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Co, CA
Christopher S. Co, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110007094 | ARCHITECTURES AND METHODS FOR CREATING AND REPRESENTING TIME-DEPENDENT IMAGERY - The present invention pertains to geographical image processing of time-dependent imagery. Various assets acquired at different times are stored and processing according to acquisition date in order to generate one or more image tiles for a geographical region of interest. The different image tiles are sorted based on asset acquisition date. Multiple image tiles for the same region of interest may be available. In response to a user request for imagery as of a certain date, one or more image tiles associated with assets from prior to that date are used to generate a time-based geographical image for the user. | 01-13-2011 |
Eric Co, Northridge, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110014351 | SYSTEM AND METHOD FOR PROVIDING A PERSONALIZED DAILY NUTRITIONAL SUPPLEMENT PACKAGE - A computer-implemented method, apparatus, system, and packaging for providing a daily nutritional supplement component regimen, comprising a series of daily packets each containing dosage forms selected by a series of answers to questions provided by a consumer. | 01-20-2011 |
Erick Co, San Diego, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090305998 | HSP90 INHIBITORS - The invention relates to HSP90 inhibiting compounds consisting of the formula: | 12-10-2009 |
Erick W. Co, Redwood City, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100105953 | Human Adam-10 Inhibitors - The present invention provides compounds useful for inhibiting the ADAM-10 protein, with selectivity versus MMP-1. Such compounds are useful in the in vitro study of the role of ADAM-10 (and its inhibition) in biological processes. The present invention also comprises pharmaceutical compositions comprising one or more ADAM-10 inhibitors according to the invention in combination with a pharmaceutically acceptable carrier. Such compositions are useful for the treatment of cancer, arthritis, and diseases related to angiogenesis. Correspondingly, the invention also comprises methods of treating forms of cancer, arthritis, and diseases related to angiogenesis in which ADAM-10 plays a critical role. | 04-29-2010 |
Erick Wang Co, Redwood, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090143386 | Human adam-10 inhibitors - The present invention provides compounds useful for inhibiting the ADAM-10 protein. Such compounds are useful in the in vitro study of the role of ADAM-10 (and its inhibition) in biological processes. The present invention also comprises pharmaceutical compositions comprising one or more ADAM-10 inhibitors according to the invention in combination with a pharmaceutically acceptable carrier. Such compositions are useful for the treatment of cancer, arthritis, and diseases related to angiogenesis. Correspondingly, the invention also comprises methods of treating forms of cancer, arthritis, and diseases related to angiogenesis in which ADAM-10 plays a critical role. The invention also provides methods for making bis-aryl ether sulfonyl chlorides and ADAM-10 modulators therefrom. | 06-04-2009 |
Erick Wang Co, San Diego, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110021525 | P70S6 Kinase Modulators and Method of Use - The invention provides compounds and methods for inhibition of kinases, more specifically p70S6 kinases. The invention provides compounds for modulating protein kinase enzymatic activity for modulating cellular activities such as proliferation, differentiation, programmed cell death, migration, chemoinvasion and metabolism. Compounds of the invention inhibit, regulate and/or modulate kinase receptor signal transduction pathways related to the changes in cellular activities as mentioned above, and the invention includes compositions which contain these compounds, and methods of using them to treat kinase-dependent diseases and conditions. | 01-27-2011 |
Eric Wang Co, San Diego, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110053873 | HSP90 INHIBITORS - The invention relates to HSP90 inhibiting compounds consisting of the formula: (I) wherein the variables are as defined herein. The invention also relates to pharmaceutical compositions, kits and articles of manufacture comprising such compounds; methods and intermediates useful for making the compounds; and methods of using said compounds. | 03-03-2011 |
Fred H. Co, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090088793 | APPARATUS AND METHODS FOR SEALING A VASCULAR PUNCTURE - Apparatus and methods for sealing a puncture through tissue includes an introducer sheath sized for introduction into a puncture, cartridge sized for insertion into the introducer carrying a sealant, and a locking element for coupling the introducer sheath to the cartridge. When the cartridge is advanced into the introducer sheath, the locking element couples the introducer sheath to the cartridge such that subsequent retraction of the cartridge causes the introducer sheath to retract, thereby deploying the sealant from the cartridge within the puncture beyond the introducer sheath. | 04-02-2009 |
| 20100305602 | BALLOON DISSECTING INSTRUMENTS - Balloon loaded dissection devices and methods for using such devices are disclosed. One such device includes an elongate shaft having sufficient rigidity to push through body tissue free of naturally occurring openings in the body tissue alongside an elongate structure, a handle operably mounted on an end of the elongate shaft, an elongate balloon capable of assuming deflated and inflated states on the elongate shaft, and a fluid passageway in communication with the inflatable interior space in the elongate balloon for communicating an inflation fluid to the elongate balloon. The handle includes a receptacle configured to releasably receive an instrument. The receptacle defines an elongated slot laterally spaced from the elongated shaft. The elongate balloon includes an axial length substantially greater than a transverse diameter of the elongate balloon when the elongate balloon is in the inflated state. The balloon defines an inflatable interior space into which a fluid is introduced to inflate the balloon. | 12-02-2010 |
