Da Hee
Da Hee Jeong, Seoul KR
Patent application number | Description | Published |
---|---|---|
20150068455 | METHOD OF MANUFACTURING METAL MASK AND METAL MASK FORMED THEREBY - Disclosed is a method of manufacturing a metal mask. A method of manufacturing a metal mask in accordance with an exemplary embodiment of the present invention includes forming through holes in a plate using a laser, by scanning the laser onto sequentially smaller overlapping portions of the plate. | 03-12-2015 |
Da Hee Jeong, Geumcheon-Gu KR
Patent application number | Description | Published |
---|---|---|
20150104608 | METAL MASK AND MANUFACTURING METHOD THEREOF - A manufacturing method of a metal mask including a plurality of pattern openings includes forming a first depression portion by radiating a first laser beam focused on a plane beyond a subject under processing, and then forming the plurality of pattern openings at a bottom part of the first depression portion by radiating a second laser beam focused on the bottom part of the first depression portion. Because the energy of the second laser beam is less than the first laser beam, manufacturing time of the mask is reduced while the sidewalls of the pattern opening are smooth and may be inclined, to allow for a better deposition of organic emission material onto a large display. | 04-16-2015 |
Da Hee Kim, Seoul KR
Patent application number | Description | Published |
---|---|---|
20160081195 | DETACH CORE SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF - The present invention relates to a detach core substrate and a method of manufacturing a detach core substrate. In accordance with one embodiment of the present invention, there is proposed a detach core substrate that a conductive layer including a metal layer with an etching property different from copper is formed on a top surface and a bottom surface of an insulating layer formed thereon a surface roughness. At this time, the contact interface between the top surface and the bottom surface of the insulating layer is the detachment interface to be separated during the manufacture of the circuit board. In addition, a method of manufacturing the detach core substrate is proposed. | 03-17-2016 |
Da Hee Kim, Suwon KR
Patent application number | Description | Published |
---|---|---|
20140102766 | MULTI-LAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a multi-layer type coreless substrate, including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated on one surface or both surfaces of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting a pillar disposed on an outermost insulating layer of the plurality of insulating layers. | 04-17-2014 |
20140102767 | MULTI-LAYER TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer. | 04-17-2014 |
Da Hee Kim, Gyunggi-Do KR
Patent application number | Description | Published |
---|---|---|
20140014398 | CORELESS SUBTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a coreless substrate according to a preferred embodiment of the present invention, the coreless substrate including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a direction of one surface or both surfaces of the first insulating layer, including at least one circuit layer and at least one another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers. | 01-16-2014 |
20140027156 | MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a multilayer type coreless substrate, the method including: (A) preparing a carrier substrate including at least one copper foil formed on one surface or both surfaces of an insulating surface; (B) forming a coreless printed circuit precursor on one surface or both surfaces of the carrier substrate; (C) separating the carrier substrate; (D) performing a polishing cutting process on the coreless printed circuit precursor; and (E) laminating a plurality of other insulating layers on a flat outer surface of the coreless printed circuit precursor, the plurality of other insulating layers sequentially including other circuit layers and other pillars. | 01-30-2014 |
Da Hee Kim, Suwon-Si KR
Patent application number | Description | Published |
---|---|---|
20150061093 | INTERPOSER AND SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING INTERPOSER - Disclosed herein is an interposer, including: an interposer substrate configured by stacking an insulating layer of one layer or more and interlayer connected through a via; a cavity penetrating through a center of the interposer substrate in a thickness direction; and a connection electrode having a post part which is disposed on at least one of an upper surface and a lower surface of the interposer substrate, thereby increasing electrical characteristics and reducing manufacturing cost and time. | 03-05-2015 |
20150101857 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - There is provided a method for manufacturing a printed circuit board including: preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating seed layer on the insulating layer and the exposed conductive layer; forming an electroplating layer on the plating seed layer by overplating the plating seed layer; and etching the overplated portion in a lump to form a circuit layer in the opening. | 04-16-2015 |
