Patent application number | Description | Published |
20080205117 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device includes a semiconductor substrate and a plurality of cell transistors provided on a surface of the semiconductor substrate. A local bit line is provided above the cell transistors and electrically connected to one of a source diffusion layer and a drain diffusion layer of each of the cell transistors. Ferroelectric capacitors corresponding in number to the cell transistors, are provided above the local bit line, where each of the ferroelectric capacitors has an upper electrode and a lower electrode electrically connected to the other one of the source diffusion layer and drain diffusion layer of the corresponding one of the cell transistors. A plate line is provided above the upper electrodes and electrically connected to the upper electrodes. A reset transistor and a block selection transistor are provided on the surface of the semiconductor substrate. | 08-28-2008 |
20080231351 | VOLTAGE STEP-DOWN CIRCUIT - According to an aspect of the present invention, there is provided a voltage step-down circuit including: a first NMOS connected between an external and an internal power-supply voltages through a PMOS turned ON during an active state and turned OFF during a standby state; a second NMOS connected between the external and the internal power-supply voltages; and a current control circuit that sinks a current from the internal power-supply voltage to a ground level for a certain period of time after an operation state is switched from the active state to the standby state. | 09-25-2008 |
20080285327 | Ferroelectric Memory and Semiconductor Memory - A chain type ferroelectric random access memory has a memory cell unit including ferroelectric memory cells electrically connected in series to each other, a plate line connected to an electrode of the memory cell unit, a bit line connected to the other electrode of the memory cell unit via a switching transistor, a sense amplifier which amplifies the voltages of this bit line and its complementary bit line, and a transistor inserted between the switching transistor and the sense amplifier. A value, being the minimum value of the gate voltage in the transistor obtained during elevation of the plate line voltage and comparative amplification, is smaller than a value, being the maximum value of the gate voltage in the transistor obtained during fall of the plate line voltage and comparative amplification. With these features, decrease in the accumulated charge of polarization in the memory cell is reduced and occurrence of disturb is prevented during read/write operations. | 11-20-2008 |
20080304309 | SEMICONDUCTOR MEMORY DEVICE - The sense amp circuit includes a first node given a first, positive constant voltage larger than a fixed potential before reading, a second node given a second, negative constant voltage smaller than the fixed potential before reading, and a third node to be connected to the first and second nodes on reading. A first transistor is connected between the first node and the bit line and operative to turn on when the potential on the bit line becomes smaller than the fixed potential. A second transistor is connected between the second node and the bit line and operative to turn on when the potential on the bit line becomes larger than the fixed potential. A first capacitor is connected between the first node and the fixed potential. A second capacitor is connected between the second node and the fixed potential. | 12-11-2008 |
20090039944 | REFERENCE VOLTAGE GENERATION CIRCUIT AND SEMICONDUCTOR STORAGE APPARATUS USING THE SAME - According to an aspect of the present invention, there is provided a reference voltage generation circuit including: a first circuit configured to generate a first voltage that is independent of a power supply voltage and that is dependent of a temperature; a second circuit configured to generate a second voltage that is independent of the power supply voltage and that is dependent of the temperature; and a third circuit configured to compare the first voltage and the second voltage and to generate a reference voltage based on a higher one therebetween. | 02-12-2009 |
20090040807 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a memory cell array of memory cells each including a cell transistor and a ferroelectric capacitor; a sense amp circuit operative to sense/amplify a signal read out of the ferroelectric capacitor through a pair of bit lines; a pair of decoupling transistors provided on the pair of bit lines to decouple the bit lines; a control circuit operative to provide a control signal to the gates of the decoupling transistors to control conduction of the decoupling transistors; and a dummy capacitor provided in connection with at least either one of the pair of bit lines between the decoupling transistors and the sense amp circuit. The control circuit is configured to be capable of turning the decoupling transistors from on to off when a certain period of time elapsed after the beginning of reading. | 02-12-2009 |
