Patent application number | Description | Published |
20090026634 | ELECTRONIC PART MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD - An electronic part mounting structure includes electronic part ( | 01-29-2009 |
20090039168 | Noncontact Information Storage Medium and Method for Manufacturing Same - A non-contact information storage medium has IC chip having at least a function of storing information, and resin substrate having antenna pattern for communicating a signal to an external device. Antenna terminal disposed at one end of antenna pattern on resin substrate and electrode terminal of IC chip are mounted so that the antenna terminal faces the electrode terminal. Insulating layer for gap regulation of at least 5 μm is disposed between antenna pattern and circuit forming surface of IC chip. | 02-12-2009 |
20090173795 | CARD TYPE INFORMATION DEVICE AND METHOD FOR MANUFACTURING SAME - Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard. | 07-09-2009 |
20090246474 | ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - An electronic component mounted structure is constituted by connecting together via a conductive adhesive | 10-01-2009 |
20090266582 | THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD - A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape. | 10-29-2009 |
20090268423 | INTERCONNECT SUBSTRATE AND ELECTRONIC CIRCUIT MOUNTED STRUCTURE - Interconnect substrate ( | 10-29-2009 |
20090315178 | CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMPONENT MOUNTED STRUCTURE - A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance. | 12-24-2009 |
20100029044 | CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE - Conductive bump ( | 02-04-2010 |
20100052189 | ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - Electronic component mounting structure ( | 03-04-2010 |
20100148362 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes an electronic part including an electrode, a substrate including a substrate electrode electrically connected to the first electrode on an upper surface thereof, the first substrate electrode and the first electrode being arranged, facing each other, a connecting member configured to connect the electrode with the substrate electrode, and a sealing material including a first resin portion which contains flux and contacts at least a connection portion between the connecting member and the substrate electrode, and a second resin portion which contains a lower concentration of flux than that of the first resin portion. A gap between the electronic part and the substrate is filled with the sealing film. | 06-17-2010 |
20110233767 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The semiconductor device manufacturing method includes the steps of attaching two or more solder particles on at least one electrode among a plurality of electrodes of an electronic component, arranging the electrode of the electronic component and an electrode of a circuit board so as to oppose each other, abutting the solder particles attached on a surface of the electrode of the electronic component to the electrode of the circuit board and heating the solder particles, and connecting electrically the electrode of the electronic component and the electrode of the circuit board via two or more solder joint bodies made by melting the solder particles. | 09-29-2011 |
20120125676 | THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD - A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape. | 05-24-2012 |
20120168961 | SEMICONDUCTOR DEVICE - An externally connecting electrode is formed above a semiconductor substrate with interlayer insulation films and disposed in the externally connecting electrode. The externally connecting electrode has a pad metal layer whose upper surface is exposed, a first metal layer formed between the pad metal layer and the semiconductor substrate, and at least two first vias which penetrate the interlayer insulation film and electrically connect the pad metal layer to the first metal layer and are formed in the interlayer insulation film. The maximum interval b between the first vias is larger than the width a of the pad metal layer. | 07-05-2012 |
20130170165 | ELECTRONIC-COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT, AND CIRCUIT BOARD - An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position. | 07-04-2013 |
20130181041 | MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATING METHOD, AND SOLDER TRANSFER SUBSTRATE - An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included. | 07-18-2013 |
20130307146 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE MOUNTING STRUCTURE OF THE ELECTRONIC COMPONENT - A mounting structure of an electronic component includes a plurality of joining portions that join a plurality of first electrode terminals on the electronic component to a plurality of second electrode terminals on a circuit board. The joining portions each include a first projecting electrode formed on the first electrode terminal, a second projecting electrode formed on the second electrode terminal, and a solder portion that joins the first projecting electrode to the second projecting electrode. The end face of the first projecting electrode is larger in area than the end face of the second projecting electrode, and at least a part of the second electrode terminals exposed from the circuit board has a larger area than the bottom of the second projecting electrode. | 11-21-2013 |
20140010991 | SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AND METHOD FOR TRANSFERRING SOLDER - A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused. | 01-09-2014 |
20140217595 | MOUNTING STRUCTURE AND MANUFACTURING METHOD FOR SAME - In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal ( | 08-07-2014 |
20140299986 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - A plurality of protruding electrodes of a semiconductor chip are in contact with a plurality of electrodes formed on a semiconductor substrate, via a plurality of solder sections. In this state, the solder sections are melted so as to form a plurality of solder bonding sections joined to the protruding electrodes of the semiconductor chip and the electrodes of the semiconductor substrate. Moreover, a distance between a part of the semiconductor chip and the semiconductor substrate is larger than a distance between the other part of the semiconductor chip and the semiconductor substrate, extending at least some of the solder bonding sections. Thus, the solder bonding sections vary in height. Holes are then formed at least in a solder bonding section having a maximum height out of the solder bonding sections. After that, the solder bonding sections are solidified. | 10-09-2014 |