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Dae Jun Kim
Dae Jun Kim, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110083891 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a flexible film; an insulation layer formed on one side of the flexible film; an electronic component mounted on the one side of the flexible film in a face-down manner such that the electronic component is buried in the insulation layer; and a circuit layer including a connecting pattern which is formed on the one side of the flexible film and is connected with a connecting terminal of the electronic component by a connecting member. The electronic component-embedded printed circuit board is advantageous in that the position alignment between the connecting patterns and the connecting terminals is easy and the connection reliability therebetween is high because the connecting patterns formed on a flexible film are directly connected to the connecting terminals of an electronic component using connecting members, and in that the production cost thereof can be reduced because additional rewiring is not required. | 04-14-2011 |
| 20110083892 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an electronic component-embedded printed circuit board, which includes an insulating base, an insulating layer formed on one surface of the insulating base, an electronic component embedded in the insulating layer so that an active surface of the electronic component having a connection terminal faces the insulating base, a trench formed in the insulating base to expose the connection terminal, and a connection pattern formed and embedded in the trench, and in which the embedded connection pattern is finely formed by an imprinting process and is connected to the connection terminal of the electronic to component, thus obviating a need for an additional redistribution layer and reducing the manufacturing cost. A method of manufacturing such a printed circuit board is also provided. | 04-14-2011 |
Dae Jun Kim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20110072845 | REFRIGERANT INJECTION DEVICE FOR REFRIGERANT DESTRUCTION FACILITY - Featured is a refrigerant injection device which is particularly suitable for use in a refrigerant destruction facility using an incinerator. Such an injection device includes a storage device which stores the refrigerant and a decompressor fluidly coupled to the storage device. The injection device further includes two flow meters and a cutoff-valve that are fluidly coupled to the decompressor. The cutoff valve is configured to cut off the injection of refrigerant. The injection device further includes bypass flow members that are fluidly coupled to the two flow meters. The bypass flow members and flow meters are configured and arranged to selectively measure the flow rate and to perform flow meter calibration without stopping the feeding of refrigerant to the injection device. | 03-31-2011 |
Dae Jun Kim, Daejeon KR
| Patent application number | Description | Published |
|---|---|---|
| 20080252196 | Active-Matrix Field Emission Display - Provided is a field emission display (FED) in which field emission devices are applied to a flat panel display. The FED includes: a cathode plate including a substrate, first and second thin film transistors (TFTs) that are serially connected on the substrate, a field emitter disposed on a drain electrode of the second TFT, a gate insulating layer having a gate hole surrounding the field emitter, and field emission gate electrodes disposed on the gate insulating layer; and an anode plate including a substrate, and red, green, and blue phosphors disposed on the substrate, wherein the cathode plate and the anode plate are vacuum-packaged parallel and opposite to each other. According to the present invention, uniformity of the FED panel can be significantly improved, and an inherent source-drain leakage current of the TFT can be significantly reduced, so that a contrast ratio of the FED can be significantly enhanced. | 10-16-2008 |
| 20080284314 | Active-Matrix Field Emission Pixel and Active-Matrix Field Emission Display - Provided is a field emission display (FED) capable of driving on the basis of current and preventing leakage current caused by thin film transistors (TFTs). The FED includes: a plurality of unit pixels including an emission element in which cathode luminescence of a phosphor occurs and a TFT for driving the emission element; a current source for applying a scan signal to each unit pixel; and a voltage source for applying a data signal to each unit pixel. Here, the on-current of the current source is high enough to take care of the load resistance and capacitance of a scan row within a given writing time, and the off-current of the current source is so low that the electron emission of each pixel can be ignored. In addition, the pulse amplitude or pulse width of the data signal applied from the voltage source is changed, and thereby the gray scale of the display is represented. | 11-20-2008 |
| 20080299298 | Methods of Manufacturing Carbon Nanotube (Cnt) Paste and Emitter with High Reliability - Provided are methods of manufacturing carbon nanotube (CNT) paste, to which a nano-sized particle is added, and a CNT emitter with high reliability for a field emission display (FED). The method includes the steps of: (i) dispersing CNT powder in a solvent; (ii) adding an organic binder to the solution in which the CNT powder is dispersed; and (iii) performing a milling process to adjust viscosity of the dispersion solution to which the organic binder is added, wherein a nano-sized metal particle is added in step (i) or (iii). Accordingly, the nano-sized metal particle is added as a metal filler of the CNT paste, and thus a metal may be melted at a low temperature at which CNTs do not deteriorate. Thus, adhesion between the CNT paste and a cathode may be improved, and resistance between the cathode and the CNT or between CNTs may be reduced. Further, the CNT paste manufactured by the above method is employed in manufacturing the CNT emitter to thereby obtain uniform emission of electrons from the CNT emitter and increase electron emission sites, and thus the reliability of the CNT emitter may be further improved. | 12-04-2008 |
| 20100225225 | FIELD EMISSION BACK LIGHT UNIT, CATHODE STRUCTURE THEREOF AND METHOD FOR FABRICATING THE SAME - Provided is a field emission device, and more particularly, a field emission back light unit which makes an interconnection connected with an external electrode simple and capable of local dimming. To this end, a cathode structure for the field emission back light unit includes a plurality of data electrodes formed on a cathode substrate and spaced apart from one another, an insulating layer formed on the data electrodes, and having exposure regions exposing the predetermined data electrodes, cathode electrodes formed on the insulating layer and electrically connected with the data electrodes through the exposure regions, and at least one field emitter formed on the cathode electrodes, wherein a cathode block is defined based on the cathode electrodes electrically isolated from one another, and brightness of each cathode block can be controlled according to current supplied through the data electrode. | 09-09-2010 |