20090096506 | POWER SUPPLY CIRCUIT - According to an aspect of the present invention, there is provided a power supply circuit including: a detection circuit that is connected to an external power supply voltage and that outputs a first signal indicating whether the external power supply voltage is in a dropped-state in which the external power supply voltage is dropped below a reference voltage; a control circuit that includes: a delay circuit that outputs a second signal acquired by delaying the first signal for a reference time; and a determination circuit that outputs a third signal based on the first signal and the second signal; a generation circuit that generates internal power supply voltage from the external power supply voltage and that supplies the internal power supply voltage; and an interruption circuit that interrupts the internal power supply voltage supplied from the generation circuit based on the third signal. | 04-16-2009 |
20090231902 | SEMICONDUCTOR MEMORY DEVICE - A memory includes ferroelectric capacitors; cell transistors each including a drain connected to one electrode of each ferroelectric capacitor, and a gate connected to the word line; and memory cell blocks each including a reset transistor, a block selection transistor, and memory cells including the ferroelectric capacitors and the cell transistors, wherein sources of the cell transistors are connected to the plate lines, the other electrode of the ferroelectric capacitor is connected to one of the sub-bit lines, a source and a drain of the block selection transistor are connected to one of the sub-bit lines and one of the bit lines, a source of the reset transistor is connected to one of the plate lines or a fixed potential, and a drain of the reset transistor in each memory cell block is connected to one of the sub-bit lines, and the memory cell blocks configure a memory cell array. | 09-17-2009 |
20090231903 | FERROELECTRIC MEMORY AND METHOD FOR TESTING THE SAME - A driver circuit and a precharge circuit apply, in a test mode, a fixed potential to a bit-line, while applying a second plate-line voltage to a plate-line. Then, the bit-line is switched from a first bit-line precharge potential to a floating state, and the plate-line voltage is raised from the second plate-line voltage to a plate-line voltage. | 09-17-2009 |
20090256542 | POWER SUPPLY CIRCUIT - A power supply circuit has a constant voltage circuit, a first MOS transistor, a second MOS transistor, a third MOS transistor, a first voltage dividing circuit that outputs a first divided voltage obtained by dividing the voltage of the output terminal by a first voltage dividing ratio, and a first differential amplifier circuit which is fed with a reference voltage and the first divided voltage and has an output connected to a gate of the second MOS transistor. The first differential amplifier circuit outputs a signal to turn on the second MOS transistor when the first divided voltage is higher than the reference voltage, and the first differential amplifier circuit outputs a signal to turn off the second MOS transistor when the first divided voltage is lower than the reference voltage. | 10-15-2009 |
20100002493 | SEMICONDUCTOR STORAGE DEVICE - A precharge circuit precharges a bit line paired with the bit line to which the selected one of the memory cells is connected, by applying to the former bit line an external reference voltage for comparison with a voltage in the bit line caused by selection of the memory cell. A precharge assist circuit, which is connected to the former bit line in parallel with the precharge circuit, charges the bit line to a predetermined potential by using a power supply voltage. A sense amplifier, which is connected to the pair of bit lines, senses and amplifies a potential of a bit line that is connected to a memory cell selected by word lines. | 01-07-2010 |
20100014341 | SEMICONDUCTOR MEMORY DEVICE - A memory includes word lines; plate lines; first to eighth bit lines; cell transistors; ferroelectric capacitor connected in parallel with cell transistors; sense amplifiers, wherein cell transistors and ferroelectric capacitors configure cells, the cells are connected in series to configure first to eighth cell blocks, the cell blocks are connected to the same word lines, first ends of the cell blocks are respectively connected to the bit lines, second ends of the cell blocks are respectively connected to the different plate lines, one of the first to the fourth bit lines and one of the fifth to the eighth bit lines are configured to be selectively connected to the sense amplifier during an operation, numbers of the cells connected in series between the bit lines and the plate lines are different in the first to the fourth cell blocks, and are different in the fifth to the eighth cell blocks. | 01-21-2010 |
