Compen
Hendrikus Antonis Cornelus Compen, Budel NL
Hendrikus Antonius Cornelus Maria Compen, Budel NL
Patent application number | Description | Published |
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20080262324 | Measurement Head For Non-Invasive Blood Analysis - The present invention provides an efficient approach of attaching and fixing a measurement head for a spectroscopic system to a variety of different parts of the skin of a patient. The measurement head preferably features a compact design providing a flexible handling and offering a huge variety of application areas taking into account the plurality of properties of various portions of the skin. Furthermore, the measurement head features a robust and uncomplicated optical design not requiring a lateral shifting of the optical axis of the objective. Such transverse relative movements between the objective and a capillary vessel in the skin are preferably performed by mechanically shifting the skin with respect to the objective of the measurement head. Moreover, the measurement head is adapted to host one or more pressure sensors measuring the contact pressure between the measurement head and the skin. This pressure information can further be exploited in order to calibrate the spectroscopic analysis means, to regulate the contact pressure within predefined margins specifying an optimum range of contact pressure for spectroscopic examination of capillary vessels. | 10-23-2008 |
Rene Theodorous Petrus Compen, Valkenswaard NL
Patent application number | Description | Published |
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20090180095 | Method of Placing a Substrate, Method of Transferring a Substrate, Support System and Lithographic Projection Apparatus - A method is provided for placing a substrate onto a surface of a substrate holder, the surface having a plurality of burls. First substrate placement data is calculated. This data enables placement of the substrate at a certain position with respect to a position of the plurality of burls on the surface of the substrate holder. Then, the substrate is placed at the certain position in accordance with the substrate placement data. The certain position may be based on the position at which placement would result in a minimized overlay error or may be based on the position at which placement would result in minimized substrate deformation. | 07-16-2009 |
Rene Theodorus Compen, Valkenswaard NL
Patent application number | Description | Published |
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20100195080 | Clamping Device And Object Loading Method - The present invention relates to a c lamping device configured to clamp an object ( | 08-05-2010 |