| Patent application number | Description | Published |
|---|
| 20080258848 | Spring loaded microwave interconnector - A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed. | 10-23-2008 |
| 20090044399 | Methods for producing large flat panel and conformal active array antennas - Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects. | 02-19-2009 |
| 20090231226 | Dual band active array antenna - An exemplary embodiment of a dual band antenna array includes a folded thin circuit board structure with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer, the circuit board structure folded in a plurality of folds to form a pleated structure. A first array of radiator structures on the first surface is configured for operation in a first frequency band in a first polarization sense. A second array of radiator structures is configured for operation in a second frequency band in a second polarization sense. A conductor trace pattern is formed on the folded circuit board to carry control signals, DC power and RF signals. Active RF circuit devices are attached to the folded circuit board in signal communication with the conductor trace pattern. | 09-17-2009 |
| 20100003785 | STACKED INTEGRATED CIRCUIT ASSEMBLY - In one or more embodiments, a method of producing a stacked integrated circuit assembly includes providing a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC may be disposed between the substrate and the SFIC. The method includes making at least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC. | 01-07-2010 |
| 20100031495 | METHODS FOR PRODUCING LARGE FLAT PANEL AND CONFORMAL ACTIVE ARRAY ANTENNAS - Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects. | 02-11-2010 |
| 20100073233 | Transmit/receive module communication and control architechture for active array - A distributed control system for an active array antenna system is disclosed. In an exemplary embodiment, the array system employs many transmit/receive (T/R) modules each with an associated radiator element, a phase shifter element and a set of RF switch elements to set the module to transmit or receive modes. The array system is arranged to generate a transmit or receive array beam. The distributed control system in an exemplary embodiment includes an array processor for controlling the array, the processor configured to generate command signals to set the T/R module elements to transmit or receive mode and to steer the array beam to a desired direction. The command signals to steer the array beam include phase slopes common to all T/R modules in a given array or subarray. Each T/R module includes a beam steering control function configured to convert the phase slope data to phase data to set the phase shifter element for that T/R module to a phase shift setting for the beam direction associated with the phase slope index data. | 03-25-2010 |
| 20100097277 | Airship mounted array - A space-fed conformal array for a high altitude airship includes a primary array lens assembly adapted for conformal mounting to a non-planar airship surface. The lens assembly includes a first set of radiator elements and a second set of radiator elements, the first set and the second set spaced apart by a spacing distance. The first set of radiators faces outwardly from the airship surface to provide a radiating aperture. The second set of radiators faces inwardly toward an inner space of the airship, for illumination by a feed array spaced from the second set of radiators. | 04-22-2010 |
| 20100214170 | ASYMMETRICALLY THINNED ACTIVE ARRAY TR MODULE AND ANTENNA ARCHITECTURE - An asymmetrically thinned transmit/receive (TR) module and antenna architecture is provided. In one embodiment, the invention relates to an active antenna assembly including at least one multi-channel transmit/receive (TR) module for reducing power consumption, the antenna assembly including the at least one TR module including a first phase shifter, a first switch coupled to the first phase shifter, the first switch configured to switch between a transmit circuit and a receive circuit, the transmit circuit including a plurality of first power amplifiers coupled to the first switch, the receive circuit including a low noise amplifier coupled to the first switch and to a plurality of second switches, where each of the plurality of second switches is configured to switch between one of the plurality of first power amplifiers and the low noise amplifier. | 08-26-2010 |
| 20100214171 | LOW COST MULTI-CHANNEL THINNED TR MODULE ARCHITECTURE - A low cost multi-channel thinned transmit/receive (TR) module architecture is provided. In one embodiment, the invention relates to an active antenna assembly including at least one multi-channel TR module for reducing power consumption, the antenna assembly including the at least one TR module including a first phase shifter, a first switch coupled to the first phase shifter, the first switch configured to switch between a transmit circuit and a receive circuit, the transmit circuit including a first power amplifier coupled to the first switch and to a plurality of second phase shifters, and a plurality of second power amplifiers, each second power amplifier coupled to one of the second phase shifters, the receive circuit including a low noise amplifier coupled to the first switch and to a plurality of third phase shifters, and a plurality of second switches, each second switch configured to switch between one of the second power amplifiers and one of the third phase shifters. | 08-26-2010 |