20100020589 | SEMICONDUCTOR MEMORY DEVICE - The sense amplifier detects and amplifies a signal read via bit lines from the ferroelectric capacitor of the memory cell. The dummy capacitor provides a reference voltage to bit lines. The dummy capacitor includes a first dummy capacitor and a second dummy capacitor. The first dummy capacitor is provided with a first dummy plate potential at one end to set the reference voltage to a certain potential. The other end is connected to the bit line. The second dummy capacitor is provided with a second dummy plate potential at one end to fine-tune the reference voltage from the certain potential. The other end thereof is connected to the bit line. | 01-28-2010 |
20100020627 | SEMICONDUCTOR MEMORY DEVICE - A memory includes a cell array; bit lines; word lines; sense amplifiers; first determination transistors receiving information data and making a connection between a first voltage source and a first determination node be in a conductive or a non-conductive state based on a logic value of the information data; second determination transistors receiving the information data detected by the sense amplifiers and making a connection between the first voltage source and a second determination node be in a conductive or a non-conductive state based on the logic value of the information data; a second voltage source charging the first and the second determination nodes; and a determination unit detecting potentials of the first determination node and the second determination node when a logic of the information data is inverted logically to determine maximum and minimum values of potential of the information data. | 01-28-2010 |
20100054064 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory apparatus includes: a bit line; a word line; a local bit line; a first switch unit provided between the local bit line and the bit; a memory cell connected to the bit line and the word line; a memory cell array including the memory cell; a first sense circuit connected to the bit line and configured to amplify a signal read out from the memory cell; and a second sense circuit connected to the local bit lines and configured to amplify a signal amplified by the first sense circuit, wherein the first switch unit disconnects the local bit line from the bit line when the first sense circuit amplifies the signal, and connects the local bit line to the bit line when the second sense circuit amplifies the signal amplified by the first sense circuit. | 03-04-2010 |
20100067284 | Semiconductor Memory Device - A memory cell array includes a plurality of memory cells arranged at intersections of bit line pairs and word lines. Each memory cell includes a first transistor having one main electrode connected to a first bit line, a second transistor having one main electrode connected to a second bit line, a first node electrode for data-storage connected to the other main electrode of the first transistor, a second node electrode for data-storage connected to the other main electrode of the second transistor, and a shield electrode formed surrounding the first and second node electrodes. The first and second transistors have respective gates both connected to an identical word line, and the first and second bit lines are connected to an identical sense amp. The first and second node electrodes, the first and second bit lines, the word line and the shield electrode are isolated from each other using insulating films. | 03-18-2010 |
20100090727 | VOLTAGE DETECTION CIRCUIT AND BGR VOLTAGE DETECTION CIRCUIT - A voltage detection circuit of the present invention includes an NMOS transistor diode-connected, a gate and a drain thereof being supplied with a power supply voltage, a resistor connected between a source of the NMOS transistor and a ground potential, and a source voltage detection circuit receiving a voltage of the source, wherein an NMOS type transistor is employed as the NMOS transistor, a channel width and a channel length of the NMOS type transistor being set in such a manner that an operating point on a VG-ID curve of the NMOS type transistor may come to a certain point, at the certain point, a drain current of the NMOS type transistor being constant even if the temperature fluctuates. | 04-15-2010 |
20100091547 | SEMICONDUCTOR MEMORY DEVICE - A memory includes a memory cell array including destructive read-out type memory cells; a decoder selecting a cell; a sense amplifier configured to detect the data; and a read and write controller controlling a read operation and a write operation, wherein the read and write controller outputs a logical value of a write enable signal at the start of the read operation in a first period and makes the write enable signal invalid after the read operation starts during the first period, on the basis of the write enable signal and a restore signal keeping an activated state during the first period, the write enable signal being a signal allowing the write operation, the first period being a period from when the read operation starts to when a restore operation for writing the data back to the memory cell is completed. | 04-15-2010 |
