Patent application number | Description | Published |
20090147575 | NOR FLASH MEMORY DEVICE WITH A SERIAL SENSING OPERATION AND METHOD OF SENSING DATA BITS IN A NOR FLASH MEMORY DEVICE - In a NOR flash memory device with a serial sensing operation, and method of sensing data bits in a NOR flash memory device, the device includes a multilevel cell, a sense amplifying circuit, a data buffer, a data latch circuit, and a control logic circuit. The sense amplifying circuit serially detects plural data bits stored in the multilevel cell. The data buffer is provided to buffer the data bit detected by the sense amplifier. The data latch circuit stores an output value of the data buffer for a time. The control logic circuit regulates the sense amplifying circuit to detect a lower data bit stored in the multilevel cell in response to a higher data bit held in the data latch. Here, the control logic circuit initializes an output terminal of the data buffer before or while sensing each of the plural data bits by the sense amplifier. According to the invention, a stabilized serial sensing operation can be conducted because the data line is conditioned to a uniform charge level regardless of the level of the data bit previously sensed. | 06-11-2009 |
20100214843 | NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM HAVING THE SAME - A non-volatile memory device including a cell array having memory cells arranged at intersections of word lines and bit lines; an address decoder configured to select one of the word lines in response to an address; a write circuit configured to write program data in memory cells connected with the selected word line; and a control circuit configured to control the address decoder and the write circuit such that a plurality of band program (write) operations are sequentially executed during a write operation, wherein the control circuit is further configured to select each band write operation the optimal write condition of the next band write operation. A plurality of available write conditions are stored as trim information in a plurality of registers. The control circuit selects the register storing information for performing programming under the optimal write condition. | 08-26-2010 |
20100254193 | WIRITING METHOD OF A NONVOLATILE MEMORY DEVICE - A method of performing a writing operation of a nonvolatile memory device is provided. The method includes performing a first band program using trim information from a first band register of multiple band registers, which include at least a default band register; and performing a second band program using trim information from a second band register or trim information from the default band register after performing the first band program. The second band register is selected while the first band program is being performed. | 10-07-2010 |
20130235648 | RESISTIVE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A resistive memory device comprises a resistive memory cell, and a read/program circuit configured to program the resistive memory cell from a first state to a second state. The read/program circuit reads a resistance in the first state of the resistive memory cell and adjusts a compliance current supplied to the resistive memory cell according to the read resistance during the program operation. | 09-12-2013 |
20140347927 | NONVOLATILE MEMORY DEVICE HAVING SPLIT GROUND SELECTION LINE STRUCTURES - A nonvolatile memory device comprises a plurality of vertical NAND flash memory cells arranged in a three dimensional (3D) structure, a first memory block disposed in the 3D structure and having memory cells selected by a first ground selection line and a second ground selection line, wherein the first and second ground selection lines are electrically separated from each other, a second memory block disposed in the 3D structure and having memory cells selected by a third selection line and fourth selection line, wherein the third and fourth ground selection lines are electrically separated from each other, and a pass transistor that transfers a driving signal to turn on ground selection transistors respectively connected to the first and third ground selection lines in response to a block selection signal. | 11-27-2014 |
20150111724 | VISIBLE LIGHT RESPONSIVE PHOTOCATALYST BY HYDROPHILIC MODIFICATION USING POLYMER MATERIAL AND A METHOD FOR PREPARING THE SAME - The present invention relates to a visible light-responsive photocatalyst with an excellent removal efficiency of environmental contaminants, and a method of preparing the same. | 04-23-2015 |
Patent application number | Description | Published |
20110267112 | OUTPUT DRIVER AND SEMICONDUCTOR APPARATUS HAVING THE SAME - An output driver includes: a pull-up signal generation unit configured to control a pulse width of first data and output a pull-up pre-drive signal; a pull-down signal generation unit configured to control a pulse width of second data and output a pull-down pre-drive signal; a pull-up pre-driver unit configured to receive the pull-up pre-drive signal and generate a pull-up main drive signal; a pull-down pre-driver unit configured to receive the pull-down pre-drive signal and generate a pull-down main drive signal; a pull-up main driver unit configured to charge an output node according to the pull-up main drive signal; and a pull-down main driver unit configured to discharge the output node according to the pull-down main drive signal. | 11-03-2011 |
20110267124 | CLOCK SIGNAL DUTY CORRECTION CIRCUIT - A clock signal duty correction circuit includes: a first transition timing control unit configured to generate a first control signal for controlling a rising timing of a duty correction clock signal by using a clock signal; a second transition timing control unit configured to generate a second control signal for varying a falling timing of the duty correction clock signal by using the clock signal according to a code signal; and a differential buffer unit configured to generate the duty correction clock signal, whose rising time or falling time is adjusted, in response to the first control signal and the second control signal. | 11-03-2011 |
