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| 20100253828 | REFRACTIVE INDEX DISTRIBUTED OPTICAL ELEMENT AND IMAGE SENSOR INCLUDING THE REFRACTIVE INDEX DISTRIBUTED OPTICAL ELEMENT - A refractive index distributed optical element having a refractive index varying within a plane, including a positive refractive index distributed portion having a positive refractive index varying within the plane and a negative refractive index distributed portion having a negative refractive index varying within the plane. The absolute values of the refractive indexes of the positive refractive index distributed portion and the negative refractive index distributed portion decrease toward a region between the positive refractive index distributed portion and the negative refractive index distributed portion. | 10-07-2010 |
| 20100259668 | IMAGE SENSOR - An image sensor including an photoelectric conversion portion; a microlens; and a filter layer between the photoelectric conversion portion and the microlens. The filter layer has a convex shape having a center of curvature on a side of the photoelectric conversion portion with respect to the filter layer and includes patterns that are arranged in a one-dimensional or two-dimensional period such that an angle from the center of curvature is fixed. | 10-14-2010 |
| 20110063716 | METHOD OF MAKING OPTICAL ELEMENT AND OPTICAL ELEMENT - A method of making an optical element, the optical element including magnetic resonators that are anisotropically shaped and smaller than a wavelength of incident light, includes a first step of dispersing the magnetic resonators in a host medium, a second step of applying an external magnetic field to the host medium after the first step, and a third step of curing the host medium after the second step. | 03-17-2011 |
| 20110090384 | SOLID-STATE IMAGING DEVICE - Provided is a solid-state imaging device capable of reducing occurrence of noise resulting from reflected light to improve light use efficiency in a case where a solid-state imaging device is constructed to have a structure in which incident light passing through a substrate is reflected toward a photoelectric conversion unit. The solid-state imaging device includes: a photoelectric conversion unit formed in an inner portion of a substrate; a condensing unit provided on a side of the substrate which incident light enters, for condensing the incident light to the photoelectric conversion unit; and a reflecting unit provided on a side of the substrate which is opposed to the condensing unit, the reflecting unit being concave to the substrate, in which the reflecting unit has a structure for substantially aligning a same magnification imaging position of the reflecting unit with a focusing position of the condensing unit. | 04-21-2011 |
| 20110156991 | DISPLAY UNIT - A display unit has an interlayer formed at least as one or more than one layers and arranged between a light-emitting layer and a diffractive element. The interlayer has a thickness not less than 500 nm and not more than 2,000 nm and an average refractive index greater than a refractive index of the light-emitting layer. The optical path length of the interlayer defined as a product of multiplication of its average refractive index by its thickness satisfies the requirement shown below: | 06-30-2011 |
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| 20100289161 | MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF SHAPED ARTICLE - There is provided a method of manufacturing a shaped article having a plurality of lens sections arranged one-dimensionally or two-dimensionally and a substrate section connecting the lens sections, the lens sections and the substrate section being integrally made of a resin material. The resin material is cured between a transfer surface of a first mold, which is fit to one side surface of the shaped article, and a transfer surface of a second mold which is fit to an opposite side surface of the shaped article. A space between the transfer surface of the first mold and the transfer surface of the second mold is narrowed in accordance with contraction of the resin material caused by the curing, and the transfer surface of the first mold and the transfer surface of the second mold are kept in tight contact with the resin material. | 11-18-2010 |
| 20100290123 | WAFER LEVEL LENS ARRAY AND MANUFACTURING METHOD THEREFOR - Provided is a wafer level lens array, in which a plurality of lens sections arranged one-dimensionally or two-dimensionally and a substrate section connecting the lens sections are integrally made of a resin material, capable of preventing the substrate section from being deformed. A wafer level lens array includes: a plurality of lens sections that are two-dimensionally arranged; a substrate section that connects the lens sections to each other; and a rib that is disposed on the substrate section and extends along the surface of the substrate section. The lens sections, the substrate section, and the rib are integrally made of a resin material. | 11-18-2010 |
| 20110063487 | WAFER-LEVEL LENS ARRAY, METHOD OF MANUFACTURING WAFER-LEVEL LENS ARRAY, LENS MODULE AND IMAGING UNIT - Disclosed are a wafer-level lens array, a method of manufacturing a wafer-level lens array, a lens module, and an imaging unit that can prevent the influence of, for example, the shrinkage of a forming material, prevent the positional deviation between lenses when the wafer-level lens arrays overlap each other or when the wafer-level lens array overlaps an imaging element array, and be easily designed. | 03-17-2011 |
