| Patent application number | Description | Published |
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| 20080289167 | METHODS AND APPARATUS FOR ASSEMBLING AND OPERATING ELECTRONIC DEVICE MANUFACTURING SYSTEMS - A method for operating one or more electronic device manufacturing systems is provided, including the steps 1) performing a series of electronic device manufacturing process steps with a process tool, wherein the process tool produces effluent as a byproduct of performing the series of process steps; 2) abating the effluent with an abatement tool; 3) supplying an abatement resource to the abatement tool from a first abatement resource supply; 4) changing an abatement resource supply from the first abatement resource supply to a second abatement resource supply, wherein changing the abatement resource supply comprises: i) interrupting a flow of the abatement resource from the first abatement resource supply; and ii) beginning a flow of the abatement resource from the second abatement resource supply; and 5) continuing to perform the series of process steps with the process tool, while changing, and after changing, the abatement resource supply. | 11-27-2008 |
| 20080290041 | METHODS AND APPARATUS FOR EFFICIENT OPERATION OF AN ABATEMENT SYSTEM - A method of operating an electronic device manufacturing system is provided which includes the steps of receiving information with an interface, wherein the information relates to an abatement system, and shutting down a process tool and an abatement tool in response to the information. | 11-27-2008 |
| 20080310975 | METHODS AND APPARATUS FOR A COGENERATION ABATEMENT SYSTEM FOR ELECTRONIC DEVICE MANUFACTURING - The present invention provides systems, methods, and apparatus for abating effluent from an electronic device manufacturing system using cogeneration. The invention includes a pump adapted to couple to a processing chamber and adapted to draw effluent from the processing chamber; a reaction chamber coupled to the pump and adapted to receive the effluent from the pump; and a turbine coupled to the reaction chamber and adapted to be driven by combustion gases from the reaction chamber. The turbine is adapted to generate power which is applied to operate the pump. Numerous additional aspects are disclosed. | 12-18-2008 |
| 20090017206 | METHODS AND APPARATUS FOR REDUCING THE CONSUMPTION OF REAGENTS IN ELECTRONIC DEVICE MANUFACTURING PROCESSES - A substrate coating system is provided which includes a substrate coating chamber; a gas box connected to the coating chamber and adapted to provide reagent gases to the coating chamber; and a reagent reclaim system connected to the substrate coating chamber and the gas box, wherein the reagent reclaim system includes a wet scrubber connected to the coating chamber; a polisher connected to the wet scrubber; and a dryer connected to the polisher and the gas box. | 01-15-2009 |
| 20090018688 | METHODS AND SYSTEMS FOR DESIGNING AND VALIDATING OPERATION OF ABATEMENT SYSTEMS - A method of developing an integrated abatement system is provided, including the steps: a) determining whether an integrated abatement system meets a destruction removal efficiency standard wherein the determination includes the steps: i) operating an electronic device manufacturing process tool using a best known method, whereby effluent containing a target species is produced; ii) abating the target species to form abated effluent, using an abatement system which is coupled to the process tool; and iii) calculating a destruction removal efficiency for the target species; and b) modifying the abatement system by altering at least one of a design parameter and an operating parameter of the abatement system to improve the destruction removal efficiency. Numerous other aspects are provided. | 01-15-2009 |
| 20090098492 | METHODS AND APPARATUS FOR STARTING AND OPERATING A THERMAL ABATEMENT SYSTEM - A flame sensor apparatus for use with a flame heated thermal abatement reactor is provided, including a flame sensor adapted to sense a flame within the thermal abatement reactor; and a shutter adapted to selectively block the transmission of radiation from the flame to the flame sensor. | 04-16-2009 |
| 20090110622 | METHODS AND APPARATUS FOR SMART ABATEMENT USING AN IMPROVED FUEL CIRCUIT - A method for abating effluent from an electronic device manufacturing process is provided, including abating the effluent in a thermal abatement tool to form abated effluent; determining whether the abated effluent contains one or more chemical species of interest; and changing one or more operating parameters of the thermal abatement tool based upon the determination. Numerous other embodiments are provided. | 04-30-2009 |
| 20090148339 | APPARATUS AND METHODS FOR REDUCING RESTRICTIONS TO AIR FLOW IN AN ABATEMENT SYSTEM - An abatement system is provided, including an abatement unit adapted to abate effluent using ambient air; and an ambient air delivery system in fluid communication with the abatement unit and adapted to deliver ambient air to the abatement unit; wherein the ambient air delivery system allows sufficient ambient air to flow into the abatement unit to abate the effluent without compressed air. Numerous other aspects are provided. | 06-11-2009 |
| 20090214991 | APPARATUS AND METHODS FOR SUPPLYING FUEL EMPLOYED BY ABATEMENT SYSTEMS TO EFFECTIVELY ABATE EFFLUENTS - An abatement apparatus for introducing fuel into an electronic device manufacturing effluent abatement tool, including: a manifold; a fuel source adapted to supply fuel to the manifold through a fuel conduit; and a plurality of nozzles adapted to receive fuel from the manifold; wherein the manifold is adapted to supply fuel to the nozzles at a fuel velocity greater than a flame velocity. | 08-27-2009 |
