| Patent application number | Description | Published |
|---|
| 20090009752 | Method And Apparatus For Referencing A MEMS Device - A method and an apparatus for calibrating a MEMS actuator of a hybrid MEMS-PLC optical switch or router is described. Two calibrating waveguides, embedded monolithically adjacent to the waveguides that provide the PLC output functions, are used for referencing a MEMS mirror tilt angle by maximizing optical coupling of light, reflected off the MEMS mirror, into one or each of the two calibrating waveguides. The input light is provided by either a waveguide carrying a live optical signal, or by a special input waveguide, coupled to an LED, for providing a calibrating light. Two emitting waveguides, embedded monolithically adjacent to the waveguides that provide the PLC input functions, can be used. | 01-08-2009 |
| 20090046288 | Scanning Spectrometer With Multiple Photodetectors - A scanning optical spectrometer with a detector array is disclosed, in which position of focused spot of light at the input of a dispersive element such as arrayed waveguide grating (AWG) with a slab input, is scanned using a micro-electro-mechanical (MEMS) tiltable micromirror so as to make the dispersed spectrum of light scan over the detector array coupled to the AWG. Sub-spectra recorded using individual detectors are concatenated by a processor unit to obtain the spectrum of input light. | 02-19-2009 |
| 20090121732 | TEMPORARY PLANAR ELECTRICAL CONTACT DEVICE AND METHOD USING VERTICALLY-COMPRESSIBLE NANOTUBE CONTACT STRUCTURES - A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface. | 05-14-2009 |
| 20090263142 | TUNABLE OPTICAL FILTER - A tunable PLC optical filter having sequentially connected thermally tunable Mach-Zehnder (MZ) interferometers is described. The MZ interferometers, having free spectral ranges matching ITU frequency grid spacing, are tuned so as to have a common passband centered on the frequency of the signal being selected, while having at least one of the stopbands centered on any other ITU frequency. Any other optical channel that may be present at any other ITU frequency is suppressed as a result. The PLC chip, including a zero-dispersion lattice-filter interleaver stage, a switchable fine-resolution stage and, or a retroreflector for double passing the filter, is packaged into a hot-pluggable XFP transceiver package. A compensation heater is used to keep constant the amount of heat applied to the PLC chip inside the XFP package, so as to lessen temperature variations upon tuning of the PLC optical filter. | 10-22-2009 |
| 20110018566 | TEMPORARY PLANAR ELECTRICAL CONTACT DEVICE AND METHOD USING VERTICALLY-COMPRESSIBLE NANOTUBE CONTACT STRUCTURES - A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface. | 01-27-2011 |
| 20110096326 | SCANNING SPECTROMETER WITH MULTIPLE PHOTODETECTORS - A scanning optical spectrometer with a detector array is disclosed, in which position of focused spot of light at the input of a dispersive element such as arrayed waveguide grating (AWG) with a slab input, is scanned using a micro-electro-mechanical (MEMS) tiltable micromirror so as to make the dispersed spectrum of light scan over the detector array coupled to the AWG. Sub-spectra recorded using individual detectors are concatenated by a processor unit to obtain the spectrum of input light. | 04-28-2011 |
