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Date, Tokyo

Atsushi Date, Tokyo JP

Patent application numberDescriptionPublished
20090296117IMAGE-PROCESSING APPARATUS, METHOD FOR CONTROLLING THEREOF, AND COMPUTER PROGRAM - An image-processing apparatus is provided. The apparatus includes a determining unit determining a type of image data; a holding unit holding color value for the still images, and holding a ratio for the moving image for each moving image, an updating unit updating the color value and the ratio, and a display unit displaying composite image data. For each piece of image data to be drawn, the updating unit updates each ratio based on a transmittance of the image data, updates the color value and a transmittance of a still image when it is a still image, and updates the color value data based on a transmittance of a moving image, and causes the transmittance to be further held as a ratio of the moving image when it is a moving image. The display unit displays the composite image data using the color value and the ratio.12-03-2009
20100002014IMAGE PROCESSING APPARATUS AND CONTROL METHOD THEREOF - An image processing apparatus and its control method receives a drawing command including a moving image drawing command and a graphics drawing command and performs drawing processing. A drawing command is received, and the moving image drawing command is separated from the graphics drawing command. A graphics drawing unit obtains the result of graphics drawing in accordance with the graphics drawing command. A moving image drawing unit generates moving image data processed in accordance with the moving image drawing command. A composition unit composes the result of graphics drawing by the graphics drawing unit with the moving image data generated by the moving image drawing unit.01-07-2010
20110025708IMAGE PROCESSING APPARATUS AND CONTROL METHOD THEREOF - According to an image processing apparatus and a control method thereof of the present invention, a graphics drawing result is obtained in accordance with one or more graphics drawing commands included in drawing commands, a clipping command is generated from one or more moving image drawing commands included in the drawing commands, and clipped graphics is obtained by clipping the graphics drawing result using the clipping command. Further, moving image data processed in accordance with the one or more moving image drawing commands included in the drawing commands is generated, and the generated moving image data and the clipped graphics are composed and output.02-03-2011

Patent applications by Atsushi Date, Tokyo JP

Hiroki Date, Tokyo JP

Patent application numberDescriptionPublished
20100075508METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - A dielectric insulating film including HfO or the like is formed by: cleaning a surface of a semiconductor substrate by exposing the substrate surface to a fluorine radical; performing hydrogen termination processing with a fluorine radical or a hydride (SiH03-25-2010
20100144127METHOD FOR REDUCING AGGLOMERATION OF Si LAYER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND VACUUM TREATMENT APPARATUS - The present invention provides a method for reducing the agglomeration of a Si layer in an SOI substrate, which can prevent the agglomeration of the Si layer from occurring in a heating and temperature-raising process for the Si layer, when heating and temperature-raising the Si layer that is the outermost surface of the SOI substrate and is in an exposed state, and can prevent the agglomeration further without forming a protective film on the SOI substrate. The method for reducing the agglomeration of the Si layer in the SOI substrate is a method of supplying a hydride gas in a heating and temperature-raising process for the Si layer, when heating and temperature-raising the Si layer which is in an exposed state in the SOI substrate that has an insulation layer and the Si layer sequentially stacked on a Si substrate. In this method, the hydride gas dissociates before the Si layer coheres, at a temperature at which the Si layer does not yet start agglomeration, and terminates a dangling bond of the Si layer with a predetermined atom such as H.06-10-2010

Hiromitsu Date, Tokyo JP

Patent application numberDescriptionPublished
20100119867PLATED STEEL SHEET FOR CANS AND PRODUCTION METHOD THEREOF - A plated steel sheet for cans with excellent secondary adhesion of an organic film and high corrosion resistance is provided, that is, a plated steel sheet for cans, which is a plated steel sheet having a alloy tin layer and a metallic tin layer in sequence from the steel sheet side, wherein a chemical conversion layer comprising tin oxide in an amount of 0.3 to 5.0 mC/cm05-13-2010
20100310898PLATED STEEL SHEET FOR CANS AND METHOD FOR PRODUCTION OF THE SAME - Plated steel sheet comprised of steel sheet having a tin alloy layer on it, which is characterized by (i) having free tin distributed on the tin alloy layer in a 5 to 97% area rate and further (ii) having a chemically treated layer having phosphate in an amount of 1.0 to 5.0 mg/m12-09-2010

Masakazu Date, Tokyo JP

Patent application numberDescriptionPublished
20090079794LIQUID EJECTING APPARATUS - In a liquid ejecting apparatus using the electrostatic attraction method or electric field assist method, a liquid ejecting apparatus where discharging of a nozzle plate is securely performed and appropriate liquid ejecting is possible is provide. The liquid ejecting apparatus is provided with an electrode; a liquid ejecting head, having, a nozzle plate including a nozzle opposed to the counter electrode to eject liquid, a pressure generating device to rise a meniscus of liquid at a ejecting port of the nozzle, and a charging electrode opposed to the counter electrode via the nozzle plate, an electrostatic voltage applying device to apply electrostatic voltage onto the liquid in the nozzle; a discharging device to discharge the charged nozzle plate; and a control device to control the electrostatic voltage applying device and the discharging device; wherein the discharging device provides a conductive discharging member detachable to an whole area of the nozzle plate opposed to the counter electrode.03-26-2009

Patent applications by Masakazu Date, Tokyo JP

Misao Date, Tokyo JP

Patent application numberDescriptionPublished
20090186557Method of operating substrate processing apparatus and substrate processing apparatus - A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.07-23-2009

Munehiro Date, Tokyo JP

Patent application numberDescriptionPublished
20090217749ACOUSTIC CAPACITY, VOLUME, AND SURFACE AREA MEASUREMENT METHOD - The present invention provides an acoustic capacity measurement method for finding capacity of a container or object by removing effect of the surface area without using an approximate expression of acoustic impedance.09-03-2009