20100103715 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor storage device includes: a plurality of memory cell arrays, each having a memory cell arranged therein, the memory cell including a ferroelectric capacitor and a transistor; a dummy capacitor operative to provide a reference potential corresponding to a potential read from the memory cell; a sense amplifier circuit including an amplifier circuit to compare and amplify potentials between a pair of bit lines; a reference potential correction capacitor connected to the pair of bit lines together with the dummy capacitor; and a control circuit configured to output a correction signal based on shift information to correct the reference potential, the shift information being retained in at least one of the plurality of memory cell arrays. The reference potential correction capacitor shifts the reference potential by changing the amount of accumulated electric charges according to the correction signal. | 04-29-2010 |
20100110755 | FERROELECTRIC RANDOM ACCESS MEMORY DEVICE - A ferroelectric random access memory device has a first bit line, a first ferroelectric capacitor, a second bit line, a second ferroelectric capacitor and a first to fourth MOS transistor. The first bit line is changed to a first data potential according to first data stored in the first ferroelectric capacitor, the second bit line is changed to a second data potential according to second data obtained by inverting a logic of the first data, and then the second MOS transistor and the fourth MOS transistor are turned on. | 05-06-2010 |
20100124092 | FERROELECTRIC MEMORY DEVICE - According to an aspect of the present invention, there is provided a ferroelectric memory device including: a cell unit including: a first select transistor having a first source, a first drain, and a first gate, one of the first source and the first drain being connected to a bit line; and a memory cell unit having a plurality of first memory cells, each of the first memory cells including a first ferroelectric capacitor and a first memory transistor; and a ferroelectric memory fuse including: a second select transistor having a second source, a second drain, and a second gate connected to a second select line, one of the second source and the second drain being connected to one end of the bit line; and a memory fuse unit having a plurality of second memory cells, each of the second memory cells including a second ferroelectric capacitor and a second memory transistor. | 05-20-2010 |
20100124093 | FERROELECTRIC MEMORY - A ferroelectric memory of an embodiment of the present invention includes m platelines arranged in a first interconnect layer (m is a positive integer), n bitlines arranged in a second interconnect layer (n is a positive integer), and m×n memory cells arranged at m×n intersection points of the m platelines and the n bitlines, each of the m×n memory cells including a ferroelectric capacitor and a zener diode connected in series between any one of the m platelines and any one of the n bitlines. | 05-20-2010 |
20100149850 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory device including: a memory cell array including: memory cell blocks each having series-connected memory cells; wordlines; and a bitline pair connected to the memory cell blocks, one functioning as a readout bitline, the other one functioning as a reference bitline; an amplification circuit connected to the bitline pair to amplify a signal difference therebetween; and a reference voltage generation circuit including: a dummy memory cell block that has the same configuration as the memory cell block, that has one terminal connected to a first dummy plate line and that has the other terminal connected to the reference bitline; and a paraelectric capacitor that has one terminal connected to a second dummy plate line and that has the other terminal connected to the reference bitline. | 06-17-2010 |
20100157650 | FERROELECTRIC MEMORY - A ferroelectric memory according to an embodiment of the present invention includes a memory cell array including plural memory cells, and provided with plural word lines, plural bit lines, and plural plate lines, each of the plate lines corresponding to at least two of the word lines, an access control circuit configured to perform an access operation to a selected cell which is selected from the memory cells, and a refresh control circuit configured to perform a refresh operation, in a background of the access operation, on a refresh cell which is selected from the memory cells, the refresh control circuit performing the refresh operation when a plate line connected to the selected cell and a bit line connected to the selected cell are at the same potential after the access operation. | 06-24-2010 |
20100161881 | MEMORY SYSTEM - A memory system ( | 06-24-2010 |