| 20090216061 | SYSTEMS AND METHODS FOR TREATING FLAMMABLE EFFLUENT GASES FROM MANUFACTURING PROCESSES - A system for treating flammable effluent gas is provided. The system includes an exhaust conduit to carry the flammable effluent gas to an abatement unit, a control system coupled to the abatement unit to determine an operating parameter of the abatement unit, a bypass valve coupled to the exhaust conduit which is an operative responsive to the monitoring system, and a source of second gas to be mixed with the effluent gas diverted from the abatement unit when the bypass valve is operating in a bypass mode to provide a mixed gas having a flammability lower than the effluent gas. Methods of the invention as well as numerous other aspects are provided. | 08-27-2009 |
| 20090222128 | METHODS AND APPARATUS FOR OPERATING AN ELECTRONIC DEVICE MANUFACTURING SYSTEM - Methods and apparatus for efficiently operating an electronic device manufacturing system are provided. In one aspect, an electronic device manufacturing system is provided, including: a process tool; a process tool controller linked to the process tool, wherein the process tool controller is adapted to control the process tool; a first sub-fab auxiliary system linked to the process tool controller; wherein the first sub-fab auxiliary system is adapted to operate in a first operating mode and a second operating mode; and wherein the process tool controller is adapted to cause the first sub-fab auxiliary system to change from the first operating mode to the second operating mode. | 09-03-2009 |
| 20090238972 | METHODS AND APPARATUS FOR USING REDUCED PURITY SILANE TO DEPOSIT SILICON - In one aspect, a method of forming a silicon layer on a substrate is provided, including the steps providing a substrate; and introducing hydrogen and silane into a chamber containing the substrate such that a layer of silicon is deposited on the substrate; wherein the silane is less than about 99.999% pure. Numerous other aspects are provided. | 09-24-2009 |
| 20090246105 | METHODS AND APPARATUS FOR CONSERVING ELECTRONIC DEVICE MANUFACTURING RESOURCES - A method for operating an electronic device manufacturing system is provided, including: introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode; and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a clean mode. Numerous other embodiments are provided. | 10-01-2009 |
| 20090252664 | METHODS AND APPARATUS FOR HEATING REAGENTS AND EFFLUENTS IN ABATEMENT SYSTEMS - In some aspects, an apparatus for abating effluent from an electronic device manufacturing process tool is provided, including: a reaction chamber adapted to receive an effluent; and a reagent heating apparatus in fluid connection with the reaction chamber; wherein the reagent heating apparatus is adapted to heat a reagent and to introduce the heated reagent into a heated reagent reaction zone of the reaction chamber; and wherein the reaction chamber is further adapted to mix the effluent and the heated reagent in the heated reagent reaction zone. Other apparatus and methods are disclosed. | 10-08-2009 |
| 20100008838 | METHODS AND APPARATUS FOR ABATING ELECTRONIC DEVICE MANUFACTURING PROCESS EFFLUENT - A thermal abatement system is provided, including: a thermal abatement reactor; an inlet in fluid communication with the reactor; a process chamber in fluid communication with the inlet; a first sheathing fluid source in fluid communication with the inlet; a first flow control device, adapted to regulate a flow of a first sheathing fluid from the first sheathing fluid source; and a controller, in signal communication with the first flow control device, adapted to regulate the sheathing fluid by operating the first flow control device; wherein the inlet is adapted to receive an effluent stream from the process chamber and the first sheathing fluid from the first sheathing fluid source, to sheathe the effluent stream with the first sheathing fluid to form a sheathed effluent stream, and to introduce the sheathed effluent stream into the reactor. | 01-14-2010 |
| 20100096110 | METHODS AND APPARATUS FOR RECOVERING HEAT FROM PROCESSING SYSTEMS - Methods and apparatus for recovering heat from disposed effluents are disclosed herein. In some embodiments, an apparatus may include a first process chamber configured for gaseous or liquid processes; a second process chamber configured for liquid processes; and a heat pump having a compressor and a first heat exchanger, wherein the compressor is configured to use a first effluent exhausted from the first process chamber and wherein the first heat exchanger having first and second sides configured to transfer heat therebetween, wherein the first side is configured to flow a liquid reagent therethrough and into the second process chamber, and wherein the second side is configured to flow the pressurized first effluent from the first process chamber therethrough. In some embodiments, a heater may be disposed between the heat pump and the second process chamber to further heat the liquid reagent prior to entering the second process chamber. | 04-22-2010 |
| 20100119420 | ABATEMENT SYSTEM HAVING ENHANCED EFFLUENT SCRUB AND MOISTURE CONTROL - Apparatus for improved treatment of effluents are provided herein. In some embodiments, an abatement system may include an exhaust conduit to flow an effluent stream therethrough; a plurality of packed beds disposed in the exhaust conduit to remove non-exhaustible effluents from the effluent stream; one or more spray jets to provide an effluent treating agent between adjacent packed beds, the effluent treating agent to remove non-exhaustible effluents from the effluent stream; and a dripper disposed in the exhaust conduit above an uppermost packed bed to provide the effluent treating agent in large droplets to wet and rinse particulate from an upper surface of the uppermost packed bed substantially without forming fine droplets. | 05-13-2010 |