| 20110063731 | WAFER-LEVEL LENS ARRAY, METHOD OF MANUFACTURING WAFER-LEVEL LENS ARRAY, LENS MODULE AND IMAGING UNIT - Disclosed are a wafer-level lens array, a method of manufacturing a wafer-level lens array, a lens module, and an imaging unit capable of preventing the permeation of air into a substrate unit or a lens unit to be molded when a wafer-level lens array having the substrate unit and the lens units integrated with each other is molded. There is provided a method of integrally manufacturing a wafer-level lens array including a substrate unit and a plurality of lens units arranged on the substrate unit using a transfer mold having a plurality of concave portions corresponding to at least the plurality of lens units provided in a surface thereof. The method includes: supplying a resin to each concave portion, the amount of resin supplied being more than the volume of the concave portion; and performing molding to integrate the resin overflowing from the concave portions, thereby forming the substrate unit. | 03-17-2011 |
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| 20100290414 | WIRELESS COMMUNICATION DEVICE, WIRELESS COMMUNICATION SYSTEM, AND WIRELESS COMMUNICATION METHOD - When radar/radio signals are detected by one of two access points establishing communication in a WDS mode, the one access point notifies the other access point of a change of a communication channel to a newly allocated channel and actually changes the communication channel to the newly allocated channel. The other access point notified of the newly allocated channel performs a passive scan at the notified newly allocated channel to detect a beacon broadcasted by the one access point. In response to detection of the beacon, the other access point resets the communication channel to the notified newly allocated channel. The two access points can accordingly reestablish communication in the WDS mode within a short time period. This arrangement allows for a quick channel change in response to detection of radar/radio signals, such as a weather radar, during communication of a 5 GHz frequency band in the WDS mode. | 11-18-2010 |
| 20100299725 | WIRELESS LAN ACCESS POINT DEVICE AND UNAUTHORIZED MANAGEMENT FRAME DETECTION METHOD - A wireless LAN access point device is structured to perform frame-based data transmission and reception to and from a wireless terminal over a wireless communication path. The wireless LAN access point device has a communication module configured to transmit and receive a frame to and from the wireless terminal. In the wireless LAN access point device, when the communication module receives a predetermined management frame from the wireless terminal, an execution module performs a corresponding operation specified by the received management frame. In the wireless LAN access point device, when the communication module receives a frame, a sequence monitor module obtains a sequence number included in the frame. In the wireless LAN access point device, when a first sequence number obtained by the sequence monitor module and a second sequence number included in the received management frame satisfy a preset condition, an unauthorized frame judgment module identifies the received management frame as an unauthorized frame. This arrangement has the high versatility and effectively protects a wireless LAN network from unauthorized accesses. | 11-25-2010 |
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| 20080311769 | Anistropic Conductive Connector, Conversion Adapter for Inspection Device Having the Anisotropic Conductive Connector, and Method for Manufacturing the Anistropic Conductive Connector - The anisotropically conductive connector | 12-18-2008 |
| 20090039906 | CIRCUIT BOARD APPARATUS FOR WAFER INSPECTION, PROBE CARD, AND WAFER INSPECTION APPARATUS - Disclosed herein are a circuit board device for wafer inspection having high connection reliability, and a probe card and a wafer inspection apparatus, which are equipped with this circuit board device for wafer inspection. The circuit board device for wafer inspection has a board body and a connector device provided on the board body and obtained by stacking a plurality of connector units on each other, wherein each of the connector units has a first anisotropically conductive elastomer sheet, a composite conductive sheet, a second anisotropically conductive elastomer sheet and a pitch converting board, the composite conductive sheet has an insulating sheet, in which a plurality of through-holes have been formed, and rigid conductors respectively arranged into the through-holes in this insulating sheet so as to protrude from both surfaces of the insulating sheet, and in each of the rigid conductors, terminal portions having a diameter greater than the diameter of the through-hole are formed on both ends of a body portion inserted into the through-hole in the insulating sheet in order for the conductor to be provided movably in the thickness-wise direction of the insulating sheet. | 02-12-2009 |
| 20090072844 | WAFER INSPECTING SHEET-LIKE PROBE AND APPLICATION THEREOF - Disclosed herein are a sheet-like probe for wafer inspection, by which a good electrically connected state to a wafer can be surely achieved even when the pitch of electrodes to be inspected in the wafer is extremely small, and applications thereof. | 03-19-2009 |
| 20090159325 | ANISOTROPICALLY CONDUCTIVE CONNECTOR AND ANISOTROPICALLY CONDUCTIVE CONNECTOR DEVICE - An anisotropically conductive connector and an anisotropically conductive connector device. The anisotropically conductive connector includes a supporting member, a plurality of through-holes each extending in a thickness-wise direction of the supporting member, and anisotropically conductive sheets respectively held in the through-holes of the supporting member. Each anisotropically conductive sheet includes a frame plate, a plurality of through-holes each extending in a thickness-wise direction of the frame plate, and a plurality of anisotropically conductive elements arranged in the respective through-holes of the frame plate. Each of the anisotropically conductive elements includes a conductive part, conductive particles contained in an elastic polymeric substance in a state oriented so as to align in a thickness-wise direction of the element, and an insulating part to cover the outer periphery of the conductive part and including an elastic polymeric substance. | 06-25-2009 |