20100172192 | REFERENCE VOLTAGE GENERATION CIRCUIT AND SEMICONDUCTOR MEMORY - A reference voltage generation circuit includes a first node settable at a reference voltage to be any one of a plurality of voltage levels, a second node set at a pre-charge voltage, first and second switches connected in series between the first and second nodes, a plurality of capacitors, each capacitor comprising a first end connected to a connection node between the first and second switches and a second end settable at an independent voltage level, a switch controller configured to turn off the first switch and turn on the second switch in an initial state, and then to turn off the second switch, and then to turn on the first switch, and a voltage controller configured to individually set a voltage at the second end of each capacitor after the first switch is turned on. | 07-08-2010 |
20100237931 | INTERNAL POWER SUPPLY VOLTAGE GENERATION CIRCUIT - An internal power supply voltage generation circuit | 09-23-2010 |
20100237933 | CURRENT SUPPLY CIRCUIT - A current supply circuit according to an embodiment of the present invention includes an operational amplifier having first and second input terminals and an output terminal, a transistor having a control terminal connected to the output terminal of the operational amplifier, and having first and second main terminals, a first resistance arranged between the first input terminal of the operational amplifier and the first main terminal of the transistor, a second resistance arranged between a predetermined node and a ground line, the predetermined node being between the first input terminal of the operational amplifier and the first resistance, first to Nth transistors, each of which has a control terminal connected to the control terminal or the second main terminal of the transistor, and has a main terminal outputting a current, where N is an integer of two or larger, and first to Nth switching transistors, each of which has a main terminal, the main terminals of the first to Nth switching transistors being respectively connected to the main terminals of the first to Nth transistors, a pulse width of a signal provided to a control terminal of the respective first to Nth switching transistors being set to be constant regardless of a pulse frequency of the signal. | 09-23-2010 |
20110007579 | INTERNAL VOLTAGE GENERATOR - An internal voltage generator according to an embodiment generates a reference voltage used for detecting data stored in a semiconductor memory. A first AD converter is configured to convert an external voltage supplied to the semiconductor memory into a first digital value. A second AD converter is configured to convert a temperature characteristic voltage that changes depending on a temperature of the semiconductor memory into a second digital value. An adder is configured to receive a reference voltage trimming address that specifies the reference voltage, the first digital value, and the second digital value, and to output a third digital value obtained by performing a weighted addition of the reference voltage trimming address, the first digital value, and the second digital value. A driver is configured to output the reference voltage responding to the third digital value. | 01-13-2011 |
20110044087 | SEMICONDUCTOR MEMORY DEVICE - A memory includes ferroelectric capacitors; sense amplifiers configured to detect the data stored in ferroelectric capacitors; and a plate control circuit configured to receive a plate driving signal driving a plate line, a write signal indicating writing of data from an outside to the sense amplifier, and an operation end signal indicating end of an executable period for reading or writing data between the sense amplifier and the outside, the plate control circuit validating or invalidating the plate driving signal based on the write signal and the operation end signal wherein the plate control circuit validates the plate driving signal in the executable period, and the plate control circuit invalidates the plate driving signal at the end of the executable period when the write signal is never activated in the executable period, and keeps the plate driving signal valid when the write signal is activated in the executable period. | 02-24-2011 |
20110058403 | FERRO-ELECTRIC RANDOM ACCESS MEMORY APPARATUS - A ferro-electric random access memory apparatus has a memory cell array in which a plurality of memory cells each formed of a ferro-electric capacitor and a transistor are arranged, word lines are disposed to select a memory cell, plate lines are disposed to apply a voltage to a first end of the ferro-electric capacitor in a memory cell, and bit lines are disposed to read cell data from a second end of the ferro-electric capacitor in the memory cell. The ferro-electric random access memory apparatus has a sense amplifier which senses and amplifies a signal read from the ferro-electric capacitor onto the bit line. The ferro-electric random access memory apparatus has a bit line potential control circuit which exercises control to pull down a voltage on an adjacent bit line adjacent to the selected bit line onto which the signal is read, before operation of the sense amplifier at time of data readout. | 03-10-2011 |