Katrina Andrea U. Co, St. Martinez, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100247632 | STABILIZED SOLUBILITY-ENHANCED FORMULATIONS FOR ORAL DELIVERY - Methods and compositions are described whereby poorly water-soluble beneficial agents such as vitamins and co-factors are formulated into self-emulsifying formulas (SEF) and optionally sorbing the SEF into pores of porous solid particulates, or preparing supersaturated solutions (SSS) and sorbing the SSS into pores of porous solid particulates. These formulations are useful as dosage forms with oral availability. | 09-30-2010 |
Neelsen Co, Pleasanton, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110017263 | METHOD AND DEVICE FOR FABRICATING A SOLAR CELL USING AN INTERFACE PATTERN FOR A PACKAGED DESIGN - A method and device of fabricating a photovoltaic strip. The method includes providing a photovoltaic cell having a front surface and a back surface and forming a first grid pattern on the front surface and second grid pattern on the back surface. The first grid pattern includes a first plurality of strip columns in parallel in a first direction and a plurality of grid lines in parallel in a second direction perpendicularly crossing the first plurality of strip columns. The second grid pattern includes a plurality of blocks separated by a plurality of streets parallel in the second direction and a second plurality of strip columns parallel in the first direction. The method further includes dicing the photovoltaic cell along the plurality of streets into a plurality of photovoltaic strips. Each of the plurality of photovoltaic strips includes at least one of the plurality of grid lines. | 01-27-2011 |
Reynaldo Co, Scotts Valley, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080315434 | WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS - An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board). | 12-25-2008 |
| 20090315174 | Semiconductor Die Separation Method - According to the invention, die shift is reduced or substantially eliminated, by cutting the wafer in two stages. In some embodiments a first wafer cutting procedure is carried out prior to thinning the wafer to the prescribed die thickness; and in other embodiments the wafer is thinned to the prescribed die thickness prior to carrying out a first wafer cutting procedure. The first wafer cutting procedure includes cutting along a first set of streets to a depth greater than the prescribed die thickness and optionally along a second set of streets to a depth less than the die thickness. The result of the first cutting procedure is an array of strips or blocks of die, each including a plurality of connected die, that are less subject to shift than are individual singulated die. In a second wafer cutting procedure the die are singulated by cutting through along the second set of streets. Subsequent to the first cutting procedure, and prior to the second cutting procedure, additional die preparation procedures that are sensitive to die shift may be carried out. | 12-24-2009 |
| 20100327461 | Electrical interconnect for die stacked in zig-zag configuration - A die (or of a stack of die) is mounted over and elevated above a support, and is electrically connected to circuitry in the support. Pillars of electrically conductive material are formed on a set of bond pads at a mount side of the support, and the elevated die (or at least one die in the elevated stack of die) is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the support. Also, tiered offset stacked die assemblies in a zig-zag configuration, in which the interconnect edges of a first (lower) tier face in a first direction, and the interconnect edges of a second (upper) tier, stacked over the first tier, face in a second direction, different from the first direction, are electrically connected to a support. Die in the first tier are electrically interconnected die-to-die, and the tier is electrically connected to a support, by traces of an electrically conductive material contacting interconnect pads on the die and a first set of bond pads on the support. Pillars of a electrically conductive material are formed on a second set of bond pads, and die in the second tier are electrically interconnected die-to-die, and the tier is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the substrate. | 12-30-2010 |
| 20110101505 | Semiconductor Die Separation Method - According to the invention, die shift is reduced or substantially eliminated, by cutting the wafer in two stages. In some embodiments a first wafer cutting procedure is carried out prior to thinning the wafer to the prescribed die thickness; and in other embodiments the wafer is thinned to the prescribed die thickness prior to carrying out a first wafer cutting procedure. The first wafer cutting procedure includes cutting along a first set of streets to a depth greater than the prescribed die thickness and optionally along a second set of streets to a depth less than the die thickness. The result of the first cutting procedure is an array of strips or blocks of die, each including a plurality of connected die, that are less subject to shift than are individual singulated die. In a second wafer cutting procedure the die are singulated by cutting through along the second set of streets. Subsequent to the first cutting procedure, and prior to the second cutting procedure, additional die preparation procedures that are sensitive to die shift may be carried out. | 05-05-2011 |
| 20110147943 | WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS - An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board). | 06-23-2011 |