| Patent application number | Description | Published |
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| 20110320477 | Dynamic Icon Overlay System and Method of Producing Dynamic Icon Overlays - A dynamic icon overlay system of a present invention embodiment dynamically generates icon overlays to be applied to a primary file icon of a target file. The icon overlays convey information regarding the target file and are relevant to an end user. The icon overlay system determines icon overlays to be applied to the primary file icon based on attributes associated with an end user of the target file that are correlated with attributes of the target file itself. The system applies the icon overlay to the primary icon and displays the primary icon with the applied icon overlay at an end user system. The applied icon overlay for the same target file may vary for different end users based on user attributes. | 12-29-2011 |
| 20110321117 | Policy Creation Using Dynamic Access Controls - A method and system for dynamically managing access to assets such as an electronic document or a hardware component, using policies that comprise one or more dynamic access controls, which are linked to data sources such as databases or web services. The access controls are dynamic because, each time the policy is invoked, the policy and its component access controls must be evaluated with respect to the current information in the linked data sources. | 12-29-2011 |
| 20110321159 | Dynamic Management of Role Membership - A method and system for dynamically managing entity membership in a role, using role configurations that comprise one or more dynamic role filters, which are linked to data sources such as databases or web services. The role filters are dynamic because, each time a role membership is queried, the role configuration and its component role filters must be evaluated with respect to the current information in the linked data sources. The roles may be used in role-based access control systems or entity identification systems. | 12-29-2011 |
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| 20080270061 | SYSTEM AND METHOD FOR SENSOR REPLICATION FOR ENSEMBLE AVERAGING IN MICRO-ELECTROMECHANICAL SYSTEM (MEMS) - A MEMs-based system (and method), includes a sensor array including at least two sensors providing a basis for ensemble averaging. | 10-30-2008 |
| 20080284365 | SERVO SYSTEM FOR A TWO-DIMENSIONAL MICRO-ELECTROMECHANICAL SYSTEM (MEMS)-BASED SCANNER AND METHOD THEREFOR - A servo control system micro-electromechanical systems (MEMS)-based motion control system (and method therefor), includes a motion generator having an inherent stiffness component. | 11-20-2008 |
| 20090015278 | APPARATUS TO MONITOR SUBSTRATE VIABILITY - An apparatus for detecting and reporting a condition is described. The apparatus is an electronic package comprising a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package. | 01-15-2009 |
| 20090039911 | METHOD TO MONITOR SUBSTRATE VIABILITY - An invention for detecting and reporting a condition is described. The components of the invention comprise an electronic package comprising a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package. | 02-12-2009 |
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| 20080215283 | METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT - An apparatus for predicting a thermal state of a system including a semiconductor chip includes a plurality of sensors formed on the semiconductor chip for measuring a temperature at first locations of the semiconductor chip, a model developer for developing a model for estimating a temperature at second locations of the semiconductor chip which are other than the first locations, a mapping unit for mapping an instruction cache associated with the chip into a sequence of X-Y distributed quanta of heat packets, and a predicting unit for predicting a future temperature of the chip based on an execution of an instruction stream in the instruction cache. | 09-04-2008 |
| 20090015187 | METHOD OF OPTIMIZING SERVO CONTROLLER POWER IN TWO-DIMENSIONAL FLEXUTRE MEMS STORAGE DEVICES - A method of optimizing a servo controller power required in the operation of two-dimensional flexure (Microelectronic Memory Storage) MEMS devices. Furthermore, provided is an arrangement for optimizing servo controller power in a two-dimensional flexure MEMS storage device through a utilization of the inventive method. | 01-15-2009 |
| 20090114429 | PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS - A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished. | 05-07-2009 |
| 20090265028 | Organic Substrate with Asymmetric Thickness for Warp Mitigation - A process for large scale production of a laminated organic substrate having reduced thermal warp. | 10-22-2009 |
| 20100218364 | PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS - A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished. | 09-02-2010 |
| 20100262399 | METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT - A method of estimating temperature of a transient nature of a thermal system, including, without a temperature measurement being made available, determining a drive current and thermal parameters of the thermal system. | 10-14-2010 |
| 20100274522 | Method and System for Real-Time Estimation and Prediction of the Thermal State of a Microprocessor Unit - A method judging a temperature of a chip including using a limited set of temperature sensors and using a knowledge of a power dissipation, estimating a temperature on a surface of a chip and predicting a future temperature of the chip knowing the instruction stream characteristics to be processed by the chip. | 10-28-2010 |
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| 20090017816 | IDENTIFICATION OF EQUIPMENT LOCATION IN DATA CENTER - Techniques are disclosed for identifying the locations of equipment in computing environments such as data centers. For example, a method of identifying a plurality of computing devices in a computing environment includes the following steps. A first temperature-indicative map of the plurality of computing devices is generated while the plurality of computing device is in a first mode. The first temperature-indicative map is overlaid with a facility map associated with the computing environment. A first one of the plurality of computing devices is placed into a second mode. The second temperature-indicative map of the plurality of computing devices is generated while the first one of the plurality of computing devices is in the second mode and the remainder of the plurality of computing devices is in the first mode. The second temperature-indicative map is overlaid with the facility map associated with the computing environment. The first temperature-indicative map is compared with the second temperature-indicative map to determine a location of the first one of the plurality of computing devices. | 01-15-2009 |
| 20090019201 | IDENTIFICATION OF EQUIPMENT LOCATION IN DATA CENTER - Techniques are disclosed for identifying the locations of equipment in computing environments such as data centers. For example, a method of identifying a location of at least one computing device in a computing environment, including a plurality of computing devices, includes the following steps. A first representation of temperature conditions associated with the plurality of computing devices is obtained while the at least one computing device is in a first mode. The at least one computing device is placed into a second mode. A second representation of temperature conditions associated with the plurality of computing devices is obtained while the at least one computing device is in the second mode. The location of the at least one computing system is determined using the first representation and the second representation. The first mode may be one of a normal operating mode and an idle mode, and the second mode may be the other of the normal operating mode and the idle mode. | 01-15-2009 |
| 20090310848 | Characterizing Thermomechanical Properties of an Organic Substrate Using Finite Element Analysis - A method for characterizing thermomechanical properties of an organic substrate is provided. The method includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the plurality of circuit layers of the substrate; selecting a given one of the plurality of circuit layers for processing; converting the image to a two-dimensional finite element model (FEM) image of the given one of the circuit layers; determining at least one of a coefficient of thermal expansion (CTE), modulus and Poisson's ratio of the FEM image of the given one of the circuit layers; repeating the steps of selecting a given one of the plurality of circuit layers, converting the image to a two-dimensional FEM image, and determining at least one of a CTE, modulus and Poisson's ratio of the FEM image for all of the plurality of circuit layers corresponding to at least a portion of the organic substrate; and constructing a three-dimensional representation of at least a portion of the organic substrate including the plurality of circuit layers as a function of at least one of the CTE, modulus and Poisson's ratio of each of the plurality of circuit layers. | 12-17-2009 |
| 20090312960 | Characterizing Thermomechanical Properties of an Organic Substrate Using Three-Dimensional Finite Element Analysis - A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image. | 12-17-2009 |
| 20090313588 | Method to Extract and Apply Circuit Features in Organic Substrate for Automation of Warp Modeling - A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images. | 12-17-2009 |