20110058428 | SEMICONDUCTOR STORAGE DEVICE - According to one embodiment, a first node is connected to a gate of a second PMOS and a gate of a second NMOS, a second node is connected to a gate of a first PMOS and a gate of a first NMOS, a gate of the first transistor is connected to a first signal line, a source of a first transistor is connected to the first node, and a drain of the first transistor is connected to the second node, a gate of a second transistor is connected to the second node, a source of the second transistor is connected to a third node, and a drain of the second transistor is connected to a second signal line, and a gate of a third transistor is connected to a third signal line, a source of the third transistor is connected to a fourth signal line, and a drain of the third transistor is connected to the third node. | 03-10-2011 |
20110063886 | SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD OF THE SAME - A memory includes a cell region; a spare region including a spare block; a fuse region storing remedy information necessary for an access to the spare block instead of a remedy target block, the fuse region comprising non-defective cells in the remedy target block, or including cells in a first block of the spare region; an initial reading fuse storing a block address for identifying the remedy target block or the first block allocated as the fuse region, and a selection address for selecting a region in the remedy target block or a region in the first block allocated as the fuse region; and a controller configured to acquire the remedy information from the fuse region based on the block address and the selection address, and to change the access to the remedy target block to the access to the spare block based on the remedy information. | 03-17-2011 |
20110228603 | FUSION MEMORY - According to one embodiment, there is provided a fusion memory including a first memory cell array formed of a NAND cell unit and a second memory cell array formed of a DRAM cell on a semiconductor substrate. The NAND cell unit is formed of a non-volatile memory cell having a two-layer gate structure in which a first gate and a second gate are stacked, and a selective transistor connecting the first and second gates of the non-volatile memory cell. The DRAM cell is formed of a cell transistor having a structure same as the structure of the selective transistor, and a MOS capacitor having a structure same as the structure of the non-volatile memory cell or the selective transistor. | 09-22-2011 |
20110234306 | BOOSTER CIRCUIT - In a booster, a first transistor of a second conduction-type is formed on a first conduction-type substrate and connected to between a voltage-source and an output so that the first transistor functions as a diode. A first capacitor is connected to a first node of the first transistor on a voltage-source side, and transmits a first clock to the first node. A second transistor of the first conduction-type is connected to a second node of the first transistor on an output side to receive the first clock. A second capacitor is connected to the second node and transmits a second clock having an opposite phase of the first clock to the second node. The first transistor transfers the first node's voltage stepped up by the first clock to the second node. The second transistor transfers the second node's voltage stepped up by the second clock to an output side. | 09-29-2011 |
20120060066 | SEMICONDUCTOR MEMORY DEVICE WITH ERROR CORRECTION - This disclosure concerns a memory including: a first memory region including memory groups including a plurality of memory cells, addresses being respectively allocated for the memory groups, the memory groups respectively being units of data erase operations; a second memory region temporarily storing therein data read from the first memory region or temporarily storing therein data to be written to the first memory region; a read counter storing therein a data read count for each memory group; an error-correcting circuit calculating an error bit count of the read data; and a controller performing a refresh operation, in which the read data stored in one of the memory groups is temporarily stored in the second memory region and is written back the read data to the same memory group, when the error bit count exceeds a first threshold or when the data read count exceeds a second threshold. | 03-08-2012 |
20120068763 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - According to one embodiment, a semiconductor integrated circuit device includes an output circuit which includes an inverter having a first transistor and a second transistor whose current paths are series-connected between a first power supply voltage and a second power supply voltage, a first diode circuit one end of which is connected to the first power supply voltage, and the other end of which is connected to a control terminal of the first transistor, and an adjustment circuit which forms a current path for discharging a charge of the control terminal of the first transistor to the second power supply voltage when an input clock is at a first level. | 03-22-2012 |
