Patent application number | Description | Published |
20100027137 | Lens module - A lens module includes a first lens, a second lens, a spacer, a seating part, and a protrusion part. The first lens includes a lens surface and a rib. The second lens is laminated on the first lens. The spacer maintains a predetermined interval between the first lens and the second lens. The seating part is disposed between the lens surface of the first lens and the rib and allows the spacer to be seated on the upper part of the first lens. The protrusion part includes a plurality of protrusions protruded from an undersurface of the spacer, which allow a height of the spacer seated on the seating part to change when the spacer is decentered. | 02-04-2010 |
20100252305 | CIRCUIT BOARD MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions. | 10-07-2010 |
20110000701 | Ceramic elements module and manufacturing method thereof - The present invention relates to a ceramic elements module and a manufacturing method thereof. There is provided a ceramic elements module, including: a ceramic elements that has a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted, and a manufacturing method thereof. | 01-06-2011 |
20110061919 | Low temperature co-fired ceramics assembling system and method thereof - A low temperature ceramics substrate, a low temperature ceramics assembling system, and a method thereof in which a fixing member is formed on the bottom of an LTCC substrate, an insertion hole is formed at a coupled portion on a fixing member of the LTCC substrate coupled onto the heat sink, the fixing member is inserted into the insertion hole when the LTCC substrate and the heat sink are coupled to each other to firmly achieve alignment and fixation by the fixing member and a ceramic laminate assembling system includes a ceramic laminate substrate including an electronic component mounted on the bottom thereof and a fixing member is formed at one side thereof; and a heat sink including a sensor holder onto which the electronic component is held and an insertion groove is provided at a portion corresponding to the fixing member. | 03-17-2011 |
20110061929 | Optimized power package for electrical device - Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case. | 03-17-2011 |
20110079420 | Ceramic multilayer and method for manufacturing the same - The present invention provides a multi-layered ceramic substrate including a first insulating sheet having a first via contact; and a second insulating sheet joined to the first insulating sheet, wherein the second insulating sheet has a second via contact aligned with the first via contact up and down to be joined to the first via contact, wherein the first via contact has a form extended to the inside of the second via contact. | 04-07-2011 |
20110149530 | PRINTED CIRCUIT BOARD ASSEMBLY - There is provided a printed circuit board assembly including a printed circuit board having a plurality of circuit elements mounted on an upper surface thereof, and a power line mounted on a lower surface of the printed circuit board and supplying power to the circuit elements. | 06-23-2011 |
20110168439 | MULTILAYER CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a multilayer ceramic circuit board. A multilayer ceramic circuit board according to an aspect of the invention may include: preparing a plurality of ceramic green sheets; forming a recess having a desired line shape and a via hole connected to the recess in at least one of the plurality of ceramic green sheets; forming a conductive via by filling the via hole with a conductive material; forming a circuit line connected to the conductive via by filling the recess with a conductive material; stacking the plurality of ceramic green sheets upon one another to thereby form a ceramic green sheet stack; and sintering the ceramic green sheet stack. | 07-14-2011 |
20120037408 | METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME - There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof. | 02-16-2012 |
20120040125 | METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE USING THE SAME - A method for manufacturing a ceramic substrate, and a ceramic substrate using the same are disclosed. The method for manufacturing a ceramic substrate includes: forming a first adhesive layer on a blister formed on a substrate; filling the blister having the first adhesive layer formed thereon with a filler; and hardening the ceramic substrate. A blister formed on the ceramic substrate can be removed to make the substrate have a smooth surface, thus improving reliability. | 02-16-2012 |
20130000958 | MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a multilayer ceramic substrate and a method for manufacturing the same. In a method for manufacturing the multilayer ceramic substrate, which has a ceramic laminate including multiple ceramic layers and allowing interconnection between layers through vias respectively formed in the multiple ceramic layers, the method includes: preparing a ceramic laminate in which a void is formed around a via in at least one ceramic layer of multiple ceramic layers; immersing the ceramic laminate in a precipitating bath in which an electrode solution is contained; putting the ceramic laminate out of the precipitating bath after a predetermined period of time, and then removing a nanoparticle film stacked on a surface of a multilayer ceramic substrate; and applying heat to the multilayer ceramic substrate to form nanoparticles filling an inside of the void, after the removing of the nanoparticle film. | 01-03-2013 |
20130043064 | CERAMIC ELEMENTS MODULE - A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted. | 02-21-2013 |
20130162278 | PROBE PIN, PROBE CARD USING THE PROBE PIN, AND METHOD OF MANUFACTURING THE PROBE CARD - There is provided a probe card, including: a substrate having a plurality of grooves formed in one surface thereof; and at least one probe pin having a plurality of substrate combining protrusions formed on one surface thereof and corresponding to the plurality of grooves, the plurality of substrate combining protrusions having heights corresponding to the plurality of grooves. | 06-27-2013 |
20130162280 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - There are provided a probe card and a method of manufacturing the same, in which an electrode pad having a probe pin bonded thereto may be prevented from being delaminated from a substrate. The probe card according to embodiments of the present invention may include a ceramic substrate including at least one pad groove formed in one surface thereof and an electrode pad embedded in the pad groove; and a probe pin bonded to the electrode pad. | 06-27-2013 |
20140318838 | METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME - There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof. | 10-30-2014 |