20120195153 | SEMICONDUCTOR SYSTEM AND SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes an odd data clock buffer group configured to maintain or shift a phase of a multi-phase source clock signal, and output a first multi-phase clock signal, an even data clock buffer group configured to maintain or shift a phase of the multi-phase source clock signal, and output a second multi-phase clock signal, an odd data output buffer group configured to drive odd data in response to the first multi-phase clock signal and output the driven data to an odd data pad group, and an even data output buffer group configured to drive even data in response to the second multi-phase clock signal and output the driven data to an even data pad group, wherein the phases of clock signals of the first and second multi-phase clock signal are different from each other. | 08-02-2012 |
20120250402 | SEMICONDUCTOR MEMORY APPARATUS - A semiconductor memory apparatus includes a resistive memory cell; a data sensing unit configured to sense an output voltage, formed by a sensing current supplied to the resistive memory cell, based on a reference voltage, and output data having a value corresponding to the sensing result; and a reference voltage generation unit comprising a dummy memory cell including first and second resistors having first and second resistance values, respectively, and configured to output a voltage formed by the sensing current supplied to the dummy memory cell as the reference voltage. | 10-04-2012 |
20130135038 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes a power supply changing unit. The power supply changing unit is configured to receive an enable signal and power supply voltage, generate first voltage or second voltage according to the enable signal, change a voltage level of the second voltage according to a level signal, and supply the first voltage or the second voltage as a driving voltage of an internal circuit, wherein the internal circuit receives a first input signal to output a second input signal. | 05-30-2013 |
20130342245 | RESET SIGNAL GENERATION APPARATUS - A reset signal generation apparatus includes a reset signal generation unit and a reset signal expansion unit. The reset signal generation unit enables a reset signal and an enable signal in response to a reset input signal, and disables the reset signal in response to a pulse width extension signal. The reset signal expansion unit generates the pulse width extension signal that is enabled for a predetermined time, in response to the enable signal. | 12-26-2013 |
20130342250 | DELAY CONTROL CIRCUIT AND CLOCK GENERATION CIRCUIT INCLUDING THE SAME - A clock generation circuit includes a delay line, which delays an input clock and generates a delayed clock, a delay modeling unit, which delays the delayed clock by a modeled delay value and generates a feedback clock, a phase detection unit, which compares phases of the input clock and the feedback clock and generates a phase detection signal, a filter unit, which receives the phase detection signal and generates phase information, generates an update signal when a difference between the numbers of phase detection signals with a first and a second level generated is greater than or equal to a threshold value, and generates the update signal after a lapse of a predetermined time when the difference is less than the threshold value, and a delay line control unit, which sets a delay value of the delay line in response to the update signal and the phase information. | 12-26-2013 |
20140002149 | CLOCK GENERATION CIRCUIT AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME | 01-02-2014 |
20140002154 | DELAY CIRCUIT AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME | 01-02-2014 |
Patent application number | Description | Published |
20100148317 | CRITICAL DIMENSION REDUCTION AND ROUGHNESS CONTROL - A method for forming a feature in an etch layer is provided. A photoresist layer is formed over the etch layer. The photoresist layer is patterned to form photoresist features with photoresist sidewalls. A control layer is formed over the photoresist layer and bottoms of the photoresist features. A conformal layer is deposited over the sidewalls of the photoresist features and control layer to reduce the critical dimensions of the photoresist features. Openings in the control layer are opened with a control layer breakthrough chemistry. Features are etched into the etch layer with an etch chemistry, which is different from the control layer break through chemistry, wherein the control layer is more etch resistant to the etch with the etch chemistry than the conformal layer. | 06-17-2010 |
20120309201 | CRITICAL DIMENSION REDUCTION AND ROUGHNESS CONTROL - A method for forming a feature in an etch layer is provided. A photoresist layer is formed over the etch layer. The photoresist layer is patterned to form photoresist features with photoresist sidewalls. A control layer is formed over the photoresist layer and bottoms of the photoresist features. A conformal layer is deposited over the sidewalls of the photoresist features and control layer to reduce the critical dimensions of the photoresist features. Openings in the control layer are opened with a control layer breakthrough chemistry. Features are etched into the etch layer with an etch chemistry, which is different from the control layer break through chemistry, wherein the control layer is more etch resistant to the etch with the etch chemistry than the conformal layer. | 12-06-2012 |
20130074769 | APPARATUS FOR THE DEPOSITION OF A CONFORMAL FILM ON A SUBSTRATE AND METHODS THEREFOR - A method for depositing a conformal film on a substrate in a plasma processing chamber of a plasma processing system, the substrate being disposed on a chuck, the chuck being coupled to a cooling apparatus, is disclosed. The method includes flowing a first gas mixture into the plasma processing chamber at a first pressure, wherein the first gas mixture includes at least carbon, and wherein the first gas mixture has a condensation temperature. The method also includes cooling the chuck below the condensation temperature using the cooling apparatus thereby allowing at least some of the first gas mixture to condense on a surface of the substrate. The method further includes venting the first gas mixture from the processing chamber; flowing a second gas mixture into the plasma processing chamber, the second gas mixture being different in composition from the first gas mixture; and striking a plasma to form the conformal film. | 03-28-2013 |