Daniël
Daniël De Zutter, Eeklo BE
Patent application number | Description | Published |
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20100280801 | METHOD AND DEVICE FOR GENERATING A MODEL OF A MULTIPARAMETER SYSTEM - The present invention relates to a method ( | 11-04-2010 |
Daniël De Zutter, Eeklo BE
Patent application number | Description | Published |
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20100280801 | METHOD AND DEVICE FOR GENERATING A MODEL OF A MULTIPARAMETER SYSTEM - The present invention relates to a method ( | 11-04-2010 |
Daniël Nelis, Peer BE
Patent application number | Description | Published |
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20110045745 | Doped Ceria Abrasives with Controlled Morphology and Preparation Thereof - The present invention relates to doped ceria (CeO2) abrasive particles, having an essentially octahedral morphology. Such abrasives are used in water-based slurries for Chemical Mechanical Polishing (CMP) of subrates such as silicon wafers. The invention more particularly concerns yttrium-doped ceria particles having a specific surface area of 10 to 120 m2/g, characterized in that at least 95 wt %, preferably at least 99 wt %, of the particles are mono-crystalline and in that the particles' surfaces consist of more than 70%, preferably of more than 80%, of planes parallel to {111} planes. A novel gas phase process for synthesizing this product is also disclosed, comprising the steps of providing a hot gas stream, —and, introducing into said gas stream a cerium-bearing reactant, a dopant-bearing reactant, and an oxygen-bearing reactant, —the temperature of said gas stream being chosen so as to atomize said reactant, the reactant being selected so as to form, upon cooling, doped ceria particles. Abrasive slurries based on the above ceria offer a low level of induced detectivity in the polished substrate, while ensuring a good removal rate. | 02-24-2011 |
20130136986 | Submicron Sized Silicon Powder with Low Oxygen Content - A submicron sized Si based powder having an average primary particle size between 20 nm and 200 nm, wherein the powder has a surface layer comprising SiO | 05-30-2013 |
Daniël Nelis, Peer BE
Patent application number | Description | Published |
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20110045745 | Doped Ceria Abrasives with Controlled Morphology and Preparation Thereof - The present invention relates to doped ceria (CeO2) abrasive particles, having an essentially octahedral morphology. Such abrasives are used in water-based slurries for Chemical Mechanical Polishing (CMP) of subrates such as silicon wafers. The invention more particularly concerns yttrium-doped ceria particles having a specific surface area of 10 to 120 m2/g, characterized in that at least 95 wt %, preferably at least 99 wt %, of the particles are mono-crystalline and in that the particles' surfaces consist of more than 70%, preferably of more than 80%, of planes parallel to {111} planes. A novel gas phase process for synthesizing this product is also disclosed, comprising the steps of providing a hot gas stream, —and, introducing into said gas stream a cerium-bearing reactant, a dopant-bearing reactant, and an oxygen-bearing reactant, —the temperature of said gas stream being chosen so as to atomize said reactant, the reactant being selected so as to form, upon cooling, doped ceria particles. Abrasive slurries based on the above ceria offer a low level of induced detectivity in the polished substrate, while ensuring a good removal rate. | 02-24-2011 |
20130136986 | Submicron Sized Silicon Powder with Low Oxygen Content - A submicron sized Si based powder having an average primary particle size between 20 nm and 200 nm, wherein the powder has a surface layer comprising SiO | 05-30-2013 |
Daniël Van'T Veen, Borne NL
Daniël Van'T Veen, Borne NL
Daniël Wagter, Leeuwarden NL
Patent application number | Description | Published |
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20150064307 | SLICED, GRATED OR SHREDDED CHEESE AND METHOD FOR THE PRODUCTION THEREOF - The invention is concerned with a method for producing a sliced, grated or shredded cheese, wherein the cheese is of the semi-hard or hard type and wherein said cheese is prepared with a starter culture comprising polysaccharide producing lactic acid bacteria. The cheese preferably has a reduced fat content. The sliced or grated cheese advantageously has a reduced tendency to stick or lump together. | 03-05-2015 |