Patent application number | Description | Published |
20120299170 | Module and Method of Manufacturing a Module - A module and a method for manufacturing a module are disclosed. An embodiment of a module comprises a first semiconductor device, a frame arranged on the first semiconductor device, the frame comprising a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity. | 11-29-2012 |
20130154868 | System and Method for an RF Receiver - In accordance with an embodiment, a radio-frequency (RF) front-end for a radio configured to receive an RF signal at a first frequency includes an antenna port configured to be coupled to an antenna, and a notch filter having an input coupled to the antenna port. The notch filter is configured to reject one or more frequencies, such that the first frequency is a harmonic or intermodulation distortion product of the one or more frequencies. The RF front-end also includes a piezoelectric filter having an input coupled to an output of the notch filter and an output configured to be coupled to an RF amplifier. The piezoelectric filter has a pass band comprising the first frequency. | 06-20-2013 |
20140015614 | System and Method for a Low Noise Amplifier - In accordance with an embodiment, a low noise amplifier (LNA) includes a transistor, and a transformer having a first winding coupled between a LNA input terminal and a control node of the transistor, and a second winding magnetically coupled to the first winding coupled between a reference node of the transistor and a LNA reference terminal. An output of the LNA is coupled to an output node of the transistor. | 01-16-2014 |
20140231974 | Module and Method of Manufacturing a Module - A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity. | 08-21-2014 |
20140332936 | PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME - In various embodiments, a package arrangement may be provided. The package arrangement may include at least one chip. The package arrangement may further include encapsulation material at least partially encapsulating the chip. The package arrangement may also include a redistribution structure over a first side of the chip. The package arrangement may further include a metal structure over a second side of the chip. The second side may be opposite the first side. The package arrangement may additionally include at least one of a semiconductor structure and an electrically conductive plastic material structure electrically coupled to the redistribution structure and the metal structure to form a current path between the redistribution structure and the metal structure. | 11-13-2014 |
20150200437 | System and Method for a Directional Coupler - In accordance with an embodiment, a circuit includes a current sensing circuit comprising a current input terminal coupled to an input port, a current output terminal coupled to a transmitted port, and a current sensing output terminal configured to provide a current sensing signal proportional to a current flowing between the current input terminal and the current output terminal. The circuit further includes a voltage sensing circuit having a voltage input terminal coupled to the transmitted port and a voltage sensing output terminal configured to provide a voltage sensing signal proportional to a voltage at the transmitted port. A combining circuit has a first input coupled to the current sensing output terminal, a second input coupled to the voltage sensing output terminal, and a combined output node coupled to an output port. | 07-16-2015 |
20150261708 | Connectivity of Slave Devices in Mobile Devices - In accordance with an embodiment of the present invention, a chip set for a mobile device includes a slave device chip and an interface circuit chip that includes a slave bus interface for controlling the slave device chip through an analog bus. The slave bus interface is coupled to a master bus interface via a digital bus of the mobile device. The slave bus interface is configured to be driven by the master bus interface. | 09-17-2015 |
20150280654 | System and Method for a Low Noise Amplifier - An embodiment described herein includes a low noise amplifier (LNA) including a plurality of separate input terminals, a plurality of transistors, and an output network coupled to a first reference terminal and a single output of the LNA. Each transistor includes a conduction path and a control terminal coupled to one of the plurality of separate input terminals. The output network is also coupled to the conduction path of each of the plurality of transistors. | 10-01-2015 |