20120069623 | FERROELECTRIC MEMORY - One embodiment provides a ferroelectric memory including: memory cells each including a ferroelectric memory; first and second bitlines configured to read out cell signals from the memory cells; a first circuit configured to fix, when the cell signal is read from the memory cell to the first bitline, a voltage of the second bitline to a first power-supply voltage, and then set the second bitline to a second power-supply voltage different from the first power-supply voltage; a second circuit configured to set, after the first circuit sets the second bitline to the second power-supply voltage, the second bitline to a reference voltage; and a third circuit configured to amplify a voltage difference between the first bitline to which the cell signal is read and the second bitline to which the reference voltage is set. | 03-22-2012 |
20120179942 | MEMORY SYSTEM - To provide a memory system which determines a memory state such as an exhaustion level and allows a memory to be efficiently used. | 07-12-2012 |
20120241837 | NON-VOLATILE MEMORY HAVING CHARGE STORAGE LAYER AND CONTROL GATE - According to one embodiment, a non-volatile memory includes a first non-volatile memory cell and a first selected transistor. A first cell block is formed by connecting a plurality of first non-volatile memory cells in series. An area S1 of the first insulating film at which the first floating gate is in contact with the first silicon channel is larger than an area S2 of the second insulating film at which the first floating gate is in contact with the first gate electrode. | 09-27-2012 |
20120243307 | RESISTANCE CHANGE NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a phase change memory includes a memory cell, a select transistor, and a memory cell array. The memory cell includes a chalcogenide wiring, resistance wirings and a cell transistor. The chalcogenide wiring becomes a heater. One end of a plurality of memory cells with sources and drains connected in series is connected to a source of the select transistor. The bit line is connected a drain of the select transistor. The memory cell array is obtained by forming a memory cell string. | 09-27-2012 |
20130194867 | SEMICONDUCTOR MEMORY DEVICE - A volatile memory area includes a plurality of second memory cells, a third select transistor, and a fourth select transistor. The plurality of second memory cells are electrically connected in series, and stacked above the substrate. The third select transistor is connected to one end of the plurality of second memory cells, and connected to a second bit line. The fourth select transistor is connected to the other end of the plurality of second memory cells, and unconnected to a second source line. A controller is configured to supply a first voltage to all gates of the second memory cells. The first voltage is capable of turning on the plurality of second memory cells. | 08-01-2013 |
20140284680 | NONVOLATILE MEMORY - According to one embodiment, a nonvolatile memory includes the following structure. A first gate insulating film, a first floating gate, a second gate insulating film and a gate electrode are stacked on a semiconductor region between source and drain electrodes. A second floating gate is formed on a first side surface of the first floating gate. A first insulating film is formed between the first and second floating gates and has an air gap. A third floating gate is formed on a second side surface of the first floating gate on the opposite side of the first side surface. A second insulating film is formed between the first and third floating gates. | 09-25-2014 |
20140289588 | MEMORY SYSTEM - A memory system ( | 09-25-2014 |
20150036410 | SEMICONDUCTOR STORAGE DEVICE - A memory includes a first and second cell storing first data and second or reference-data. A first and second bit-lines connected to the first and second cells respectively correspond to a first and second sense-nodes. A first transfer-gate is inserted/connected between the first bit-line and the first sense-node. A second transfer-gate is inserted/connected between the second bit-line and the second sense-node. A sense-amplifier is inserted or connected between the first and second sense-nodes. A preamplifier includes a first and second common-transistors. The first common-transistor applies a first power-supply voltage to either the first or the second sense-node according to the first and second data or according to the first and reference-data during a data-read-operation. The second common-transistor applies a second power-supply voltage to the other sense-node out of the first and second sense-nodes according to the first and second data or according to the first and reference data. | 02-05-2015 |