| 20100231119 | THE FIELD EMISSION DEVICE WITH FINE LOCAL DIMMING - Provided is a field emission device (FED) capable of fine local dimming. In the FED, a cathode substrate is comprised of a plurality of cathode layers, and a plurality of interconnections are disposed on each of the cathode layers, so that fine local dimming is enabled using a plurality of cathode blocks without limiting the number of the cathode blocks. Also, since RC delays of the respective cathode blocks can be synchronized according to the design of the interconnections, current control signals can be simultaneously transmitted to the respective cathode blocks, thereby improving the characteristics of the FED. | 09-16-2010 |
| 20100260321 | DISCRETELY ADDRESSABLE LARGE-AREA X-RAY SYSTEM - A discretely addressable large-area X-ray system is provided. The large-area X-ray system can output a uniform flux of X-rays over a large area using discrete addressing operation of transistors connected to cathodes of electron emitters. Thus, when applied to a medical device, the system can minimize damage inflicted upon the human body because it enables effective imaging of only a desired specific portion of the body. Furthermore, the large-area X-ray system can be simply implemented by current switching using transistors. Thus, the system can be very easily applied to other applications. | 10-14-2010 |
| 20110116603 | MICROMINIATURE X-RAY TUBE WITH TRIODE STRUCTURE USING A NANO EMITTER - A microminiature X-ray tube with a triode structure using a nano emitter is provided, which can increase a field emission region as much as possible by means of nano emitters fine-patterned in a cathode to not only increase an emission current per unit area as much as possible but secure high electrical characteristics, reliability, and structural stability by means of a cover and a bonding material. In addition, gate holes having a macro structure can be formed in the gate to promote electron beam focusing by means of the gate without using a separate focusing electrode and to prevent a leakage current from occurring on the gate. Further, an auxiliary electrode can be formed on a top or an inner surface of a cover applied for structural stability to further promote the electron beam focusing and to control the output amounts per individual X-ray tubes output according to current switching to be equal to each other. | 05-19-2011 |
Dae Jun Kim, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100024203 | MANUFACTURING METHOD OF ELECTRODE FOR BATTERY - This invention relates to a method of manufacturing an electrode for a secondary battery, which enables cost savings and the manufacture of products having various sizes and shapes. The method includes (A) preparing an electrode plate, (B) cutting the electrode plate to conform to the width of the electrode, thus providing a unit electrode plate, and (C) removing at least one of the corner regions of the unit electrode plate. | 02-04-2010 |
Dae Jun Kim, Daegu KR
| Patent application number | Description | Published |
|---|---|---|
| 20090058309 | FIELD EMISSION DEVICE - Disclosed is a field emission device. The field emission device includes: an anode substrate including an anode electrode formed on a surface thereof and a fluorescent layer formed on the anode electrode; a cathode substrate disposed opposite to and spaced apart from the anode substrate, and including at least one cathode electrode formed toward the anode substrate and a field emitter formed on each cathode electrode; and a gate substrate having one surface in contact with the cathode substrate, wherein the gate substrate include gate insulators surrounding the field emitters and having a plurality of openings exposing the field emitters, and a plurality of gate electrodes formed on the gate insulators around the openings and electrically isolated from one another. Thus, when the trajectories of the electron beams emitted from the emitters are rapidly changed over time by a voltage difference between the gate electrodes, an electron beam-scanned area can be expanded due to residual images and the electron beam can be more uniformly emitted due to an electron beam scattering effect and a linear beam spreading effect, resulting in improved emission uniformity of the fluorescent layer. | 03-05-2009 |
Dae Jun Kim, Gyeonggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20080304821 | Camera module package and method of manufacturing the same - The present invention relates to a camera module package having flexibility and a method of manufacturing the same. Provided is the camera module package according to the invention including a silicon wafer mounted with the image sensor in the center of a top surface thereof and provided with pads both sides of the image sensor, a lens unit opened to form a convex lens in a mounting portion of the image sensor in an upper part of the wafer, and a flexible board tightly joined to a bottom surface of the wafer and electrically connected to the pads by an internal pattern. The camera module package can be thinly manufactured and since the camera module package has flexibility, the camera module package can be easily attached to a bendable substrate and to the inside an IT apparatus. | 12-11-2008 |
| 20090014827 | Image sensor module at wafer level, method of manufacturing the same, and camera module - Provided is an image sensor module at the wafer level including a wafer; an image sensor mounted on one surface of the wafer; a wireless communication chip formed outside the image sensor on the one surface of the wafer; and a protective cover installed on the one surface of the wafer. | 01-15-2009 |
Dae Jun Kim, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20080296577 | Camera module package - There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability. | 12-04-2008 |
| 20080296714 | Wafer level package of image sensor and method for manufacturing the same - Provided is a wafer level package of an image sensor capable of simply and easily packaging an image sensor in a packaging process, and a method for manufacturing the same. The wafer level package of an image sensor includes a lower substrate including an image sensor, a conductive pattern coupled to the image sensor, and a plurality of vias coupled to the conductive pattern; a micro lens array film having a plurality of micro lenses corresponding to the image sensor, the micro lenses being formed on the lower substrate; and a sealing line surrounding the image sensor while being spaced apart from the image sensor and being in contact with an upper substrate. The wafer level package may be useful to have an electrical connection structure using vias without any need to a bonding wire, an electrode pad and an electrode lead in the conventional wafer level package since a packaging process is carried out by bonding a wafer for an upper substrate with a plurality of the vias being provided in a wafer for a lower substrate | 12-04-2008 |