Patent application number | Description | Published |
20090253891 | CLEANING SUBSTRATE OF SUBSTRATE PROCESSING EQUIPMENT AND HEAT RESISTANT RESIN PREFERABLE THEREOF - The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×10 | 10-08-2009 |
20100175716 | Cleaning Member, Delivery Member with Cleaning Function, and Method of Cleaning Substrate Processing Apparatus - Provided is a cleaning member, which is capable of removing minute foreign matter, preferably foreign matter of a submicron level simply, exactly, and sufficiently, without contaminating a cleaning site. Further provided is a delivery member with a cleaning function having the cleaning member and a method of cleaning a substrate processing apparatus using the delivery member with a cleaning function. The cleaning member of the present invention includes a cleaning layer having a plurality of protrusions of a columnar structure on the surface, in which an aspect ratio of the protrusions of a columnar structure is 5 or more. | 07-15-2010 |
20100319151 | CLEANING SHEET, CONVEYING MEMBER USING THE SAME, AND SUBSTRATE PROCESSING EQUIPMENT CLEANING METHOD USING THEM - A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm | 12-23-2010 |
20120126379 | DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM - A semiconductor device having an electromagnetic wave shielding layer can be manufactured without decreasing productivity. The present invention provides a die bond film including an adhesive layer and an electromagnetic wave shielding layer made of a metal foil or a die bond film including an adhesive layer and an electromagnetic wave shielding layer formed by vapor deposition. | 05-24-2012 |
20120126380 | FILM FOR THE BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, DICING TAPE-INTEGRATED FILM FOR THE BACKSIDE OF SEMICONDUCTOR, METHOD OF MANUFACTURING FILM FOR THE BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE - An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer. | 05-24-2012 |
20120126381 | ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - An object of the present invention is to decrease the influence of an electromagnetic wave emitted from one semiconductor chip on other semiconductor chips in the same package, amounted substrate, adjacent devices, and the package. The present invention provides an adhesive film for a semiconductor device having an adhesive layer and an electromagnetic wave shielding layer, in which the attenuation of the electromagnetic wave that penetrates the adhesive film for a semiconductor device is 3 dB or more in at least a portion of the frequency range of 50 MHz to 20 GHz. | 05-24-2012 |
20140000793 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140004635 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140004636 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140004637 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140004683 | METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT | 01-02-2014 |
20140061955 | THERMOSETTING RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING RESIN-SEALED TYPE SEMICONDUCTOR DEVICE - A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components. | 03-06-2014 |
20140249269 | THERMALLY-DETACHABLE SHEET - In order to provide a thermally-detachable sheet that detaches at higher temperatures, this thermally-detachable sheet has a shear bond strength with respect to a silicon wafer of 0.25 kg/5×5 mm or larger, at a temperature of 200° C., after said temperature has been maintained for one minute, and a shear bond strength with respect to a silicon wafer of 0.25 kg/less than 5×5 mm at any temperature in a range of over 200° C. to not more than 500° C., after said temperature has been maintained for three minutes. | 09-04-2014 |