Cowens
J. Wayne Cowens, Durango, CO US
Patent application number | Description | Published |
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20140037620 | Methods of Treating Breast Cancer with Gemcitabine Therapy - The application describes methods for predicting overall survival in subjects with breast cancer. The application also describes for screening subjects with breast cancer to determine if the breast cancer will be responsive to a breast cancer therapy including gemcitabine. The application further describes methods for treating subjects with breast cancer by screening them for the likelihood of the effectiveness of treating the cancer with a therapy including gemcitabine and administering the therapy in subjects when it is found that gemcitabine is likely to be effective. | 02-06-2014 |
Marvin W. Cowens, Plano, TX US
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20090039524 | METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE - Methods and apparatus to support an overhanging region of stacked die are disclosed. A disclosed method comprises bonding a first die onto a substrate, placing a support element on the substrate; and bonding a second die onto the first die, wherein the second die overhangs at least one edge of the first die and the support element is positioned to limit bending of the second die. | 02-12-2009 |
Marvin Wayne Cowens, Plano, TX US
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20100159644 | LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM - Various exemplary embodiments provide materials and methods for flip-chip packaging technology. The disclosed flip-chip packaging technology can use a single B-stage wafer-applied photo-sensitive adhesive along with printed interconnects, which does not include conventional underfill materials and processes. In one embodiment, a photo-sensitive adhesive can be applied on a semiconductor die or a base substrate with conductive bumps printed in through-openings of the photo-sensitive adhesive. One or more semiconductor dies can be laterally packaged or vertically stacked on the base substrate using the printed conductive bumps as interconnects there-between. | 06-24-2010 |
20130307141 | Wire-Based Methodology of Widening the Pitch of Semiconductor Chip Terminals - A packaged semiconductor device ( | 11-21-2013 |
Wayne Cowens US
Patent application number | Description | Published |
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20160097105 | METHOD FOR USING GENE EXPRESSION TO DETERMINE PROGNOSIS OF PROSTATE CANCER - Molecular assays that involve measurement of expression levels of prognostic biomarkers, or co-expressed biomarkers, from a biological sample obtained from a prostate cancer patient, and analysis of the measured expression levels to provide information concerning the likely prognosis for said patient, and likelihood that said patient will have a recurrence of prostate cancer, or to classify the tumor by likelihood of clinical outcome or TMPRSS2 fusion status, are provided herein. | 04-07-2016 |