| Patent application number | Description | Published |
|---|
| 20080236904 | METHOD AND SYSTEM FOR COLLABORATIVE CAPTURE AND REPLAY OF DIGITAL MEDIA FILES USING MULTIMODAL DOCUMENTS - A system and method for enabling capture and replay of digital media files using multimodal documents including a context manager for managing multimodal documents with a virtual media content management system coupled to the context manager. The virtual media content management system contains digital content which is adapted to be managed by the virtual media content management system. An input system is coupled to the context manager and includes a stylus operable to select digital content to be processed. The context manager is operable to issue multimodal document management instructions to the virtual media content management system to process digital content selected by the stylus based on input information from the input system. | 10-02-2008 |
| 20080244385 | SYSTEMS AND METHODS FOR MANAGING MULTIMODAL DOCUMENTS - A multimodal document management system and method includes a context manager for managing multimodal documents. A virtual media content management system is coupled to the context manager and a physical media content management system is coupled to the context manager. The context manager is operable to issue multimodal document management instructions to the virtual media content management system and issuing instructions to the physical media content management system. The context manager instructions may relate to shredding of multimodal documents by deleting virtual media and destroying physical media. The method for managing multimodal documents may include receiving a request for the shredding of an information and content data file containing a list of virtual media and physical media relating to a multimodal document. A determination is made if the request for shred is authorized and, where said request for shred is authorized, a record of the shred request is created. Elements in the element list are grouped based on elements in the list which are managed by the same content management system. A message is sent to each content management system requesting the shredding of each element for the grouping of elements for the content management system. The content management systems may verify and report the success of the shredding. | 10-02-2008 |
| 20090172777 | SYSTEM AND METHOD FOR TRACKING DOCUMENTS - Systems and methods for tracking documents are described. In certain examples, systems and methods for authenticating and tracking physical documents through a multiple party work flow across a geographically dispersed area using digital pens and RFID tags are described. | 07-02-2009 |
| 20100153309 | SYSTEM AND METHOD FOR DIMENSIONAL RATING OF MAIL PIECES - Systems and methods for dimensionally rating mail pieces including cards, letters, flats, mailers, packages and parcels using a pointing device such as a digital pen are described. In one illustrative configuration the system includes a digital pen, a three dimensional digital pen pattern device, a computer and a printer for printing evidence of postage payment. A mail piece such as a small parcel is placed on the opened three dimensional digital pen pattern device. The user may select a digital pen pattern command box or may otherwise engage or be prompted to begin measurements. For a rectangular parcel, the user selects a bottom right and then a top left measurement point. The system then calculates the dimensions of the parcel, dimensionally rates it and then accounts for and prints a corresponding postage indicium. | 06-17-2010 |
| 20100275254 | SYSTEM AND METHOD FOR SELECTING AN EXTERNAL USER INTERFACE USING SPATIAL INFORMATION - A method and system for selecting an external user interface using spatial information is described. In one configuration the floor space of a mailroom is mapped using a two dimensional grid. At least one machine is located on the mapped grid and an associated control zone is defined for that particular machine. The machine includes a wireless transceiver for providing user interface access. An external portable processor with a wireless transceiver is provided with user interface logic for the machine. A user then moves the external portable processor into the control zone of the machine. An indoor positioning system is utilized to provide relative or absolute position information relating to the machine and the external processor. The system determines that the external processor is in the machine control zone and allows the external processor to function as a user interface for the machine. | 10-28-2010 |
| 20110144808 | METHODS AND SYSTEMS FOR CONFIGURING MAILING EQUIPMENT - A computer receives two input documents, including a carrier product description file and a document that describes attributes of a type of mailing equipment. The computer extracts information from the documents and generates a provisioning document based at least in part on the extracted information. The provisioning document is suitable for controlling a piece of mailing equipment which belongs to the particular type of mailing equipment, in such a manner that the piece of mailing equipment generates mail pieces in compliance with the carrier product description file. The provisioning document includes a script for controlling operation of the piece of mailing equipment and data to be read by the piece of mailing equipment. | 06-16-2011 |
| Patent application number | Description | Published |
|---|
| 20090134514 | METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER - A method for fabricating electrical bonding pads on one face of a wafer includes the production of electrically conductive areas and electrical connection branches connecting these conductive areas. A layer of mask material is deposited and openings are produced in this mask layer which extend above said conductive areas and at least some of which extend at least partly beyond the peripheral edges of the underlying conductive areas. Blocks made of a solder material are produces in the openings by electrodeposition in a bath. The mask material is then removed along with the connection branches. The wafer is passed through or placed in an oven so as to shape, on the conductive areas, the blocks into substantially domed electrical bonding pads. | 05-28-2009 |
| 20100244249 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a wire-bond of a first metallic composition, the wire-bond and the bond-pad being coated with a protection layer of a second metallic composition. | 09-30-2010 |
| 20110018135 | METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE - A wire is electrically connected to an electrical bonding pad of an integrated circuit chip and electronic device through an intermediate electrical interconnect block that is interposed between the electrical bonding pad and one end of the electrical lead wire. | 01-27-2011 |
| 20110074536 | ELECTRONIC CIRCUIT WITH AN INDUCTOR - An electronic device which includes an electronic component having a substrate and a plurality of metal interconnection layers, the plurality of metal interconnection layers having a top surface. It further comprises a dielectric layer situated above said metal interconnection layers, a conductive layer situated above said dielectric layer, an inductor coil and a ground shield, the inductor coil being formed in the conductive layer and the ground shield being formed in a layer of said plurality of metal interconnection layers. | 03-31-2011 |
| 20110092000 | METHOD FOR MANUFACTURING AND TESTING AN INTEGRATED ELECTRONIC CIRCUIT - A method for manufacturing and for testing an integrated circuit, including the steps of forming, on the upper portion of the integrated circuit, a passivation layer including openings at the level of metal tracks of the last interconnect stack of the integrated circuit; forming, in the openings, first pads connected to second pads formed on the passivation layer by conductive track sections, the first pads being intended for the connection of the integrated circuit; testing the integrated circuit by bringing test tips in contact with the second pads; and eliminating at least a portion of at least one of the conductive track sections. | 04-21-2011 |
| 20110151657 | METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER - A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder material on these first blocks, and passing the blocks through an oven so as to shape the blocks into approximately domed electrical bonding pads. | 06-23-2011 |