20150129291 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board, including: a substrate; a seed layer formed on the substrate; and a circuit pattern formed on the seed layer and formed so that a diameter of an upper portion thereof and a width of a lower portion thereof are equal to each other or a diameter of the lower portion is larger than that of the upper portion. Therefore, the printed circuit board according to a preferred embodiment of the present invention forms the circuit pattern having the lower portion having the diameter larger than that of the upper portion, such that the electrical signal loss may be decreased and separation of the circuit pattern may be prevented, thereby improving whole reliability of the board. | 05-14-2015 |
Da Hee Lee, Uiwang-Si KR
Patent application number | Description | Published |
---|---|---|
20130141786 | OPTICAL MEMBER AND DISPLAY APPARATUS INCLUDING THE SAME - An optical member, an optical adhesive, and a display apparatus, the optical member including a transparent conductive film; an optical adhesive layer on the transparent conductive film; and a polarizer plate stacked on the optical adhesive layer, wherein a surface resistance difference Rs2−Rs1 of a specimen including the optical adhesive layer is less than about 0.2Ω, the specimen being prepared by manufacturing the polarizer plate having the optical adhesive layer thereon and stacking two transparent conductive films on opposite upper sides of the optical adhesive layer, where Rs1 is an initial surface resistance of the specimen and Rs2 is a surface resistance of the specimen kept at 70° C. and 95% RH for 48 hours. | 06-06-2013 |
Da-Hee Jeong, Daegu-City KR
Patent application number | Description | Published |
---|---|---|
20080274205 | Ena Mineral Bioactive Solution, Manufacturing Method Thereof and Its Application for the Osteoporosis Prevention - The present invention is related to a method of manufacture of an alkaline mineral bioactive solution of which raw materials are squid bones burnt at a high temperature and crushed powder of red seaweeds and to compositions and health foods having the efficacy for the prevention of osteoporosis. The alkaline aqueous solutions having abundant minerals of the present invention may be used for bioactive solutions having the efficacy for the prevention and improvement of osseous diseases such as osteolysis and osteoporosis in mammals including human beings. | 11-06-2008 |
20090104340 | NATURAL BEAN-CURD AND ITS PREPARATION METHOD - The present invention relates to natural and functional bean-curd having good storage stability and comprising various nutrients contained in Japanese apricots and red algae as well as those of soybean, which is—prepared by using fruit vinegar and red algae as natural coagulant. In the present invention, red algae and fruit vinegar employed as coagulant serves day as inorganic salts and as organic acid, respectively, to coagulate bean-curd, so that two coagulation principles work together, and thus it is distinguishable from conventional process for preparing bean-curd. The process according to the present invention comprises the steps of 1) washing and immersing soybean with water; 2) adding water and finely pulverizing the mixture by the use of a mixer to prepare bean paste! 3) heating the bean paste and removing bean-curd dregs to provide soybean milk; 4) introducing natural coagulant thereto and coagulating the soybean milk with stirring to provide uncurdled bean-curd; and 5) pouring the uncurdled bean-curd on a mold on which a hemp cloth is laid and compressing it to provide bean curd. | 04-23-2009 |
Da-Hee Lee, Suwon-Si KR
Patent application number | Description | Published |
---|---|---|
20120183696 | PLATING METHOD USING ANALYSIS PHOTORESIST RESIDUE IN PLATING SOLUTION - A plating method includes supplying a plating solution into a plating bath, immersing a first substrate having a lower metal interconnection and a photoresist pattern in the plating solution, performing a first plating process and forming a first plating pattern on the first substrate, removing the first substrate from the plating solution, collecting a sample of the plating solution, analyzing a photoresist residue included in the sample, immersing a second substrate in the plating solution, and performing a second plating process and forming a second plating pattern on the second substrate. | 07-19-2012 |
Da-Hee Lim, Gyeonggi-Do KR
Patent application number | Description | Published |
---|---|---|
20150054767 | ELECTRONIC DEVICE AND METHOD OF CONTROLLING TOUCH REACTIVITY OF ELECTRONIC DEVICE - An electronic device includes a touch screen unit; and a controller for, when an application is executed, changing the touch reactivity of the touch screen unit in accordance with the application. | 02-26-2015 |