| Patent application number | Description | Published |
|---|
| 20090026634 | ELECTRONIC PART MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD - An electronic part mounting structure includes electronic part ( | 01-29-2009 |
| 20090039168 | Noncontact Information Storage Medium and Method for Manufacturing Same - A non-contact information storage medium has IC chip having at least a function of storing information, and resin substrate having antenna pattern for communicating a signal to an external device. Antenna terminal disposed at one end of antenna pattern on resin substrate and electrode terminal of IC chip are mounted so that the antenna terminal faces the electrode terminal. Insulating layer for gap regulation of at least 5 μm is disposed between antenna pattern and circuit forming surface of IC chip. | 02-12-2009 |
| 20090173795 | CARD TYPE INFORMATION DEVICE AND METHOD FOR MANUFACTURING SAME - Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard. | 07-09-2009 |
| 20090246474 | ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - An electronic component mounted structure is constituted by connecting together via a conductive adhesive | 10-01-2009 |
| 20090266582 | THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD - A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape. | 10-29-2009 |
| 20090268423 | INTERCONNECT SUBSTRATE AND ELECTRONIC CIRCUIT MOUNTED STRUCTURE - Interconnect substrate ( | 10-29-2009 |
| 20090315178 | CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMPONENT MOUNTED STRUCTURE - A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance. | 12-24-2009 |
| 20100029044 | CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE - Conductive bump ( | 02-04-2010 |
| 20100052189 | ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - Electronic component mounting structure ( | 03-04-2010 |
| 20100148362 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes an electronic part including an electrode, a substrate including a substrate electrode electrically connected to the first electrode on an upper surface thereof, the first substrate electrode and the first electrode being arranged, facing each other, a connecting member configured to connect the electrode with the substrate electrode, and a sealing material including a first resin portion which contains flux and contacts at least a connection portion between the connecting member and the substrate electrode, and a second resin portion which contains a lower concentration of flux than that of the first resin portion. A gap between the electronic part and the substrate is filled with the sealing film. | 06-17-2010 |