| 20100126854 | SPUTTERING TARGET - Embodiments of the present invention generally include a sputtering target capable of substantially reducing the amount of wasted material associated with conventional sputtering targets. In one embodiment, the sputtering target includes a fluidized bed of sputtering material that constantly maintains a planar sputtering surface throughout the sputtering process. In one embodiment, the fluidized bed of sputtering material is either periodically or constantly supplied with sputtering material to both maintain a planar sputtering surface and reduce downtime of the sputtering equipment. | 05-27-2010 |
| 20100192773 | ABATEMENT APPARATUS WITH SCRUBBER CONDUIT - Embodiments of an abatement apparatus are disclosed herein. In some embodiments, an abatement apparatus may include a scrubber configured to receive an effluent stream from a process chamber and further configured to remove first particles from the effluent stream; a scrubber conduit coupled to the scrubber to receive the effluent stream therefrom and configured to remove second particles from the effluent stream, the scrubber conduit having one or more inlets configured to provide a fluid to sufficiently wet an interior surface of the scrubber conduit to trap the second particles thereon and to wash the second particles therealong; and a central scrubber coupled to the scrubber via the scrubber conduit. In some embodiments, the scrubber conduit is downward sloping from the scrubber to the central scrubber. In some embodiments, a plurality of scrubbers may be coupled to the central scrubber via a plurality of scrubber conduits. | 08-05-2010 |
| 20100258510 | METHODS AND APPARATUS FOR TREATING EFFLUENT - Methods and apparatus for treating effluents in process systems are provided In some embodiments, a system for treating effluent includes a process chamber having a processing volume; an exhaust conduit coupled to the process chamber to remove an effluent from the processing volume; and a reactive species generator coupled to the exhaust conduit to inject a reactive species into the exhaust conduit to treat the effluent, wherein the reactive species generator generates a reactive species comprising at least one of singlet hydrogen, hydrogen ions or hydrogen radicals. In some embodiments, a method for treating effluent includes flowing an effluent from a processing volume of a process system through an exhaust conduit fluidly coupled to the processing volume; treating the effluent in the exhaust conduit with a reactive species comprising at least one of singlet hydrogen, hydrogen ions, or hydrogen radicals; and flowing the treated effluent to an abatement system. | 10-14-2010 |
| 20110023908 | METHODS AND APPARATUS FOR PROCESS ABATEMENT WITH RECOVERY AND REUSE OF ABATEMENT EFFLUENT - Methods and apparatus for recovering hydrogen fluoride (HF) are provided herein. In some embodiments, an apparatus includes a system for processing substrates, including a process chamber for processing a substrate; a fluorine generator coupled to the process chamber to provide fluorine (F | 02-03-2011 |
| 20110070811 | POINT OF USE RECYCLING SYSTEM FOR CMP SLURRY - The present invention generally relates to apparatus and method for recycling both polishing slurry and rinse water from CMP processes. The present invention also relates to rheology measurements and agglomeration prevention using centrifugal pumps. | 03-24-2011 |
| 20110121649 | ENERGY SAVINGS BASED ON POWER FACTOR CORRECTION - Methods and apparatus for enhanced control over electronic device manufacturing systems are provided herein. In some embodiments, an integrated sub-fab system in accordance with the present invention may be provided with fixed or real time power factor management, correction, reporting, and tabulation. Such a system could also be used by any industry consuming significant levels of power. The integrated sub-fab system power management could be extended to other parts of the factory where high levels of power are used. | 05-26-2011 |
| 20110135552 | METHODS AND APPARATUS FOR TREATING EXHAUST GAS IN A PROCESSING SYSTEM - Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, an apparatus for treating an exhaust gas in a foreline of a substrate processing system includes a plasma source coupled to a foreline of a process chamber, a reagent source coupled to the foreline upstream of the plasma source, and a foreline gas injection kit coupled to the foreline to controllably deliver a gas to the foreline, wherein the foreline injection kit includes a pressure regulator to set a foreline gas delivery pressure setpoint, and a first pressure gauge coupled to monitor a delivery pressure of the gas upstream of the foreline. | 06-09-2011 |
| 20110144791 | ENERGY SAVINGS AND GLOBAL GAS EMISSIONS MONITORING - Methods and apparatus for enhanced control, monitoring and recording of incoming chemical and power use, and emissions of electronic device manufacturing systems are provided. In some embodiments, integrated sub-fab system systems may monitor the energy usage of the sub-fab equipment. The tool can enter many different depths of energy savings modes such as idle (shallow energy savings where production equipment can recover to normal production with no quality or throughput impact in seconds), sleep (deeper energy savings where production equipment can recover in minutes), or hibernate (where production equipment may require hours to recover not to have impact on quality, or throughput) for the system. In some embodiments, the system may monitor and display all gas emissions in a sub-fab as well as the Semi S23 method reporting of CO | 06-16-2011 |