| 20100231325 | SWITCHABLE 0.degree./180.degree. PHASE SHIFTER ON FLEXIBLE COPLANAR STRIP TRANSMISSION LINE - A switchable 0°/180° phase shifter on a balanced transmission line is provided. In one embodiment, the invention relates to an apparatus for providing 0°/180° phase shifting for a transmit/receive antenna pair including a transmit element and a receive element coupled by a balanced transmission line having two sections, the apparatus including a first section of the balanced transmission line, the first section including a first conductor and a second conductor, a second section of the balanced transmission line, the second section including a third conductor and a fourth conductor, and a switch disposed between the first section and the second section, wherein in a first configuration, the switch couples the first conductor to the third conductor and the second conductor to the fourth conductor, and in a second configuration, the switch couples the first conductor to the fourth conductor and the second conductor to the third conductor. | 09-16-2010 |
| 20100231479 | LIGHT WEIGHT STOWABLE PHASED ARRAY LENS ANTENNA ASSEMBLY - A light weight stowable antenna lens array assembly is provided. In one embodiment, the invention relates to a stowable lens antenna array including at least one antenna pair including a transmit antenna on a first layered composite, a receive antenna on a second layered composite, a ground plane on a third layered composite, the ground plane being between and spaced apart from the transmit antenna and the receive antenna, and a balanced transmission line coupling the transmit antenna to the receive antenna, and an articulating structure attached to at least one of the first layered composite, the second layered composite and the third layered composite, the articulating structure having a collapsed configuration and an expanded configuration, wherein at least one of the first layered composite, the second layered composite and the third layered composite includes a polymeric film. | 09-16-2010 |
| 20110024160 | MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD - A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line. | 02-03-2011 |
| 20110109519 | SWITCHABLE MICROWAVE FLUIDIC POLARIZER - A switchable microwave fluidic polarizer is provided. In one embodiment, the invention relates to a switchable polarizer for polarizing radio frequency (RF) signals associated with an antenna, the switchable polarizer including a plurality of radiating elements, an RF feed coupled to the plurality of radiating elements, an antenna input coupled to the RF feed, and an antenna cover disposed in proximity to the plurality of radiating elements, the antenna cover including a dielectric substrate including a plurality of channels for enclosing a liquid metal. | 05-12-2011 |
| 20110114242 | SYSTEMS AND METHODS FOR ASSEMBLING LIGHTWEIGHT RF ANTENNA STRUCTURES - Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates. | 05-19-2011 |
| 20110115578 | RF TRANSITION WITH 3-DIMENSIONAL MOLDED RF STRUCTURE - A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line. | 05-19-2011 |
| 20110115686 | RECONFIGURABLE FLUIDIC SHUTTER FOR SELECTIVELY SHIELDING AN ANTENNA ARRAY - A reconfigurable fluidic shutter for selectively shielding an antenna array includes a first surface and second surface spaced apart and defining a cavity; and a pump configured to pump liquid that attenuates electromagnetic radiation, such as a liquefied metal or alloy composition, into and out of the cavity. The first and second surface are transparent to electromagnetic radiation, for instance, microwave or other RF radiation. | 05-19-2011 |
| 20110122033 | COOLING SYSTEM FOR PANEL ARRAY ANTENNA - The present invention relates to panel array antennas, and more particularly to a cooling system for an antenna such as a jet stream conformal panel array antenna. In one embodiment, a panel array antenna for an aircraft includes a closed-loop fluid flow path that passes through the panel array assembly and dissipates heat to the jet stream outside the aircraft. A fluid such as pressurized air passes through this closed-loop path, flowing through strategically-placed openings in the layers of the panel array assembly and flowing over and around the hot electrical components in the panel assembly. The air is heated by these electrical components, and the heated air then flows through the flow path under the top sheet, dissipating the heat to the jet stream outside. In one embodiment, a panel array antenna includes a panel assembly having a top layer through which the antenna radiates or receives a signal, and a fluid flow path through the panel assembly. A first portion of the fluid flow path is disposed below the top layer such that a fluid passing through the first portion of the fluid flow path is in heat transfer proximity to the top layer. | 05-26-2011 |
