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Clayton R.
Clayton R. Anderson, El Cerrito, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090145802 | STORAGE SYSTEM FOR COMPONENTS INCORPORATING A LIQUID-METAL THERMAL INTERFACE - Embodiments of an apparatus that functions as a storage system for components are described. This apparatus includes a containment vessel enclosing a desiccant and a device. This device includes a layer mechanically coupled to a component, where the component can be one of a semiconductor die and a heat-removal device. Moreover, a thermal-interface material is coupled to a region of the layer, and a boundary material is mechanically coupled to the layer, where a perimeter defined by the boundary-material surrounds the region. | 06-11-2009 |
| 20090146294 | GASKET SYSTEM FOR LIQUID-METAL THERMAL INTERFACE - Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer. | 06-11-2009 |
| 20090149021 | SPRAY DISPENSING METHOD FOR APPLYING LIQUID METAL - Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die. | 06-11-2009 |
Clayton R. Decamillis, Raleigh, NC US
| Patent application number | Description | Published |
|---|---|---|
| 20090283516 | Stable high-Q magnetron power supply - A microwave power supply includes a magnetron, a waveguide configured to carry microwave power from the magnetron to a selected load, and an adjustable impedance element connected to the waveguide at a location upstream from the magnetron. The power supply may further include provision for varying the filament voltage to the magnetron tube. In the associated method, the adjustable upstream impedance and the adjustable filament voltage may be combined (and may be adjusted iteratively) to achieve high Q output. The load may be an applicator cavity for processing selected materials. The invention is particularly suitable for high Q cavities, such as single mode cavities, where it is desirable to match the output of the microwave source to the characteristics of the cavity for efficient operation. The adjustable upstream impedance element represents an electrical characteristic that may be achieved through various physically adjustable devices such as a movable backwall, a sliding short, a stub tuner, or an adjustable iris. | 11-19-2009 |
| 20110226759 | Apparatus and method for heating semiconductor wafers via microwaves - An apparatus for heating a semiconductor wafer includes: a microwave source; an applicator cavity; and, a fixture for supporting a wafer in the cavity. The fixture comprises a dielectric mechanical support for the wafer and a grounded metallic ring movably positioned parallel to and concentric with the wafer at some distance from the wafer, to adjust the microwave power distribution to compensate for edge effects. A closed-loop feedback system adjusts the distance based on wafer edge and center temperatures. A method for heating a semiconductor wafer comprises: a. placing the wafer in a microwave cavity; b. supporting the wafer on a fixture comprising a dielectric wafer support and a grounded metallic ring movably positioned at some distance from the wafer; c. introducing microwave power into the cavity to heat the wafer; and d. adjusting the distance between wafer and ring to modify the power distribution near the wafer edge. | 09-22-2011 |
Clayton R. Livengood, Jr., Magnolia, OH US
| Patent application number | Description | Published |
|---|---|---|
| 20100199549 | Fuel Composition - A fuel composition includes a lower alkyl monool(s) and C | 08-12-2010 |
Clayton R. Polowy, Scottsdale, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20110282292 | PROTECTIVE MEDICAL DEVICE AND METHOD OF USE THEROF - A guard for protecting an implantable port is provided. The guard includes a cover that is structured to protect a user's implantable port by substantially covering the port without the cover coming into contact with a user's skin above the port. The cover can be a rounded, triangular-shaped cover having peripheral edges that bow outwardly from the center to allow the cover to be placed over circular or triangular-shaped ports. The cover can also be releasably coupled to an adhesive base that is structured to adhere to the user's skin around the port, thus allowing the cover to remain in place on the user's skin. The guard may further include a housing to support the cover, the housing being coupled to the adhesive base prior to the adhesive base being adhered to the user's skin around the port. The cover may then be detachably connected to the housing. | 11-17-2011 |