| Patent application number | Description | Published |
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| 20080204665 | Color combiner for solid-state light sources - An illumination apparatus has first and second optical condenser systems sharing a common aperture. The first optical condenser system has a first solid-state light source having a first spectral band and a first curved surface spaced apart from the first solid-state light source and treated to reflect the first spectral band along a first optical path to exit at the common aperture and to pass light outside the first spectral band. The second optical condenser system has a second solid-state light source having a second spectral band and a second curved surface disposed behind the first curved surface with respect to the first and second light sources and treated to reflect the second spectral band along a second optical path to exit at the common aperture. | 08-28-2008 |
| 20090052480 | Laser pulse conditioning - A light pulse conditioning apparatus has at least first and second curved reflective surfaces that share a common focus and a light-redirecting element disposed between the first and second curved reflective surfaces to redirect at least a portion of an incident light beam toward the second curved reflective surface as a delayed beam portion. A beam-shifting compensating element is disposed between the first curved reflective surface and the light-redirecting element and in the path of the delayed beam portion, for shifting the optical path of the delayed beam portion as it returns toward the light-redirecting element. | 02-26-2009 |
| 20090296064 | ILLUMINATION SYSTEM FOR SIZING FOCUSED SPOTS OF A PATTERNING SYSTEM FOR MASKLESS LITHOGRAPHY - An optical system for producing a pattern of focused spots, such as a maskless lithographic projection system, includes an illuminator, a pattern generator, and an imager. The illuminator includes a light source for generating a light beam, a homogenizer for evenly dispersing light within the light beam, and a condenser for coupling the light source to the homogenizer. The pattern generator has individually addressable elements illuminated by the light beam from the illuminator. The imager images the addressable elements of the pattern generator onto corresponding focusing elements for forming focused spots that are conjugate to aperture stops in both the imager and the illuminator. The illuminator underfills the imager aperture stop for reducing the size of the focused spots. The condenser underfills the illuminator aperture stop for further controlling the size and shape of the focused spots. | 12-03-2009 |
| 20100188723 | OPTICAL MODULATOR WITH BEAM-POINTING CORRECTION - An apparatus for providing a modulated pulsed radiation beam ( | 07-29-2010 |
| 20110181840 | MULTI-PROJECTOR SYSTEM USING MULTIPLEXED ILLUMINATION - An apparatus for forming a color image has at least a first, a second, and a third illumination source, each illumination source energizable to provide continuous illumination of a first, a second, or a third wavelength band, respectively, to an optical multiplexer. The optical multiplexer is actuable to cyclically switch received light from each one of the illumination sources, in turn, to each one of at least a first, a second, and a third projector channel in a repeated sequence. The first projector channel connects to a first projector apparatus, the second projector channel connects to a second projector apparatus, and the third projector channel connects to a third projector apparatus. Each projector apparatus has a light modulator that is energizable to form an image from the light of the first, second, or third wavelength band that is cyclically switched onto its projector channel from the optical multiplexer. | 07-28-2011 |
| Patent application number | Description | Published |
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| 20080274611 | METHOD AND PROCESS FOR FORMING A SELF-ALIGNED SILICIDE CONTACT - The present invention provides a method for forming a self-aligned Ni alloy silicide contact. The method of the present invention begins by first depositing a conductive Ni alloy with Pt and optionally at least one of the following metals Pd, Rh, Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W or Re over an entire semiconductor structure which includes at least one gate stack region. An oxygen diffusion barrier comprising, for example, Ti, TiN or W is deposited over the structure to prevent oxidation of the metals. An annealing step is then employed to cause formation of a NiSi, PtSi contact in regions in which the metals are in contact with silicon. The metal that is in direct contact with insulating material such as SiO | 11-06-2008 |
| 20090004831 | METHOD OF CREATING DEFECT FREE HIGH Ge CONTENT (> 25%) SiGe-ON-INSULATOR (SGOI) SUBSTRATES USING WAFER BONDING TECHNIQUES - A method for achieving a substantially defect free SGOI substrate which includes a SiGe layer that has a high Ge content of greater than about 25 atomic % using a low temperature wafer bonding technique is described. The wafer bonding process described in the present application includes an initial prebonding annealing step that is capable of forming a bonding interface comprising elements of Si, Ge and O, i.e., interfacial SiGeO layer, between a SiGe layer and a low temperature oxide layer. The present invention also provides the SGOI substrate and structure that contains the same. | 01-01-2009 |
| 20090305616 | GLASS MOLD POLISHING METHOD AND STRUCTURE - A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation. | 12-10-2009 |
