Co.,ltd.
Hongqisheng Precision Electronics (qinhuangdao) Co.,ltd. US
Patent application number | Description | Published |
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20140061903 | PACKAGE ON PACKAGE STRUCTRUE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a package on package structure includes the steps of: providing a connection substrate comprising a main body and electrically conductive posts, the main body comprising a first surface and an opposite second surface, each electrically conductive post passing through the first and second surfaces, and each end of the two ends of the electrically conductive post protruding from the main body; arranging a first package device on a side of the first surface of the connection substrate, arranging a package adhesive on a side of the second surface of the connection substrate, thereby obtaining a semi-finished package on package structure; and arranging a second package device on a side of the package adhesive furthest from the first package device, thereby obtaining a package on package structure. | 03-06-2014 |
Semiconductor Energy Laboratory Co.,ltd., Atsugi-Shi JP
Patent application number | Description | Published |
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20130130437 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - An object is to provide a semiconductor device having a structure in which parasitic capacitance between wirings can be efficiently reduced. In a bottom gate thin film transistor using an oxide semiconductor layer, an oxide insulating layer used as a channel protection layer is formed above and in contact with part of the oxide semiconductor layer overlapping with a gate electrode layer, and at the same time an oxide insulating layer covering a peripheral portion (including a side surface) of the stacked oxide semiconductor layer is formed. Further, a source electrode layer and a drain electrode layer are formed in a manner such that they do not overlap with the channel protection layer. Thus, a structure in which an insulating layer over the source electrode layer and the drain electrode layer is in contact with the oxide semiconductor layer is provided. | 05-23-2013 |
20130168670 | SEMICONDUCTOR DEVICE AND DISPLAY DEVICE - A semiconductor device including a first gate electrode and a second gate electrode formed apart from each other over an insulating surface, an oxide semiconductor film including a region overlapping with the first gate electrode with a gate insulating film interposed therebetween, a region overlapping with the second gate electrode with the gate insulating film interposed therebetween, and a region overlapping with neither the first gate electrode nor the second gate electrode, and an insulating film covering the gate insulating film, the first gate electrode, the second gate electrode, and the oxide semiconductor film, and being in direct contact with the oxide semiconductor film is provided. | 07-04-2013 |
Tianjin Funayuanchuang Technology Co.,ltd. US
Patent application number | Description | Published |
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20140024280 | METHOD FOR MAKING LIQUID CRYSTAL DISPLAY MODULE - In a method for making a liquid crystal display module, a first polarizing layer and a liquid crystal module are provided. The liquid crystal module includes an upper substrate, an upper electrode layer, a first alignment layer, a liquid crystal layer, a second alignment layer, a thin film transistor panel, and a second polarizing layer stacked in sequences. At least two driving-sensing electrodes are disposed on a surface of the upper substrate. The at least two driving-sensing electrodes are spaced from each other and spaced from the upper electrode layer. A free-standing transparent conductive layer is laid on a surface of the first polarizing layer to form a touch polarizer. The touch polarizer is fixed to the upper substrate to form the liquid crystal display module. The at least two driving-sensing electrodes are electrically connected with the transparent conductive layer. | 01-23-2014 |
20140320756 | TOUCH PANEL - A touch panel includes a first electrode plate and a second electrode plate. The first electrode plate includes a first substrate and a first transparent conductive layer. The second electrode plate includes a second substrate and a second transparent conductive layer opposite to and spaced from the first transparent conductive layer. The first substrate defines a first curved surface, and first transparent conductive layer is located on the first curved surface. The second substrate defines a second curved surface, and the second transparent conductive layer is located on the second curved surface. The second transparent conductive layer is a conductive film having different resistance along different directions. | 10-30-2014 |