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Cruz, PH
Erwin Victor Cruz, Koronadal City PH
| Patent application number | Description | Published |
|---|---|---|
| 20090057855 | SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES - A semiconductor die package. It includes a semiconductor die including a first surface and a second surface opposite the first surface, an optional conductive structure, and a leadframe structure. The leadframe structure comprises a central portion suitable for supporting the semiconductor die, and a plurality of stand-off structures coupled to the central portion of the leadframe structure. The stand-off structures can support the conductive structure, and the conductive structure is attached to the second surface of the semiconductor die. | 03-05-2009 |
| 20100258923 | PRE-MOLDED CLIP STRUCTURE - A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed. | 10-14-2010 |
| 20100258924 | PRE-MOLDED CLIP STRUCTURE - A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed. | 10-14-2010 |
Erwin Victor R. Cruz, Koronadal City PH
| Patent application number | Description | Published |
|---|---|---|
| 20090186452 | DUAL METAL STUD BUMPING FOR FLIP CHIP APPLICATIONS - A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed to the conductive region on the semiconductor die. The coated wire is cut, thereby leaving a conductive stud bump on the conductive region, where the conductive stud bump includes an inner conductive portion and an outer oxidation-resistant layer. | 07-23-2009 |
| 20100193921 | SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME - A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly. | 08-05-2010 |
Robert Ryan Fresnoza Cruz, Mandaue City PH
| Patent application number | Description | Published |
|---|---|---|
| 20100013143 | Method for Dynamically Lifting Elevator Platform of Media Input Tray During Ongoing Media Process - A method for dynamically lifting an elevator includes picking a sheet from a stack to feed to a media process where the stack is on a platform that can be lifted by an elevator, performing the media process, sensing a top of the stack to detect presence or absence of the stack at a media home position, sensing the top of the stack to detect presence or absence of the stack on the platform, sensing the platform to detect its presence or absence at a maximum elevator level, and indexing the stack at least once by lifting the platform through a given distance, during the media process and not during picking a sheet, unless presence of the top of the stack at the media home position is sensed or absence of media sheets on the elevator platform is sensed or presence of the elevator platform at the maximum elevator level is sensed. | 01-21-2010 |
| 20100038844 | Media Handling System for Maintaining Stack Top Within Given Range of Pick Positions During Feeding Sheets From Stack Top - A media handling system includes a platform, a bin supporting the platform below and for undergoing movement toward and away from a sheet feeding position, a first motion transmitting assembly coupled between the platform and bin and tailored to counterbalance the weight of the platform and any stack such that as the weight decreases the platform is lifted toward the sheet feeding position to maintain the stack top below a lower limit position thereof, a control mechanism to sense the position of the stack top relative to a given range between the lower limit position to an upper home position, and a second motion transmitting assembly drivingly coupled to the platform via the first motion transmitting assembly and responsive to the control mechanism sensing to cause the first motion transmitting assembly to further lift the platform to and maintain the stack top position within the given range. | 02-18-2010 |