| Patent application number | Description | Published |
|---|
| 20080256401 | Information Processing Apparatus, Information Processing System, Information Processing Method and Computer Program - The present invention is directed to an information processing system composed of plural information processing units adapted for mutually executing data communication, and for executing data processing in which communication data has been applied. The first entity A transmits error notification data on the basis of error detection to execute initial state return processing on the condition that data reception after error notification data has been transmitted is made, and the second entity B transmits error notification data on the basis of error detection to execute initial state return processing on the condition that transmit processing of error notification data is executed. Thus, the both entities A and B can return to the initial state in a manner synchronous with each other. As a result, it becomes possible to perform reliable error recovery and data processing restart. | 10-16-2008 |
| 20080308314 | Implementation structure of semiconductor package - An implementation structure of a semiconductor package includes: a printed wiring board which has via-holes piercing a mounted surface and an opposite surface of the printed wiring board; a via-land which is formed on the opposite surface so as to cover openings of the via-holes on the opposite surface and which is conductively connected to the via-holes; a semiconductor chip which has bumps; and a thermosetting adhesive filled between the semiconductor chip and the mounted surface of the printed wiring board, wherein an anisotropic conductive material is filled inside the via-holes, the bumps are inserted into the via-holes, and the bumps are conductively connected to the via-holes via the conductive particles. | 12-18-2008 |
| 20090032973 | Semiconductor stack package having wiring extension part which has hole for wiring - A semiconductor stack package includes a first printed wiring board; a plurality of semiconductor chips stacked on the first printed wiring board, wherein among the semiconductor chips, the uppermost semiconductor chip has an electrode pad for providing power supply, a ground pad for providing grounding, and a signal pad for signal transmission in a center area on the upper surface of the chip; connection lands formed on the first printed wiring board on the outside of the stacked semiconductor chips; a wiring extension part which is formed on the uppermost semiconductor chip, and has wiring circuits extending from the center to the periphery thereof, wherein at least one of the electrode pad and the ground pad is electrically connected to one end of one of the wiring circuits; and a wire for connecting the other end of the relevant wiring circuit of the wiring extension part and one of the connection lands on the first printed wiring board. | 02-05-2009 |
| 20090140409 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate having bumps on the backside thereof, a first semiconductor chip mounted on the surface of the substrate, a second semiconductor chip mounted on the first semiconductor chip above the surface of the substrate, a first bonding wire having a length L | 06-04-2009 |
| 20090250801 | Semiconductor device - A semiconductor device in which a plurality of semiconductor elements are stacked, yet realizing high speed operation of the semiconductor elements. The semiconductor device is provided with semiconductor packages, and a spacer. The semiconductor packages are stacked, with the spacer interposed therebetween. The semiconductor packages have, respectively, package boards, and semiconductor elements mounted on the package boards. The spacer has a plurality of conductive vias and a capacitor element. The semiconductor packages are electrically connected through the conductive vias. The capacitor element is electrically connected, among the conductive vias, to a conductive via that electrically connects the semiconductor element and power supply, and a conductive via that electrically connects the semiconductor element and ground. | 10-08-2009 |
| 20100024029 | Battery And Authentication Requesting Device - An authentication requesting device which includes a battery connecting section to be connected to a battery and a receiving section to be supplied with power from an external power source when connected to the external power source, and executes an authentication process for authenticating a battery connected to the battery connecting section, where the authentication requesting device is arranged to change the authentication process depending on whether or not the receiving section is being supplied with power from the external power source. | 01-28-2010 |
| 20100084773 | SEMICONDUCTOR DEVICE AND METHOD OF BONDING WIRES BETWEEN SEMICONDUCTOR CHIP AND WIRING SUBSTRATE - A wiring substrate and a semiconductor chip mounted on the wiring substrate are connected together via a bonding wire. The distance from each end of the semiconductor chip to a wire bond pad provided on the wiring substrate is smaller than the height of the semiconductor chip. | 04-08-2010 |
| 20100193929 | SEMICONDUCTOR DEVICE - A semiconductor device includes a package board, first connectors, and a first multi-layered structure. The package board has first and second regions. The first connectors are in the first region. The first multi-layered structure includes a first semiconductor chip, a wiring board, and second to fifth connectors. The first semiconductor chip has first and second surfaces. The first surface covers the second region. The wiring board has third and fourth surfaces. The third surface is fixed to the second surface. The second to fourth connectors are in the center regions of the second to fourth surfaces, respectively. The fifth connectors are aligned along opposing two sides of the fourth surface. The second connectors electrically connect to the third connectors. The third connectors electrically connect to the fourth and fifth connectors. The first connectors electrically connect to the fourth and fifth connectors. | 08-05-2010 |
| 20100193933 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - In a semiconductor device of the present invention, a second semiconductor chip is stacked on a first semiconductor chip having a plurality of bonding pads in its central region, with a bonding layer interposed therebetween. A plurality of wires respectively connected to the plurality of bonding pads of the first semiconductor chip are led out to the outside over a peripheral edge of the first semiconductor chip by passing through a space between the first and second semiconductor chips. A retaining member for retaining at least a subset of the plurality of wires is provided in a region on the first semiconductor chip including a middle point between the bonding pads and the peripheral edge of the first semiconductor chip by using a material different from the bonding layer so that the subset of the wires is positioned generally at a center of the spacing between the first semiconductor chip and the second semiconductor chip. | 08-05-2010 |
| 20100208443 | SEMICONDUCTOR DEVICE - A semiconductor device reduces the impedance of a wiring for supplying the circuit excluding a data output circuit with a power source voltage or a ground voltage and of speedup of data signal transmission in the data output circuit. Additional substrates | 08-19-2010 |
| 20100224984 | SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRCUIT BOARD AND SEMICONDUCTOR CHIP ARE CONNECTED BY LEADS - A semiconductor device according to one embodiment has a wiring circuit board, a semiconductor chip, a die attach material and bumps. The semiconductor chip is mounted on the wiring circuit board. The die attach material is provided between the wiring circuit board and the semiconductor chip. A wiring layer is provided on one surface of the wiring circuit board. Leads are extended from the wiring layer and connected to the semiconductor chip. The bumps are provided at outer positions relative to the region where the semiconductor chip of the wiring circuit board is mounted. The wiring layer in the wiring circuit board is formed on the surface opposite from the surface on which the semiconductor chip is mounted. | 09-09-2010 |
| 20100289141 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device with a semiconductor chip mounted on a small-sized package substrate that has a large number of external connection terminals. The package substrate includes a slot, the external connection terminals, and bonding fingers. The bonding fingers are connected to the external connection terminals. The bonding fingers constitute a bonding finger arrangement in a central section and end sections of a bonding finger area along each longer side of the slot. The bonding finger arrangement includes a first bonding finger array, which is located at a close distance from the each longer side of the slot, and a second bonding finger array, which is located at a distance farther than the distance of the first bonding finger array from the each longer side of the slot. The central section of the bonding finger area includes at least the second bonding finger array, and the end sections of the bonding finger area includes the first bonding finger array. | 11-18-2010 |
| 20100295162 | Semiconductor device - Portions of a wiring layer extending like cantilevers from an inner peripheral edge of an opening in a substrate are joined to respective terminals of a semiconductor chip mounted on the substrate. A junction portion between each portion of the wiring layer and the corresponding terminal is sealed with resin. | 11-25-2010 |
