| Patent application number | Description | Published |
|---|
| 20080266799 | Methods and Apparatuses for Cold Plate Stability - A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module. | 10-30-2008 |
| 20080308260 | COLD PLATE STABILITY - A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module. | 12-18-2008 |
| 20090034198 | APPARATUS AND METHOD FOR ATTACHING HEATSINKS - An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate. | 02-05-2009 |
| 20110008994 | IMPLEMENTING ENHANCED CONNECTOR GUIDE BLOCK STRUCTURES FOR ROBUST SMT ASSEMBLY - A method and enhanced connector guide block structures implement robust connector assembly including robust Surface Mount Technology (SMT) connector assembly. A connector guide block includes a printed wiring board (PWB) mating face including at least one mounting screw hole provided within a mounting portion for receiving a mounting screw. The connector guide block is assembled with a printed wiring board (PWB) by inserting a respective non-bonding screw through an aligned opening in the PWB into guide block mounting hole and a gap is defined from an upper surface of the PWB below the guide block mounting portion. The gap is filled with an electrically nonconductive underfill material and cured. Another connector guide block structure includes an upper connector guide block portion and a lower connector guide block portion with a gap between the guide block portions filled with a selected electrically nonconductive underfill material and cured. | 01-13-2011 |
| 20110085313 | Motherboard Assembly for Interconnecting and Distributing Signals and Power - A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB. | 04-14-2011 |
| Patent application number | Description | Published |
|---|
| 20080233771 | CUSTOMIZABLE BACKER FOR ACHIEVING CONSISTENT LOADING AND ENGAGEMENT OF ARRAY PACKAGE CONNECTIONS - An electrical contact assembly includes a first module ( | 09-25-2008 |
| 20080259572 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-23-2008 |
| 20080264603 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-30-2008 |
| 20080282539 | Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member - A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB). | 11-20-2008 |
| 20100078397 | DUAL SWIVEL IN-LINE LOAD NODE LOCK MECHANISM - An in-line node locking mechanism for supporting and locking a node within a rack system such forces applied on a node by the node locking mechanism generate consistent output forces. The in-line node locking mechanism utilizes dual swivel nuts and an in-line loading arrangement that evenly distributes forces along the length of a rail system to create evenly distributed forces and avoid the creation of stress points. An actuating screw causes the node locking mechanism to adjust between unlocked and locked positions. In the unlocked position, the mechanism causes the node to be lowered and move freely along the in-line rail system. In the locked position the mechanism causes the node to securely abut the rack system thereby locking the node within the rack system. | 04-01-2010 |
