EMI SHIELD WITH VARIABLE COOLING CHANNEL SIZE - An EMI shield for an electronic system enclosure is disclosed. The EMI shield may include an electrically conductive panel with a plurality of air ventilation channels, which has an upstream airflow side and a downstream airflow side. The EMI shield may also include a first air ventilation channel with a first cross-sectional shape having a first cross-sectional area and a first depth. The EMI shield may further include a second air ventilation channel with a second cross-sectional shape, having a cross-sectional area greater than the first cross-sectional area, and a second depth larger than the first depth. | 05-22-2014 |
20140140007 | HEAT SINK STRUCTURE WITH RADIO FREQUENCY ABSORPTION - According to embodiments of the invention, a heat sink structure may be provided. The heat sink structure may include a first surface adapted to connect to an electronic component. The heat sink structure may also include a second surface adapted to provide heat transfer. The heat sink structure may also include a coating of radio-frequency absorbing material covering at least a portion of the second surface. | 05-22-2014 |
20140182923 | MULTIPLE-LAYERED ELECTROMAGNETIC SHIELDING - An apparatus for electromagnetic compatibility (EMC) shielding, the apparatus comprising a first EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. A second EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. The first EMC shield coupled to the second EMC shield, wherein at least one finger element of the plurality of finger elements of the first EMC shield is situated between at least two finger elements of the plurality of finger elements of the second EMC shield and in parallel with the at least two finger elements such that a space is formed between the at least one finger element and at least one of the at least two finger elements. | 07-03-2014 |