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| 20080248596 | Method of making a circuitized substrate having at least one capacitor therein - A method of making a circuitized substrate which includes at least one and possibly several capacitors as part thereof. In one embodiment, the substrate is produced by forming a layer of capacitive dielectric material on a dielectric layer and thereafter forming channels with the capacitive material, e.g., using a laser. The channels are then filled with conductive material, e.g., copper, using selected deposition techniques, e.g., sputtering, electro-less plating and electroplating. A second dielectric layer is then formed atop the capacitor and a capacitor “core” results. This “core” may then be combined with other dielectric and conductive layers to form a larger, multilayered PCB or chip carrier. In an alternative approach, the capacitive dielectric material may be photo-imageable, with the channels being formed using conventional exposure and development processing known in the art. In still another embodiment, at least two spaced-apart conductors may be formed within a metal layer deposited on a dielectric layer, these conductors defining a channel there-between. The capacitive dielectric material may then be deposited (e.g., using lamination) within the channels. | 10-09-2008 |
| 20100060381 | Mulit-layer embedded capacitance and resistance substrate core - A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser. | 03-11-2010 |
| 20100167210 | MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE - A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser. | 07-01-2010 |
| 20110039212 | Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate - A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided. | 02-17-2011 |
| 20110043987 | METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH RESISTOR INCLUDING MATERIAL WITH METAL COMPONENT AND ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE - A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided. | 02-24-2011 |
| 20120015532 | HIGH DENSITY DECAL AND METHOD FOR ATTACHING SAME - A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal. | 01-19-2012 |
| 20120017437 | CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE - A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto. | 01-26-2012 |
| 20120031649 | CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging. | 02-09-2012 |
| 20120068326 | ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS - A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling. | 03-22-2012 |
| 20120069531 | CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS - A conducting paste and method of forming the paste for device level interconnection. The conducting paste contains metal loading in the range 80-95% that is useful for making five micron device level interconnects. The conducting paste is made by mixing two different conducting pastes, each paste maintaining its micro level individual rich region in the mixed paste even after final curing. One paste contains at least one low melting point alloy and the other paste contains noble metal fillers such as gold or silver flakes. In general, average flake size below five micron is suitable for five micron interconnects. However, 1 micron or smaller silver flakes and an LMP mixture is preferred for five micron interconnects. The amount of LMP based paste in the final mixture is preferably 20-50% by weight. The nano micro paste embodiment shows good electrical yield (81%) and low contact resistance. | 03-22-2012 |
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| 20080221858 | Dynamic Online Multi-Parameter Optimization System and Method for Autonomic Computing Systems - An improved method and system for performing dynamic online multi-parameter optimization for autonomic computing systems are provided. With the method and system of the present invention, a simplex, i.e. a set of points in the parameter space that has been directly sampled, is maintained. The system's performance with regard to a particular utility value is measured for the particular setting of configuration parameters associated with each point in the simplex. A new sample point is determined using the geometric transformations of the simplex. The method and system provide mechanisms for limiting the size of the simplex that is generated through these geometric transformations so that the present invention may be implemented in noisy environments in which the same configuration settings may lead to different results with regard to the utility value. In addition, mechanisms are provided for resampling a current best point in the simplex to determine if the environment has changed. If a sufficiently different utility value is obtained from a previously sampled utility value for the point in the simplex, then rather than contracting, the simplex is expanded. If the difference between utility values is not sufficient enough, then contraction of the simplex is performed. In addition, in order to allow for both real and integer valued parameters in the simplex, a mechanism is provided by which invalid valued parameters that are generated by geometric transformations being performed on the simplex are mapped to a nearest valid value. Similarly, parameter values that violate constraints are mapped to values that satisfy constraints taking care that the dimensionality of the simplex is not reduced. | 09-11-2008 |
| 20080263559 | METHOD AND APPARATUS FOR UTILITY-BASED DYNAMIC RESOURCE ALLOCATION IN A DISTRIBUTED COMPUTING SYSTEM - In one embodiment, the present invention is a method for allocation of finite computational resources amongst multiple entities, wherein the method is structured to optimize the business value of an enterprise providing computational services. One embodiment of the inventive method involves establishing, for each entity, a service level utility indicative of how much business value is obtained for a given level of computational system performance. The service-level utility for each entity is transformed into a corresponding resource-level utility indicative of how much business value may be obtained for a given set or amount of resources allocated to the entity. The resource-level utilities for each entity are aggregated, and new resource allocations are determined and executed based upon the resource-level utility information. The invention is thereby capable of making rapid allocation decisions, according to time-varying need or value of the resources by each of the entities. | 10-23-2008 |
| 20090012922 | METHOD AND APPARATUS FOR REWARD-BASED LEARNING OF IMPROVED SYSTEMS MANAGEMENT POLICIES - In one embodiment, the present invention is a method for reward-based learning of improved systems management policies. One embodiment of the inventive method involves supplying a first policy and a reward mechanism. The first policy maps states of at least one component of a data processing system to selected management actions, while the reward mechanism generates numerical measures of value responsive to particular actions (e.g., management actions) performed in particular states of the component(s). The first policy and the reward mechanism are applied to the component(s), and results achieved through this application (e.g., observations of corresponding states, actions and rewards) are processed in accordance with reward-based learning to derive a second policy having improved performance relative to the first policy in at least one state of the component(s). | 01-08-2009 |
| 20110230229 | Social Recommender System for Generating Dialogues Based on Similar Prior Dialogues from a Group of Users - Techniques for organizing information in a user-interactive system based on user interest are provided. In one aspect, a method for operating a system having a plurality of resources through which a user can navigate is provided. The method includes the following steps. When the user accesses the system, the resources are presented to the user in a particular order. Interests of the user in the resources presented are determined. The interests of the user are compared to interests of other users to find one or more subsets of users to which the user belongs by virtue of having similar interests. Upon one or more subsequent accesses to the system by the user, the order in which the resources are presented to the user is based on interests common to the one or more subsets of users to which the user belongs. | 09-22-2011 |
