Patent application number | Description | Published |
20130043229 | HEAT TREATMENT APPARATUS AND METHOD FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - In light-irradiation heating with a total irradiation time of one second or less, two-stage irradiation is performed, including a first stage of light irradiation of a semiconductor wafer, which irradiation produces an output waveform that reaches a peak at a given emission output; and a second stage of supplemental light irradiation of the semiconductor wafer, which irradiation is started after the peak, producing an emission output smaller than the above given emission output. The emission output in the second stage is two thirds or less than the above given emission output at the peak. The first-stage light-irradiation time is between 0.1 and 10 milliseconds, and the second-stage light-irradiation time is 5 milliseconds or more. This allows the temperature of the semiconductor wafer even at a somewhat greater depth below the surface to be raised to some extent while allowing the surface temperature to be maintained at a generally constant processing temperature. | 02-21-2013 |
20130111731 | ASSEMBLING APPARATUS AND METHOD, AND ASSEMBLING OPERATION PROGRAM - In an assembling apparatus according to the present invention, a control portion controls an operation of a working portion such that a first reference position, which corresponds to a first reference point of an assembling component defined in three-dimensional model data of the assembling component, and a second reference position, which corresponds to a second reference point of the assembling component defined in three-dimensional model data of an assembled component, are associated with each other. Therefore, it is possible to carry out an assembling operation properly and efficiently irrespective of a positional shift of the assembled component. | 05-09-2013 |
20130122704 | ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD - There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank. | 05-16-2013 |
20130154061 | ANODIZING APPARATUS, AN ANODIZING SYSTEM HAVING THE SAME, AND A SEMICONDUCTOR WAFER - An anodizing apparatus for causing an anodizing reaction to substrates immersed in an electrolyte solution. The apparatus includes a storage tank for storing the electrolyte solution, a holder for holding a plurality of substrates in liquid-tight contact with circumferential surfaces of the substrates, a moving mechanism for moving the holder between a transfer position outside the storage tank and a treating position inside the storage tank, and a closing device disposed in the storage tank for cooperating with the holder to complete a liquid-tight closure of the circumferential surfaces of the substrates held by the holder. Chemical reaction treatment is carried out with the circumferential surfaces of the substrates placed in a liquid-tight state. After the chemical reaction treatment is completed, the closing device is made inoperative and the holder is moved away from the treating position to unload the substrates from the storage tank. | 06-20-2013 |
20130161287 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A preprocess step for supplying an inert gas into an enclosed space in which a substrate is disposed, while exhausting gas by sucking out of the enclosed space. And then, an etching step for supplying a process vapor into the enclosed space while exhausting gas out of the enclosed space at an rate lower than a rate in the preprocess step. And then a post-process step for supplying an inert gas into the enclosed space while exhausting gas by sucking out of the enclosed space at a rate higher than the rate in the etching step. | 06-27-2013 |
20130167876 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus ( | 07-04-2013 |
20130175241 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A solvent vapor containing a solvent material capable of dissolving hydrogen fluoride is supplied to a surface of a substrate, thereby covering the surface of the substrate with a liquid film containing solvent material. Thereafter an etching vapor containing a hydrogen fluoride is supplied to the surface of the substrate covered by the liquid film containing the solvent material, thereby etching the surface of the substrate. | 07-11-2013 |
20130182941 | APPEARANCE INSPECTION APPARATUS AND METHOD - An appearance inspection apparatus comprises an inspection part for detecting a defect of a pattern on the basis of an image of a surface of a substrate on which the pattern is formed, which is captured by an imaging part. The inspection part comprises an image transfer part for transferring image data which is obtained by imaging a region to be inspected on the substrate and stored in an image storing memory by the imaging part to a plurality of image processing memories and a plurality of GPUs for taking image data corresponding to respective regions to be processed out of transferred image data which are transferred to the image processing memories by the image transfer part and performing an inspection process for defect detection on the image data. The inspection part further comprises an image processing control part for acquiring inspection tasks each prescribing inspection details from an inspection task holding part and controlling the plurality of GPUs in accordance with the inspection tasks, respectively, independently of the image transfer by the image transfer part. | 07-18-2013 |
20130203269 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY IRRADIATION WITH FLASHES OF LIGHT, AND HEAT TREATMENT METHOD - A first flash heating is performed in which a lower flash lamp irradiates a back surface of a semiconductor wafer with flashes of light, so that heat conduction from the back surface to a surface of the semiconductor wafer raises the temperature of the surface from the room temperature to an intermediate temperature. Then, a second flash heating is performed in which an upper flash lamp irradiates the surface of the semiconductor wafer with flashes of light, to raise the temperature of the surface of the semiconductor wafer from the intermediate temperature to a target temperature. Since only the irradiation with flashes of light emitted from the lower flash lamp and the upper flash lamp is used to cause the semiconductor wafer having the room temperature to reach the target temperature, all heat treatments can be completed in an extremely short time of one second or less. | 08-08-2013 |